Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: Electronic devices involving contact structures, and related components, systems and methods associated therewith are described. Contact structures (also referred to as electrical contact structures or electrodes) are features on a device that are electrically connected to a power source. The power source can provide current to the device via the contact structures. The contact structures can be designed to improve current distribution in electronic devices. For example, the contact resistance of the contacts may be modified to improve current distribution (e.g., by controlling the shape and/or structure and/or composition of the contacts). The contact structures may include an intervening layer (e.g., a non-ohmic layer) positioned between a surface of the device and a conductive portion extending from a conductive pad. The intervening layer and/or conductive portions may be designed to have certain shapes (e.g.

Abstract: Optical display systems and methods are disclosed.

Abstract: Light-emitting device methods are disclosed.

Abstract: Light emitting diode systems are disclosed. An optical display system that includes a light emitting diode (LED) and a cooling system is disclosed. The cooling system is configured so that, during use, the cooling system regulates a temperature of the light emitting diode.

Abstract: Electronic device contact structures are disclosed.

Abstract: Light-emitting device methods are disclosed.

Abstract: Light-emitting devices; and related components, systems and methods are disclosed.

Abstract: Light-emitting devices, and related components, systems and methods are disclosed.

Abstract: Optical display systems and methods are disclosed.

Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: Electronic device contact structures are disclosed.

Abstract: Light emitting diode systems are disclosed.

Abstract: In an apparatus and method for resin transfer molding, a mold including at least two cooperating mold sections is placed in a vacuum chamber. A reinforcing material is positioned between the mold sections, which are separated from one another during evacuation of the chamber, thus maintaining the reinforcing material in a substantially uncompressed condition, to ensure that all gasses and/or liquids are evacuated from the reinforcing material and the mold prior to resin injection. After evacuation, the mold sections are brought almost into engagement to substantially define a mold cavity, and resin is injected into the mold cavity. Prior to terminating the resin injection, the mold sections are brought into engagement, and final resin injection is performed. The injected resin is then cured in accordance with the particular type of resin injected.