Abstract: In some embodiments, data may be transferred from a first memory agent to a second memory agent in a first format having a first width, and at least a critical portion of the data maybe transferred from the second memory agent back to the first memory agent in a second format having a second width, where the critical portion is included in a first frame. The critical portion may include a cacheline mapped over a memory device rank. Other embodiments are described and claimed.

Abstract: In some embodiments, a chip includes at least four groups of memory banks and at least four groups of output conductors wherein each group of output conductors corresponds to a different one of the groups of memory banks. The chip also includes circuitry to perform a read operation by providing read data from at least one of the banks of each of the groups of memory banks to its corresponding group of output conductors. Other embodiments are described.

Abstract: The temperature for multiple devices of a memory module are determined. In one example a memory module includes a printed circuit board, a plurality of memory chips on the printed circuit board, each chip containing a plurality of memory cells and a thermal sensor, and a multiplexer on the printed circuit board, independent of the memory chips, coupled to each of the thermal sensors. A current source is coupled to the multiplexer to provide a current to each one of the thermal sensors, and a voltage detector is coupled to the multiplexer to detect a voltage from each of the thermal sensors when a current is applied. A temperature circuit is coupled to the voltage detector to determine a temperature for each memory chip based on the detected voltage.

Abstract: Thermal management and communication is described in the context of memory modules that contain several memory devices. In one example, the invention includes determining a temperature of a first memory device, the first memory device containing a plurality of memory cells, determining a temperature of a second memory device after determining the temperature of the first memory device, the second memory device containing a plurality of memory cells, and generating an alarm based on an evaluation of the first and the second temperatures. In another example, the invention includes detecting a thermal event on a memory device of a memory module that contains a plurality of memory devices, detecting the state of an event bus of the memory module, and sending an alert on the event bus if the event bus is in an unoccupied state.

Abstract: In some embodiments, a chip includes first and second bank sets, a first data port mapped to the first bank set, and a second data port mapped to the second bank set. Other embodiments are described.

Abstract: In some embodiments, a chip includes memory banks and data ports, including at least first and second data ports, coupled to the memory banks. The chip also includes control circuitry to control a configuration of the first data port to be in one of multiple configurations in response to a configuration command, wherein the available configurations for the first data port include at least two of the following: whether the first data port (1) may only be used for read transactions, (2) may only be used for write transactions, or (3) may be used for either read or write transactions while in the configuration. Other embodiments are described.

Abstract: Swizzle information for signal lines on a memory component may be stored on the memory component. The swizzle information may be transmitted to a memory controller which may include logic to receive the swizzle information which is then used to deswizzle data received from the memory component. Data may be transmitted from a memory device to a memory controller in a format that is tolerant of swizzling on signal lines between the device and the controller. The format may include codes having unique of numbers of values. Data may be sent in multi-code bursts that divide a data range into progressively smaller ranges. Other embodiments are described and claimed.

Abstract: Data is transmitted from a memory device along with a training sequence to deswizzle the data. The training sequence may be sent, for example, when the memory device is initialized, or it may be appended to the data. A memory controller may include logic to receive the data and training sequence and deswizzle the data in response to the training sequence to identify the location of data on various signal lines. Other embodiments are described and claimed.

Abstract: Thermal management and communication is described in the context of memory modules that contain several memory devices. In one example, the invention includes determining a temperature of a first memory device, the first memory device containing a plurality of memory cells, determining a temperature of a second memory device after determining the temperature of the first memory device, the second memory device containing a plurality of memory cells, and generating an alarm based on an evaluation of the first and the second temperatures. In another example, the invention includes detecting a thermal event on a memory device of a memory module that contains a plurality of memory devices, detecting the state of an event bus of the memory module, and sending an alert on the event bus if the event bus is in an unoccupied state.

Abstract: A method, apparatus, and system to enable a partial refresh scheme for DRAM which includes specifying at least a refresh start value, or a refresh start value and a refresh end value, to reduce the number of rows that must be refreshed during a refresh cycle, thus reducing the amount of power consumed during refresh.

Abstract: A high speed DRAM cache architecture. One disclosed embodiment includes a multiplexed bus interface to interface with a multiplexed bus. A cache control circuit drives a row address portion of an address on the multiplexed bus interface and a command to open a memory page containing data for a plurality of ways. The cache control circuit subsequently drives a column address including at least a way indicator to the multiplexed bus interface.

Abstract: A high speed DRAM cache architecture. One disclosed embodiment includes a multiplexed bus interface to interface with a multiplexed bus. A cache control circuit drives a row address portion of an address on the multiplexed bus interface and a command to open a memory page containing data for a plurality of ways. The cache control circuit subsequently drives a column address including at least a way indicator to the multiplexed bus interface.

Abstract: Some embodiments of the invention enable debugging functionality for memory devices residing on a memory module that are buffered from the memory bus by a buffer chip. Some embodiments map connector signals from a tester coupled to the high speed interface between the buffer chip and the memory bus to an interface between the buffer chip and the memory devices. During test mode, some embodiments bypass the normal operational circuitry of the buffer chip and provide a direct connection to the memory devices. Other embodiments use the existing architecture of the buffer chip to convert high speed pins into low speed pins and map them to pins that are connected to the memory devices. Other embodiments are described in the claims.

Abstract: Methods and apparatuses for mapping cache contents to memory arrays. In one embodiment, an apparatus includes a processor portion and a cache controller that maps the cache ways to memory banks. In one embodiment, each bank includes data from one cache way. In another embodiment, each bank includes data from each way. In another embodiment, memory array banks contain data corresponding to sequential cache lines.

Abstract: A memory component with built-in self test includes a memory array. An input/output interface is coupled to the memory array and has a loopback. A controller is provided to transmit memory array test data to the memory array to store the memory array test data, and to read the memory array test data from the memory array. A compare register is also provided to compare the memory array test data transmitted to the memory array with the memory array test data read from the memory array.

Abstract: Provision and use of sets of isolators to enable the caching of the contents of at least one row of memory cells within a subarray of a bank of a memory device by a row of sense amplifiers associated with the subarray to enable faster access to read the contents of that at least one row through a read operation causing the data to read from the row of sense amplifiers versus from the row of memory cells, directly.

Abstract: Provision and use of sets of isolators to enable the caching of the contents of at least one row of memory cells within a subarray of a bank of a memory device by a row of sense amplifiers associated with the subarray to enable faster access to write the data directed to at least one row through a write operation causing the data to written to the row of sense amplifiers versus from the row of memory cells, directly, and to store an indication that the data cached by the row of sense amplifiers is dirty.

Abstract: Memory device having banks of memory cells organized into two groups of banks that share control circuitry and a data buffer to provide an interface to a memory bus, but which are independently operable enough to support unrelated transactions with each group, and can be used to stagger read operations with shortened burst transfers so as to minimize dead time on a memory bus.

Abstract: Method and apparatus for use with buffered memory modules are included among the embodiments. In exemplary systems, a serial presence detect function is included within a memory module buffer instead of being provided by a separate EEPROM device mounted on the memory module. Various embodiments thus can provide cost savings, chip placement and signal routing simplification, and can in some circumstances save pins on the module. Other embodiments are described and claimed.

Abstract: Method and apparatus for use with buffered memory modules are included among the embodiments. In exemplary systems, the memory module has a buffer that receives memory commands and data, and then presents those commands and data to physical memory devices through a separate interface. The buffer has the capability to accept an implicit memory command, i.e., a command that does not contain a fully-formed memory device command, but instead instructs the memory module buffer to form one or more fully-formed memory device commands to perform memory operations. Substantial memory channel bandwidth can be saved, for instance, with a command that instructs a memory module to clear a region of memory or copy a region to a second area in memory. Other embodiments are described and claimed.