Patents by Inventor John Higginson

John Higginson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pick and place device with interdigitated electrodes for micro scale device
    Patent number: 10276419
    Abstract: A compliant electrostatic transfer head and array are described. In an embodiment a compliant electrostatic transfer head includes a base substrate, and a plurality of interdigitated spring electrodes that are deflectable together into a cavity toward the base substrate. Each spring electrode includes mesa structure, and the mesa structures of the plurality of interdigitated spring electrodes are aligned.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: April 30, 2019
    Assignee: Apple Inc.
    Inventors: Hyeun-Su Kim, Dariusz Golda, John A. Higginson
  • LIGHT EMITTING STRUCTURE
    Publication number: 20190123032
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: December 13, 2018
    Publication date: April 25, 2019
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE
    Publication number: 20190096846
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 28, 2019
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Light emitting structure
    Patent number: 10192858
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: January 29, 2019
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Mass transfer tool manipulator assembly with remote center of compliance
    Patent number: 10183396
    Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: January 22, 2019
    Assignee: Apple Inc.
    Inventors: Paul Argus Parks, Nile Alexander Light, Stephen P. Bathurst, John A. Higginson, Andreas Bibl
  • Mass transfer tool
    Patent number: 10183401
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 22, 2019
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, David Albertalli
  • Micro device transfer head heater assembly and method of transferring a micro device
    Patent number: 10121864
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: November 6, 2018
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Micro device transfer system with pivot mount
    Patent number: 10043776
    Abstract: A micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: August 7, 2018
    Assignee: APPLE INC.
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • Mass transfer tool manipulator assembly
    Patent number: 10022859
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: July 17, 2018
    Assignee: APPLE INC.
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl, Paul Argus Parks, Stephen Paul Bathurst
  • LIGHT EMITTING STRUCTURE
    Publication number: 20180197844
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: March 5, 2018
    Publication date: July 12, 2018
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • APPARATUS AND METHOD FOR ACTIVE SHAPE CONTROL OF A MICRO PICK UP ARRAY
    Publication number: 20180194014
    Abstract: Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.
    Type: Application
    Filed: December 12, 2017
    Publication date: July 12, 2018
    Inventors: Andreas Bibl, Paul A. Parks, Stephen P. Bathurst, Jon A. Williams, John A. Higginson, Shenshen Zhao
  • ELECTROSTATIC CLEANING DEVICE
    Publication number: 20180076076
    Abstract: An electrostatic cleaning device, mass transfer tool, and method of operation are disclosed. In an embodiment an electrostatic cleaning device includes a cleaning electrode area including a first electrode pattern, a first trace line connected to the first electrode pattern, and a dielectric layer covering the cleaning electrode and the first trace line. In an embodiment, a mass transfer tool includes a translatable transfer head assembly that is translatable over a carrier substrate stage, a receiving substrate stage, and an electrostatic cleaning stage.
    Type: Application
    Filed: March 14, 2016
    Publication date: March 15, 2018
    Inventors: Stephen P. BATHURST, John A. HIGGINSON, Dariusz GOLDA, Hyeun-Su KIM
  • Method and structure for receiving a micro device
    Patent number: 9911722
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: March 6, 2018
    Assignee: APPLE INC.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Compliant micro device transfer head
    Patent number: 9895902
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: February 20, 2018
    Assignee: APPLE INC.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
  • LED array
    Patent number: 9831383
    Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: November 28, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law
  • Compliant electrostatic transfer head with defined cavity
    Patent number: 9828244
    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: November 28, 2017
    Assignee: APPLE INC.
    Inventors: Dariusz Golda, Stephen P. Bathurst, John A. Higginson, Andreas Bibl, Jeffrey Birkmeyer
  • Method of transferring and bonding an array of micro devices
    Patent number: 9773750
    Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: September 26, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu, Hung-Fai Stephen Law
  • Micro device stabilization post
    Patent number: 9741592
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: August 22, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • MICRO DEVICE STABILIZATION POST
    Publication number: 20170170049
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Application
    Filed: February 28, 2017
    Publication date: June 15, 2017
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE
    Publication number: 20170125391
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu