Patents by Inventor John Higginson

John Higginson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of transferring a light emitting diode
    Patent number: 8794501
    Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: August 5, 2014
    Assignee: LuxVue Technology Corporation
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Actuatable device with die and integrated circuit element
    Patent number: 8789924
    Abstract: A fluid ejector includes a fluid ejection module and an integrated circuit element. The fluid ejection module includes a substrate having a plurality of fluid paths, a plurality of actuators, and a plurality of conductive traces, each actuator configured to cause a fluid to be ejected from a nozzle of an associated fluid path. The integrated circuit element is mounted on the fluid ejection module and is electrically connected with the conductive traces of the fluid ejection module such that an electrical connection of the module enables a signal sent to the fluid ejection module to be transmitted to the integrated circuit element, processed on the integrated circuit element, and output to the fluid ejection module to drive the actuator.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: July 29, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Andreas Bibl, Deane A. Gardner, John A. Higginson, Kevin von Essen
  • Micro device transfer head heater assembly and method of transferring a micro device
    Patent number: 8789573
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: July 29, 2014
    Assignee: LuxVue Technology Corporation
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT
    Publication number: 20140169924
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 19, 2014
    Applicant: Luxvue Technology Corporation
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • MICRO PICK UP ARRAY WITH INTEGRATED PIVOT MOUNT
    Publication number: 20140169927
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array structure allows the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array.
    Type: Application
    Filed: December 14, 2012
    Publication date: June 19, 2014
    Applicant: Luxvue Technology Corporation
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • MICRO DEVICE STABILIZATION POST
    Publication number: 20140084240
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Application
    Filed: September 24, 2012
    Publication date: March 27, 2014
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • MICRO DEVICE STABILIZATION POST
    Publication number: 20140084482
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Application
    Filed: December 11, 2012
    Publication date: March 27, 2014
    Applicant: LUXVUE TECHNOLOGY CORPORATION
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • MASS TRANSFER TOOL
    Publication number: 20140071580
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.
    Type: Application
    Filed: September 7, 2012
    Publication date: March 13, 2014
    Inventors: John A. Higginson, Andreas Bibl, David Albertalli
  • LED ARRAY
    Publication number: 20140061687
    Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
    Type: Application
    Filed: November 4, 2013
    Publication date: March 6, 2014
    Applicant: LuxVue Technology Corporation
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law
  • ACTUATABLE DEVICE WITH DIE AND INTEGRATED CIRCUIT ELEMENT
    Publication number: 20140055528
    Abstract: A fluid ejector includes a fluid ejection module and an integrated circuit element. The fluid ejection module includes a substrate having a plurality of fluid paths, a plurality of actuators, and a plurality of conductive traces, each actuator configured to cause a fluid to be ejected from a nozzle of an associated fluid path. The integrated circuit element is mounted on the fluid ejection module and is electrically connected with the conductive traces of the fluid ejection module such that an electrical connection of the module enables a signal sent to the fluid ejection module to be transmitted to the integrated circuit element, processed on the integrated circuit element, and output to the fluid ejection module to drive the actuator.
    Type: Application
    Filed: November 1, 2013
    Publication date: February 27, 2014
    Applicant: FUJIFILM Corporaiton
    Inventors: Andreas Bibl, Deane A. Gardner, John A. Higginson, Kevin von Essen
  • Micro device transfer head
    Patent number: 8646505
    Abstract: A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: February 11, 2014
    Assignee: LuxVue Technology Corporation
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE
    Publication number: 20140027709
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: July 30, 2012
    Publication date: January 30, 2014
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Forming A Funnel-Shaped Nozzle
    Publication number: 20140022304
    Abstract: Techniques are provided for making a funnel-shaped nozzle in a semiconductor substrate. The funnel-shaped recess includes a straight-walled bottom portion and a curved top portion having a curved sidewall gradually converging toward and smoothly joined to the straight-walled bottom portion, and the curved top portion encloses a volume that is substantially greater than a volume enclosed by the straight-walled bottom portion.
    Type: Application
    Filed: September 23, 2013
    Publication date: January 23, 2014
    Inventors: Gregory De Brabander, Mark Nepomnishy, John A. Higginson
  • COMPLIANT MICRO DEVICE TRANSFER HEAD
    Publication number: 20130300812
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Application
    Filed: May 8, 2012
    Publication date: November 14, 2013
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
  • Actuatable device with die and integrated circuit element
    Patent number: 8579412
    Abstract: A fluid ejector includes a fluid ejection module and an integrated circuit element. The fluid ejection module includes a substrate having a plurality of fluid paths, a plurality of actuators, and a plurality of conductive traces, each actuator configured to cause a fluid to be ejected from a nozzle of an associated fluid path. The integrated circuit element is mounted on the fluid ejection module and is electrically connected with the conductive traces of the fluid ejection module such that an electrical connection of the module enables a signal sent to the fluid ejection module to be transmitted to the integrated circuit element, processed on the integrated circuit element, and output to the fluid ejection module to drive the actuator.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: November 12, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Andreas Bibl, Deane A. Gardner, John A. Higginson, Kevin Von Essen
  • Systems And Methods For Delivering And Recirculating Fluids
    Publication number: 20130293642
    Abstract: Among other things, a device for use in printing is described. The device comprises a first chamber for receiving a liquid and a first filter member in the first chamber. The first filter member separates the first chamber into a first part and a second part laterally adjacent to the first part. The first filter member comprises pores having an average size. The pores are configured to filter the liquid passing from the first part to the second part. The first filter member further comprises an opening adjacent to a top of the first chamber for air to pass from the first part to the second part. The opening has a size at least 10 times larger than the average size of the pores. There is a first inlet in fluid communication with the first part and a first outlet in fluid communication with the second part.
    Type: Application
    Filed: May 3, 2012
    Publication date: November 7, 2013
    Inventors: Kevin Von Essen, John A. Higginson, Paul A. Hoisington, Don S. Minami
  • Fluid Ejection Module Mounting
    Publication number: 20130292529
    Abstract: A bracket includes a support strut configured to carry the fluid ejection module and an alignment strut coupled to the support strut. The alignment strut is configured to affix to the frame so as to orient the support strut with respect to the frame in each of three orthogonal linear directions and three orthogonal angular directions. The alignment strut includes three alignment mechanisms. Each of the first and second alignment features is held mechanically fixed on the alignment strut in a respective aligned position, and the third alignment mechanism is movable on the alignment strut.
    Type: Application
    Filed: March 11, 2013
    Publication date: November 7, 2013
    Applicant: FUJIFILM CORPORATION
    Inventors: Norihisa Takada, Steve Deming, Kevin von Essen, Michael Rocchio, John A. Higginson
  • Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer
    Patent number: 8573469
    Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: November 5, 2013
    Assignee: LuxVue Technology Corporation
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law
  • Forming A Funnel-Shaped Nozzle
    Publication number: 20130286097
    Abstract: Techniques are provided for making a funnel-shaped nozzle in a semiconductor substrate. The funnel-shaped recess includes a straight-walled bottom portion and a curved top portion having a curved sidewall gradually converging toward and smoothly joined to the straight-walled bottom portion, and the curved top portion encloses a volume that is substantially greater than a volume enclosed by the straight-walled bottom portion.
    Type: Application
    Filed: April 30, 2012
    Publication date: October 31, 2013
    Inventors: Gregory De Brabander, Mark Nepomnishy, John A. Higginson
  • Micro device array for transfer to a receiving substrate
    Patent number: 8558243
    Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: October 15, 2013
    Assignee: LuxVue Technology Corporation
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu