Abstract: A method for plasma-enhanced cleaning of a system component in a batch-type processing system and a method for monitoring and controlling the cleaning. The cleaning is performed by introducing a cleaning gas in a process chamber of the batch-type processing system, forming a plasma by applying power to a system component within the process chamber, exposing a material deposit in the process chamber to the plasma to form a volatile reaction product, and exhausting the reaction product from the processing system. Monitoring of the processing system can be carried out to determine cleaning status of the processing system, and based upon the status from the monitoring, the processing system is controlled for either continuing the exposing and monitoring or stopping the cleaning process. A batch-type processing system is provided that allows plasma-enhanced cleaning of system components, and a system is provided with monitoring and controlling capability.

Abstract: A method and system are provided for monitoring status of a system component in a process chamber of a batch type processing system. The method includes exposing a system component to light from a light source and monitoring interaction of the light with the system component to determine status of the system component. The method can detect light transmission and/or light reflection from a system component during a process that can include a chamber cleaning process, a chamber conditioning process, a substrate etching process, and a substrate film formation process. The system component can be a consumable system part such as a process tube, a shield, a ring, a baffle, and a liner, and can further contain a protective coating.

Abstract: A method and system for monitoring status of a system component during a process. The method includes exposing a system component to a reactant gas during a process, where the reactant gas is capable of etching the system component material to form an erosion product, and monitoring release of the erosion product during the process to determine status of the system component. Processes that can be monitored include a chamber cleaning process, a chamber conditioning process, a substrate etching process, and a substrate film formation process. The system component can be a consumable system part such as a process tube, a shield, a ring, a baffle, an injector, a substrate holder, a liner, a pedestal, a cap cover, an electrode, and a heater, any of which can further include a protective coating.