Abstract: Apparatus and methods for protecting a submersible pump. The apparatus can include a cage having at least two longitudinal support arms, at least one window defined between any two of the support arms, and a perforated insert is at least partially disposed within the cage, wherein a first end of the perforated insert has a seat formed therein for engaging a moveable member that is contained within the cage, wherein passage of solids, fluids or both through the flow path is at least partially restricted in a first flow direction when the moveable member contacts the seat of the perforated insert and passage through the flow path is not restricted in a second flow direction that is opposite of the first flow direction when the moveable member does not contact the seat.

Abstract: An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminum, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.

Abstract: In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.

Abstract: An alloy suitable for use in a ball grid array or chip scale package, the alloy comprising from 0.05-1.5 wt. % copper; from 2.5-5 wt. % silver; one or both of from 0.005-0.3 wt % nickel and/or from 0.003-0.3 wt % chromium; from 0-0.1 wt. % phosphorus; from 0-0.1 wt. % germanium; from 0-0.1 wt. % gallium; from 0-0.3 wt. % of one or more rare earth elements; from 0-0.3 wt. % indium; from 0-0.3 wt. % magnesium; from 0-0.3 wt. % calcium; from 0-0.3 wt. % silicon; from 0-0.3 wt. % aluminium; from 0-0.3 wt. % zinc; from 0-2 wt. % bismuth; from 0-1 wt. % antimony; from 0-0.2 wt % manganese; from 0-0.3 wt % cobalt; from 0-0.3 wt % iron; and from 0-0.1 wt % zirconium; and the balance tin, together with unavoidable impurities.

Abstract: In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.

Abstract: An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminium, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.

Abstract: A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.

Abstract: The present invention relates generally to a system and method for publishing and distributing briefings, information, articles, advertisements, data, and the like to specific consumers in industries such as travel, health care, and retail, and more particularly, to a publishing system that shares, among publishers and advertisers, both content resources and information about the intended recipient's interests, location, and thereby providing publishers and advertisers a method to adapt the contents of a publication or electronic medium to the interests, demographics, and current circumstances of each recipient.

Abstract: A method and apparatus for creating a computerized market and integrated service chain for the aviation industry by use of a plurality of participant terminals using software tools and electronic devices. The present invention provides suppliers with specialized marketing and pricing tools for participating and non-participating aircraft operators and offers aircraft operators tools for displaying, managing, and analyzing suppliers' pricing and service offerings. The invention additionally creates a means for aircraft operators to integrate scheduling activities with the purchase of fuel and services in a paperless, detailed reporting environment, while using one or more credit providers but without the need for pilots to present any physical form of payment. In a preferred embodiment of the invention, suppliers are provided a method to display, manage, and integrate service requests from all aircraft operators.