Patents by Inventor John M. Lynch

John M. Lynch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096199
    Abstract: Techniques are disclosed for facilitating disabling an alarm in response to particular types of activity-indicative data. More specifically, activity-indicative data (e.g., measurements obtained by an electronic device) can be detected prior to a preset alarm time. Upon determining, based on the activity-indicative data, that a wakefulness condition is satisfied, the alarm can be disabled such that the alarm stimuli is not to be presented at the preset alarm time.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: Apple Inc.
    Inventors: Bharath Narasimha Rao, Kevin Will Chen, Reed E. Olsen, Umamahesh Srinivas, Kevin M. Lynch, John-Peter E. Cafaro
  • Publication number: 20240070331
    Abstract: Systems, methods, and software for filtering components, such as hardware components, compatible with computer-modeled structures are presented. A compatible components system provides selection methods that present components compatible with computer-aided design (CAD) models designed in computer modeling software. The system executes methods designed to filter components made available to designers using attribute information of the features and attribute information of the components. Designers may interact with the compatibility methods numerous times, narrowing components through a series or number of filtering steps until a desired compatible component is easily selected. The computer modeling software may include graphical user interfaces for selecting component source locations, filtering types of components presented by the system, and adding components to CAD models.
    Type: Application
    Filed: September 7, 2023
    Publication date: February 29, 2024
    Applicant: Desprez, LLC
    Inventors: James L. Jacobs, II, John E. Cronin, Justin R. Kunz, Steven M. Lynch
  • Patent number: 11914927
    Abstract: Systems, methods, and software for filtering components, such as hardware components, compatible with computer-modeled structures are presented. A compatible components system provides selection methods that present components compatible with computer-aided design (CAD) models designed in computer modeling software. The system executes methods designed to filter components made available to designers using attribute information of the features and attribute information of the components. Designers may interact with the compatibility methods numerous times, narrowing components through a series or number of filtering steps until a desired compatible component is easily selected. The computer modeling software may include graphical user interfaces for selecting component source locations, filtering types of components presented by the system, and adding components to CAD models.
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: February 27, 2024
    Inventors: James L. Jacobs, II, John E. Cronin, Justin R. Kunz, Steven M. Lynch
  • Patent number: 10426381
    Abstract: Switchable grounded terminal loads are built into, or otherwise coupled to, connectors on motherboards and control devices. The terminal loads are coupled to the bus termination at the connector when the connector is “stuffed” (connected to a mating connector). The switchable grounded terminal loads replace dummy connectors in preventing empty “unstuffed” connectors from increasing error risks on active channels.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: October 1, 2019
    Assignee: INTEL CORPORATION
    Inventors: Yunhui Chu, Charles C. Phares, John M. Lynch
  • Patent number: 9941643
    Abstract: Switchable grounded terminal loads are built into, or otherwise coupled to, connectors on motherboards and control devices. The terminal loads are coupled to the bus termination at the connector when the connector is “stuffed” (connected to a mating connector). The switchable grounded terminal loads replace dummy connectors in preventing empty “unstuffed” connectors from increasing error risks on active channels.
    Type: Grant
    Filed: December 26, 2015
    Date of Patent: April 10, 2018
    Assignee: Intel Corporation
    Inventors: Yunhui Chu, Charles C. Phares, John M. Lynch
  • Patent number: 9935384
    Abstract: A circuit board may include a connector having a circuit module latch that may include a latch frame and pivot-able ejector assembly coupled to the latch frame.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: April 3, 2018
    Assignee: Intel Corporation
    Inventors: Xiang Li, George Vergis, John M. Lynch
  • Publication number: 20180090862
    Abstract: A circuit board may include a connector having a circuit module latch that may include a latch frame and pivot-able ejector assembly coupled to the latch frame.
    Type: Application
    Filed: September 29, 2016
    Publication date: March 29, 2018
    Inventors: Xiang Li, George Vergis, John M. Lynch
  • Patent number: 9929511
    Abstract: An example electronic assembly for securing an electronic card. In some forms, the electronic assembly further includes a printed circuit board. The electronic assembly includes a housing having a first set of electrical contacts and a second set of electrical contacts. The housing is configured to receive the electronic card between the first and second set of electrical contacts. The housing further includes a third set of electrical contacts and a fourth set of electrical contacts. The housing is configured to receive the electronic card between the third and fourth set of electrical contacts. A ground shield is positioned between at least one of the first and third set of electrical contacts and the second and fourth set of electrical contacts. In some forms, the ground shield may be positioned between both the first and third set of electrical contacts and the second and fourth set of electrical contacts.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: March 27, 2018
    Assignee: Intel Corporation
    Inventors: John M. Lynch, Chong Richard Zhao, Xiang Li, Donald T. Tran
  • Patent number: 9929517
    Abstract: Switchable grounded terminal loads are built into, or otherwise coupled to, connectors on motherboards and control devices. The terminal loads are coupled to the bus termination at the connector when the connector is “stuffed” (connected to a mating connector). The switchable grounded terminal loads replace dummy connectors in preventing empty “unstuffed” connectors from increasing error risks on active channels.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: March 27, 2018
    Assignee: INTEL CORPORATION
    Inventors: Yunhui Chu, Charles C. Phares, John M. Lynch
  • Publication number: 20180007791
    Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.
    Type: Application
    Filed: September 12, 2017
    Publication date: January 4, 2018
    Inventors: Mani Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram S. Viswanath, Bassam N. Coury, Dimitrios Ziakas, Chong J. Zhao, Jonathan W. Thibado, Gregorio R. Murtagian, Kuang C. Liu, Rajasekaran Swaminathan, Zhichao Zhang, John M. Lynch, David J. Llapitan, Sanka Ganesan, Xiang Li, George Vergis
  • Patent number: 9832876
    Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: November 28, 2017
    Assignee: Intel Corporation
    Inventors: Mani Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram S. Viswanath, Bassam N. Coury, Dimitrios Ziakas, Chong J. Zhao, Jonathan W. Thibado, Gregorio R. Murtagian, Kuang C. Liu, Rajasekaran Swaminathan, Zhichao Zhang, John M. Lynch, David J. Llapitan, Sanka Ganesan, Xiang Li, George Vergis
  • Publication number: 20170271818
    Abstract: An example electronic assembly for securing an electronic card. In some forms, the electronic assembly further includes a printed circuit board. The electronic assembly includes a housing having a first set of electrical contacts and a second set of electrical contacts. The housing is configured to receive the electronic card between the first and second set of electrical contacts. The housing further includes a third set of electrical contacts and a fourth set of electrical contacts. The housing is configured to receive the electronic card between the third and fourth set of electrical contacts. A ground shield is positioned between at least one of the first and third set of electrical contacts and the second and fourth set of electrical contacts. In some forms, the ground shield may be positioned between both the first and third set of electrical contacts and the second and fourth set of electrical contacts.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 21, 2017
    Inventors: John M. Lynch, Chong Richard Zhao, Xiang Li, Donald T. Tran
  • Publication number: 20170264055
    Abstract: Switchable grounded terminal loads are built into, or otherwise coupled to, connectors on motherboards and control devices. The terminal loads are coupled to the bus termination at the connector when the connector is “stuffed” (connected to a mating connector). The switchable grounded terminal loads replace dummy connectors in preventing empty “unstuffed” connectors from increasing error risks on active channels.
    Type: Application
    Filed: May 26, 2017
    Publication date: September 14, 2017
    Inventors: Yunhui Chu, Charles C. Phares, John M. Lynch
  • Publication number: 20170258372
    Abstract: Switchable grounded terminal loads are built into, or otherwise coupled to, connectors on motherboards and control devices. The terminal loads are coupled to the bus termination at the connector when the connector is “stuffed” (connected to a mating connector). The switchable grounded terminal loads replace dummy connectors in preventing empty “unstuffed” connectors from increasing error risks on active channels.
    Type: Application
    Filed: May 26, 2017
    Publication date: September 14, 2017
    Inventors: Yunhui Chu, Charles C. Phares, John M. Lynch
  • Publication number: 20170187151
    Abstract: Switchable grounded terminal loads are built into, or otherwise coupled to, connectors on motherboards and control devices. The terminal loads are coupled to the bus termination at the connector when the connector is “stuffed” (connected to a mating connector). The switchable grounded terminal loads replace dummy connectors in preventing empty “unstuffed” connectors from increasing error risks on active channels.
    Type: Application
    Filed: December 26, 2015
    Publication date: June 29, 2017
    Inventors: Yunhui Chu, Charles C. Phares, John M. Lynch
  • Publication number: 20160183374
    Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.
    Type: Application
    Filed: December 18, 2014
    Publication date: June 23, 2016
    Inventors: Mani Prakash, Thomas T. Holden, Jeffory L. Smalley, Ram S. Viswanath, Bassam N. Coury, Dimitrios Ziakas, Chong J. Zhao, Jonathan W. Thibado, Gregorio R. Murtagian, Kuang C. Liu, Rajasekaran Swaminathan, Zhichao Zhang, John M. Lynch, David J. Llapitan, Sanka Ganesan, Xiang Li, George Vergis
  • Publication number: 20150171535
    Abstract: According to some embodiments, a SODIMM memory connector comprises a first socket to electrically couple a first SODIMM, and a second socket to electrically couple a second SODIMM, where the first socket is disposed vertically adjacent to the second socket.
    Type: Application
    Filed: December 28, 2011
    Publication date: June 18, 2015
    Inventors: Xiang Li, Chong J. Zhao, Jefferey L. Krieger, Dan Willis, John M. Lynch, Yun Ling
  • Patent number: 7909627
    Abstract: An electronic system includes a system board, a connector mounted on the system board, an electronic card attached to the connector, the card overhanging the connector at least on an inward end of the card, and a guide secured to the system board and spaced from the connector, wherein the guide is adapted to inhibit lateral movement of the card. The guide includes a latch adapted to inhibit removal of the electronic card from the connector.
    Type: Grant
    Filed: October 20, 2003
    Date of Patent: March 22, 2011
    Assignee: Intel Corporation
    Inventors: Brent A. Hill, Cary D. Cottrell, Yun Ling, John M. Lynch, Scott Noble, Guixiang Tan, Thai (Daniel) Tong, Daniel S. Willis, Yinan Wu
  • Publication number: 20040259405
    Abstract: According to some embodiments, a device includes a connector to hold an electrical module at an acute angle with respect to a surface on which the connector is to be mounted, and a first contact, a first portion of the first contact to contact the surface and a second portion of the first contact to contact the electrical module, a distance between the first portion and the second portion equal to a first length. A device may also include a second contact adjacent to the first contact, a first portion of the second contact to contact the surface and a second portion of the second contact to contact the electrical module, a distance between the first portion of the second contact and the second portion of the second contact substantially equal to the first length.
    Type: Application
    Filed: June 20, 2003
    Publication date: December 23, 2004
    Inventors: John M. Lynch, Jerry Bolen
  • Patent number: 6830470
    Abstract: According to some embodiments, a device includes a connector to hold an electrical module at an acute angle with respect to a surface on which the connector is to be mounted, and a first contact, a first portion of the first contact to contact the surface and a second portion of the contact to contact the electrical module, a distance between the first portion and the second portion equal to a first length. A device may also include a second contact adjacent to the first contact, a first portion of the second contact to contact the surface and a second portion of the second contact to contact the electrical module, a distance between the first portion of the second contact and the second portion of the second contact substantially equal to the first length.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: December 14, 2004
    Assignee: Intel Corporation
    Inventors: John M. Lynch, Jerry Bolen