Patents by Inventor John Meccia

John Meccia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF
    Publication number: 20220411674
    Abstract: The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
    Type: Application
    Filed: August 30, 2022
    Publication date: December 29, 2022
    Inventors: Tianjian Huang, Kristina Thompson, Daniel Waski, John Meccia
  • Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
    Patent number: 11459490
    Abstract: The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: October 4, 2022
    Assignee: HENKEL AG & CO, KGaA
    Inventors: Tianjian Huang, Kristina Thompson, Daniel Waski, John Meccia
  • WATER REUSE SYSTEM FOR PHYSICAL AND MICROBIOLOGICAL DECONTAMINATION OF WATER
    Publication number: 20220234912
    Abstract: Provided are systems and methods to effect separation of solids from fluid runoff from poultry and produce treatment trains. The systems include separation panels that operate using the Coanda effect so as to effect separation of solids without the need for electricity or moving parts.
    Type: Application
    Filed: July 2, 2020
    Publication date: July 28, 2022
    Applicant: CMS Technology, Inc.
    Inventors: Francis Dautreuil, John Meccia
  • Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
    Patent number: 11193048
    Abstract: The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: December 7, 2021
    Assignee: Henkel IP & Holding GmbH
    Inventors: Tianjian Huang, Kristina Thompson, Daniel Waski, John Meccia
  • MULTI STEP ANTI-MICROBIAL INTERVENTION PROCESS UTILIZING AN OXIDIZING TREATMENT FOLLOWED BY A LOW PH TREATMENT
    Publication number: 20210030013
    Abstract: Provided are systems and methods for reducing bacterial count on a substrate, such as a foodstuff. The disclosed technology includes treating the substrate with an oxidizing treatment (peracetic acid, for example) followed by treating the substrate with an acidic treatment.
    Type: Application
    Filed: February 1, 2019
    Publication date: February 4, 2021
    Applicant: CMS TECHNOLOGY, INC.
    Inventors: John MECCIA, Francis DAUTREUIL, Ingrid COLE
  • WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF
    Publication number: 20210002520
    Abstract: The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
    Type: Application
    Filed: September 18, 2020
    Publication date: January 7, 2021
    Inventors: Tianjian HUANG, Kristina THOMPSON, Daniel WASKI, John MECCIA
  • SYSTEMS AND METHODS FOR HIGH PH TREATMENT OF FOODSTUFFS AND OTHER SUBSTRATE
    Publication number: 20200337341
    Abstract: The present disclosure provides systems and methods for treatment of substrates—such as foodstuffs—with a high pH composition and an oxidizer. These systems and methods give rise to enhanced disinfection performance.
    Type: Application
    Filed: December 28, 2018
    Publication date: October 29, 2020
    Inventors: Eddie Lamar JONES, John MECCIA, Frances DAUTREUL, Ingrid COLE, Brandon BENISH, Ty BAUBLITS
  • Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
    Patent number: 10815397
    Abstract: The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: October 27, 2020
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Tianjian Huang, Kristina Thompson, Daniel Waski, John Meccia
  • ANTI-MICROBIAL COMPOSITIONS AND RELATED METHODS OF TREATING FOODSTUFFS AND SURFACES
    Publication number: 20200000095
    Abstract: The present disclosure provides compositions for antimicrobial use comprising a mineral acid, an organic acid, or a combination thereof a copper(II) salt; and a buffering salt, a detergent, or a combination thereof. The present disclosure also provides methods for reducing the number of pathogens on a surface by applying compositions of the present disclosure to the surface.
    Type: Application
    Filed: March 5, 2019
    Publication date: January 2, 2020
    Inventors: John Meccia, Ron Shapira, Francis Dautreuil, James Dietrich
  • SYSTEMS AND METHODS FOR IMPROVED BLENDING OF AGENTS IN CHEMICAL APPLICATIONS
    Publication number: 20190255495
    Abstract: The present disclosure provides improved systems and methods for the blending of active agents into process fluids.
    Type: Application
    Filed: November 1, 2017
    Publication date: August 22, 2019
    Inventors: Ron SHAPIRA, Francis DAUTREUIL, John MECCIA, James DIETRICH, William Randy DARR, Douglas KROITSCH
  • WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF
    Publication number: 20190218429
    Abstract: The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
    Type: Application
    Filed: March 20, 2019
    Publication date: July 18, 2019
    Inventors: Tianjian HUANG, Kristina Thompson, Daniel Waski, John Meccia
  • Antimicrobial copper compositions and their use in treatment of foodstuffs and surfaces
    Patent number: 10264793
    Abstract: The present disclosure provides compositions for antimicrobial use comprising a mineral acid, an organic acid, or a combination thereof; a copper(II) salt; and a buffering salt, a detergent, or a combination thereof. The present disclosure also provides methods for reducing the number of pathogens on a surface by applying compositions of the present disclosure to the surface.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: April 23, 2019
    Assignee: CMS TECHNOLOGY, INC.
    Inventors: John Meccia, Ronald C. Shapira, Francis Dautreuil, James Dietrich
  • Adhesive having structural integrity and insulative properties
    Patent number: 10100231
    Abstract: An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: October 16, 2018
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Tianjian Huang, Robert Sandilla, Daniel Waski, Kristina Thompson, John Meccia
  • ANTIMICROBIAL COMPOSITIONS AND METHODS OF THEIR USE
    Publication number: 20170280728
    Abstract: The present disclosure is directed to antimicrobial compositions comprising a hypochlorite salt, a copper (II) salt, and an optionally acid that is an inorganic acid, an organic acid, or a combination thereof, and optionally a buffering agent, and having a chlorine concentration of between 0.1 ppm and 300 ppm and a copper (II) concentration of between 0.1 ppm and 300 ppm. Methods of making and using these compositions is also described.
    Type: Application
    Filed: September 11, 2015
    Publication date: October 5, 2017
    Inventors: Francis DAUTREUIL, Ron SHAPIRA, John MECCIA, Seth HYATT
  • Adhesive having structural integrity and insulative properties
    Patent number: 9771499
    Abstract: An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: September 26, 2017
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Tianjian Huang, Robert Sandilla, Daniel Waski, Kristina Thompson, John Meccia
  • ANTIMICROBIAL COPPER COMPOSITIONS AND THEIR USE IN TREATMENT OF FOODSTUFFS AND SURFACES
    Publication number: 20170258093
    Abstract: The present disclosure provides compositions for antimicrobial use comprising a mineral acid, an organic acid, or a combination thereof; a copper(II) salt; and a buffering salt, a detergent, or a combination thereof. The present disclosure also provides methods for reducing the number of pathogens on a surface by applying compositions of the present disclosure to the surface.
    Type: Application
    Filed: November 25, 2015
    Publication date: September 14, 2017
    Inventors: John MECCIA, Ronald C. SHAPIRA, Francis DAUTREUIL, James DIETRICH
  • ADHESIVE HAVING STRUCTURAL INTEGRITY AND INSULATIVE PROPERTIES
    Publication number: 20170204303
    Abstract: An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.
    Type: Application
    Filed: March 31, 2017
    Publication date: July 20, 2017
    Inventors: Tianjian HUANG, Robert SandiIla, Daniel Waski, Kristina Thompson, John Meccia
  • WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF
    Publication number: 20170204302
    Abstract: The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
    Type: Application
    Filed: March 31, 2017
    Publication date: July 20, 2017
    Inventors: Tianjian HUANG, Kristina Thompson, Daniel Waski, John Meccia
  • Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
    Patent number: 9657200
    Abstract: The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 23, 2017
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Tianjian Huang, Kristina Thompson, Daniel Waski, John Meccia
  • Hot melt assist waterborne adhesives and use thereof
    Patent number: 9273230
    Abstract: A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: March 1, 2016
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Tianjian Huang, Kristina Thompson, James Layser, John Harrington, John Meccia, Robert Mammarella