Patents by Inventor John Meccia

John Meccia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hot melt assist waterborne adhesives and use thereof
    Patent number: 9273230
    Abstract: A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: March 1, 2016
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Tianjian Huang, Kristina Thompson, James Layser, John Harrington, John Meccia, Robert Mammarella
  • HOT MELT ASSIST WATERBORNE ADHESIVES AND USE THEREOF
    Publication number: 20140141185
    Abstract: A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 22, 2014
    Applicant: Henkel Corporation
    Inventors: Tianjian Huang, Kristina Thompson, James Layser, John Harrington, John Meccia, Robert Mammerella
  • ADHESIVE HAVING STRUCTURAL INTEGRITY AND INSULATIVE PROPERTIES
    Publication number: 20140087109
    Abstract: An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.
    Type: Application
    Filed: November 27, 2013
    Publication date: March 27, 2014
    Applicant: HENKEL US IP LLC
    Inventors: Tianjian Huang, Robert Sandilla, Daniel Waski, Kristina Thompson, John Meccia
  • WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF
    Publication number: 20140087177
    Abstract: The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 27, 2014
    Applicant: Henkel Corporation
    Inventors: Tianjian Huang, Kristina Thompson, Daniel Waski, John Meccia