Abstract: The invention provides a compound of formula (0): or a pharmaceutically acceptable salt, N-oxide or tautomer thereof; wherein: n is 1 or 2; X is CH or N; Y is selected from CH and C—F; Z is selected from C—Rz and N; R1 is selected from: -(Alk1)t-Cyc1; wherein t is 0 or 1; Optionally substituted C1-6 acyclic hydrocarbon groups R2 is selected from hydrogen; halogen; and C1-3 hydrocarbon groups optionally substituted with one or more fluorine atoms; R3 is hydrogen or a group L1-R7; R4 is selected from hydrogen; methoxy; and optionally substituted C1-3 alkyl; and R4a is selected from hydrogen and a C1-3 alkyl group; wherein Rz, Alk1, Cyc1, L1 and R7 are defined herein; provided that the compound is other than 6-benzyl-3-{2-[(2-methylpyrimidin-4-yl)amino]pyridin-4-yl}-7,8-dihydro-1,6-naphthyridin-5(6H)-one and 3-{2-[(2-methylpyrimidin-4-yl)amino]pyridin-4-yl}-7,8-dihydro-1,6-naphthyridin-5(6H)-one and salts and tautomers thereof.

Abstract: Apparatus including an elongated body to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate, the surface mount connector including a connector housing having a first end portion and a second end portion. In one implementation, the elongated body may include: a first body end portion forming a first tab insertable into a first portion of a socket defined by the first housing end portion; and a second body end portion forming a second tab insertable into a second portion of the socket defined by the second housing end portion.

Abstract: Products, compositions, systems, and methods for modifying a target structure which mediates or is associated with a biological activity, including treatment of conditions, disorders, or diseases mediated by or associated with a target structure, such as a virus, cell, subcellular structure or extracellular structure. The methods may be performed in situ in a non-invasive manner by placing a nanoparticle having a metallic shell on at least a fraction of a surface in a vicinity of a target structure in a subject and applying an initiation energy to a subject thus producing an effect on or change to the target structure directly or via a modulation agent. The nanoparticle is configured, upon exposure to a first wavelength ?1, to generate a second wavelength ?2 of radiation having a higher energy than the first wavelength ?1.

Abstract: Examples described herein relate to cooling system for an electronic circuit module. The cooling system includes a frame disposable on the electronic circuit module and comprising a plurality of compartments defined by compartment walls. The cooling system further includes a plurality of cold plates disposed in the plurality of compartments of the frame and in thermal contact with the electronic circuit module, wherein the plurality of cold plates includes one or more passages to allow flow of a coolant there-through to conduct heat away from the electronic circuit module. Further, the one or more cold plates of the plurality cold plates include a guide feature to allow vertical movement of the one or more cold plates in respective compartments.

Abstract: A controller system including a first controller including one or more input controls and a connector. The controller system also can include a second controller including one or more input controls and a connector. The controller system additionally can include a bridge including a first connector at a first end of the bridge, a second connector at a second end of the bridge, and one or more hub connectors between the first end and the second end of the bridge. Each of the first connector, the second connector, and the one or more hub connectors can be a first connector type. Each of the connectors of the first controller and the second controller can be a second connector type configured to connect in a positionally secure manner with the first connector type. Other embodiments are described.

Abstract: Example implementations relate to an electrical socket for an electronic packaging assembly, which accepts a modular integrated circuit (IC) on one side and a circuit board on another side. In some examples, the electrical socket has a first body mountable on a first surface of the circuit board and a second body mountable on a second surface of the circuit board. The first body includes a plurality of conductors (wire-terminated contacts), where each first conductor includes a first end to protrude beyond the first surface of the circuit board and a second end to protrude beyond the second surface of the circuit board. The second body includes a plurality of receptacles, where each receptacle is coupled to the second end of a respective first conductor.

Abstract: A computing system comprises a module cage for containing a system board and a plurality of pluggable modules, the module cage having a front face, the pluggable modules arranged in at least two rows of pluggable module locations extending parallel to the front face within the module cage. A layered module locking system including a sliding front locking handle and a sliding rear locking handle is provided. the sliding rear locking handle extending beneath the front locking handle. The sliding locking handles each includes at least one locking feature for slidably engaging with at least one foot of a pluggable module.

Abstract: A system that may be used for deploying optical cables, the system may include a track having an outer edge and a surface, the track having a track gear disposed proximate the outer edge and a plurality of track grooves disposed on the surface of the track. The system may also include a spool having a first outer edge and a second outer edge. The spool may include a first wheel disposed on the first outer edge, a second wheel disposed on the second outer edge, a spool gear disposed on the first wheel and interfacing with the track gear, plurality of spool grooves, and a plurality of guides interfacing with the track to align the track grooves with the spool grooves.

Abstract: A computer-implemented low-code development platform is provided including a user interface and having access to a library of step macros configured for user configuration and interconnection via the user interface to generate executable code. Each step macro includes a step configuration generator and an execution code generator. The step configuration generator is configured to generate a step configuration file based on user-configurable data points configurable via the user interface. The execution code generator is configured to generate executable code in the form of a compiled step file configured for storage in memory and execution by a processor of a computing system. The execution code generator receives and inputs the step configuration file into a metaprogramming component configured to interpret the user-configurable data points of the step configuration file and to generate and output the compiled step file.

Abstract: A solid-state drive (SSD) carrier comprises a front structure, a first side structure extending perpendicularly from a first end of the front structure, and a second side structure extending perpendicularly from a second end of the front structure. The front structure and the first and second side structures defining an internal volume sufficient to contain an SSD conforming to any one of a plurality of different SSD form factors. At least one light pipe extends through in the front structure, and is configured to direct light from an indicator LED on a front face of the SSD to a location on a front face of the front structure.

Abstract: A computing system comprises a module cage for containing a system board and a plurality of pluggable modules, the module cage having a front face, the pluggable modules arranged in at least two rows of pluggable module locations extending parallel to the front face within the module cage. A layered module locking system including a sliding front locking handle and a sliding rear locking handle is provided. The sliding rear locking handle extending beneath the front locking handle. The sliding locking handles each includes at least one locking feature for slidably engaging with at least one foot of a pluggable module.

Abstract: A module, comprising: a printed circuit board (PCB); a power and management connector disposed on the PCB to connect to a computing device via a first cable; a data connector disposed on the PCB to connect to the computing device via a second cable; and a memory slot, to accept a memory device, disposed on the PCB and connected to the power and management connector and the data connector.

Abstract: Scalable-bandwidth aggregation boxes are disclosed that allow scalable electrical connection bandwidth of multiple servers in a rack to aggregation modules and compact bifurcatable optical cables to connect the aggregation modules to switches, while minimizing switch faceplate connector area requirements by using optical connectors. Users of a system including scalable-bandwidth aggregation boxes can choose a desired bandwidth cable to connect a server to a switch via an aggregation box. An aggregation box may include a scalable-bandwidth electrical connector on a faceplate, signal lines coupled between the scalable-bandwidth electrical connector and a board connector in the housing, and a serviceable bandwidth-aggregation module removably disposed in the housing.

Abstract: A solid-state drive (SSD) carrier comprises a front structure, a first side structure extending perpendicularly from a first end of the front structure, and a second side structure extending perpendicularly from a second end of the front structure. The front structure and the first and second side structures defining an internal volume sufficient to contain an SSD conforming to any one of a plurality of different SSD form factors. At least one light pipe extends through in the front structure, and is configured to direct light from an indicator LED on a front face of the SSD to a location on a front face of the front structure.

Abstract: Examples described herein relate to cooling system for an electronic circuit module. The cooling system includes a frame disposable on the electronic circuit module and comprising a plurality of compartments defined by compartment walls. The cooling system further includes a plurality of cold plates disposed in the plurality of compartments of the frame and in thermal contact with the electronic circuit module, wherein the plurality of cold plates includes one or more passages to allow flow of a coolant there-through to conduct heat away from the electronic circuit module. Further, the one or more cold plates of the plurality cold plates include a guide feature to allow vertical movement of the one or more cold plates in respective compartments.

Abstract: Example implementations relate to an electronic device packaged on a wing board. For example, an implementation includes a base board having a planar signal interface to couple parallelly to a signal interface segment of a system board. The example implementation also includes a plurality of wing boards to scale in a direction perpendicular to a plane of the base board. An electronic device is packaged on each of the wing boards. A flexible circuit flexibly links at least one of the wing boards to the base board and has a signal path to communicatively couple the planar signal interface and an electronic device packaged the wing board.

Abstract: Example implementations relate to an electrical socket for an electronic packaging assembly, which accepts a modular integrated circuit (IC) on one side and a circuit board on another side. In some examples, the electrical socket has a first body mountable on a first surface of the circuit board and a second body mountable on a second surface of the circuit board. The first body includes a plurality of conductors (wire-terminated contacts), where each first conductor includes a first end to protrude beyond the first surface of the circuit board and a second end to protrude beyond the second surface of the circuit board. The second body includes a plurality of receptacles, where each receptacle is coupled to the second end of a respective first conductor.

Abstract: A computing system comprises a module cage for containing a system board and a plurality of pluggable modules, the module cage having a front face, the pluggable modules arranged in at least two rows of pluggable module locations extending parallel to the front face within the module cage. A layered module locking system including a sliding front locking handle and a sliding rear locking handle is provided. the sliding rear locking handle extending beneath the front locking handle. The sliding locking handles each includes at least one locking feature for slidably engaging with at least one foot of a pluggable module.

Abstract: An apparatus comprising: a drive carrier assembly (DCA) including; an energy storage device having at least a portion thereof encased by a housing; and a printed circuit assembly to detect a power failure of a host computing device, wherein the printed circuit assembly has a first portion coupled to the energy storage device and a second portion coupled to a backplane of the host computing device.

Abstract: Products, compositions, systems, and methods for modifying a target structure which mediates or is associated with a biological activity, including treatment of conditions, disorders, or diseases mediated by or associated with a target structure, such as a virus, cell, subcellular structure or extracellular structure. The methods may be performed in situ in a non-invasive manner by placing a nanoparticle having a metallic shell on at least a fraction of a surface in a vicinity of a target structure in a subject and applying an initiation energy to a subject thus producing an effect on or change to the target structure directly or via a modulation agent. The nanoparticle is configured, upon exposure to a first wavelength ?1, to generate a second wavelength ?2 of radiation having a higher energy than the first wavelength ?1.