Abstract: A magnetic drive for providing pivotal motion to a mirror device. The magnetic drive may be used to drive any torsional hinged mirror, but is particularly suitable for driving a high-speed, torsional hinged mirror at its resonant frequency for use as the drive engine of a printer or visual display. According to a first embodiment, a dual axis mirror uses a first pair of torsional hinges to provide the resonant beam sweep and a second pair of torsional hinges to provide high-speed movement orthogonal to the beam sweep to maintain successive images of the sweep parallel to each other. The mass and movement of inertia of the resonant mirror are reduced by relocating permanent magnet sets to the axis of rotation. The reduced mass and movement of inertia allows a significantly higher resonant frequency and corresponding high pivotal speed.

Abstract: A magnetic drive for providing pivotal motion to a functional surface, such as a mirror. The magnetic drive may be used to drive any torsional hinged device, but is particularly suitable for driving a torsional hinged mirror. According to a first embodiment, a dual axis functional surface uses a first pair of torsional hinges to provide primary movement to the functional surface and a second pair of torsional hinges provides movement orthogonal to the primary movement to allow positioning in two directions. The mass and movement of inertia of the functional surface is reduced by relocating permanent magnet sets to the axis of rotation. The reduced mass and movement of inertia results in a stiff robust hinge having a resonant frequency above about 120 Hz.

Abstract: A wire of predetermined cross section is provided and fed through a capillary having a bore of predetermined shape and sufficiently larger dimensions so that the wire can be fed through the bore without impediment and without being rotatable within the bore. The capillary is applied to the surface to which the bond is to be made with the smallest cross sectional dimension of the wire disposed between the surface to be bonded and any adjacent wires or bonds in order to minimize the possibility of contact with the adjacent wires or bonds. By utilizing a shaped wire having one narrow dimension and one wide dimension, the space between bond locations required to accommodate the wire can be decreased whereas the total current carrying capacity can be the same as in the case of round wires by having the same cross sectional area as the round wire since the wide dimension is directed away from any adjacent bond locations or the like. In other words, the wire to wire clearance is improved by using the shaped wire.

Abstract: A wire of predetermined cross section is provided and fed through a capillary having a bore of predetermined shape and sufficiently larger dimensions so that the wire can be fed through the bore without impediment and without being rotatable within the bore. The capillary is applied to the surface to which the bond is to be made with the smallest cross sectional dimension of the wire disposed between the surface to be bonded and any adjacent wires or bonds in order to minimize the possibility of contact with the adjacent wires or bonds. By utilizing a shaped wire having one narrow dimension and one wide dimension, the space between bond locations required to accommodate the wire can be decreased whereas the total current carrying capacity can be the same as in the case of round wires by having the same cross sectional area as the round wire since the wide dimension is directed away from any adjacent bond locations or the like. In other words, the wire to wire clearance is improved by using the shaped wire.

Abstract: A lead frame, method of making same and semiconductor package containing the lead frame. The semiconductor package includes the lead frame which includes an essentially flat, planar lead frame body and lead frame leads extending from the lead frame body, the lead frame leads extending partially out of the plane of the lead frame body. A semiconductor chip is disposed on the lead frame and an encapsulant encapsulates the lead frame body, the semiconductor chip and a portion of the lead frame leads, with a portion of the lead frame leads extending external to the encapsulant. The two dimensional cross section can be essentially in the shape of a "U", essentially sinusoidal in shape, the sinusoidal shape having an odd number of half cycles of the sinusoidal shape or essentially in the shape of a "W".