Abstract: A sealed cable assembly includes a jacket enclosing a plurality of insulated wires. Each insulated wire includes a bare wire covered by surrounding insulation, and a cable plug or connector is electrically connected with the bare wires. A sealant surrounds the insulated wires in an air gap between the jacket and the insulated wires in a location at or near the cable plug or connector, and the sealant fills the air gap at the location to prevent or reduce fluid loss through the cable in an immersion cooling system. The cable assembly can also be sealed at an in-between section away from the cable plug or connector. The cable assembly is wrapped with a weatherproof film or tape at the location of the sealing to further prevent or reduce fluid loss through the cable.

Abstract: A continuous method of manufacturing adhesives is provided. The method includes obtaining an actinic radiation-polymerizable adhesive precursor composition disposed on a major surface of an actinic radiation-transparent substrate and irradiating a first portion of the actinic radiation-polymerizable adhesive precursor composition through the actinic radiation-transparent substrate for a first irradiation dosage. The method further includes moving the actinic radiation-transparent substrate and irradiating a second portion of the actinic radiation-polymerizable adhesive precursor composition through the actinic radiation-transparent substrate for a second irradiation dosage. Optionally, the method also includes irradiating a third portion of the actinic radiation-polymerizable adhesive precursor composition through the actinic radiation-transparent substrate prior to moving the substrate.

Abstract: Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

Abstract: A cationic copolymer comprises the divalent monomer units: wherein: each Ar1 independently represents phenylene; each L independently represents a direct bond or wherein each R1 independently represents an alkyl group having 1 to 4 carbon atoms, and each R2 independently represents an alkylene group having from 1 to 6 carbon atoms, and each Z? represents a non-interfering anion; each Ar2 independently represents an optionally substituted divalent aryl ring, with the proviso that if L represents a direct bond, then Ar2 represents an optionally substituted cationic divalent aryl ring accompanied by Z; each R3 independently represents H or an alkyl group having 1 to 6 carbon atoms; and each D independently represents a direct bond or Ar2, wherein adjacent D and L are not both direct bonds, and wherein if L is a direct bond, then D is Ar2. The cationic copolymer can be free-radially cured and used in a membrane.

Abstract: A filtration system for a tank includes a filter housing, at least a portion of which is disposed in a tank and in fluidic communication with a dielectric fluid within the tank; at least one filtration element, disposed within the filter housing; and a fluid pump, at least a portion of which is disposed within the filter housing and immersed in the dielectric fluid, the fluid pump in fluidic communication with the at least one filtration element.

Abstract: Described herein is a multilayered article (10) and methods of making and using such articles. The multilayered article (10) comprises: ? (a) a microsphere layer (11) comprising a plurality of microspheres disposed in a monolayer; ? (b) a bead bonding layer (12) comprising a first major surface and a second opposing major surface and the plurality of microspheres is partially embedded in the first major surface of the bead bonding layer, and comprises a thermoset polyurethane having a glass transition temperature of at least 35° C.; ? (c) a primer layer (14) disposed on the second major surface of the bead bonding layer wherein the primer layer comprises a copolymer of polyurea and polyurethane and wherein the primer layer is covalently attached to the bead bonding layer via urea linkages; and ? (d) an elastomeric layer (16) disposed on the primer layer opposite the bead bonding layer, wherein the elastomeric layer comprises a polyurethane thermoplastic elastomer.

Abstract: A method of making an adhesive is provided, including obtaining an actinic radiation-polymerizable adhesive precursor composition disposed against a surface of an actinic radiation-transparent substrate and irradiating a first portion of the actinic radiation-polymerizable adhesive precursor composition through the actinic radiation-transparent substrate for a first irradiation dosage. The method further includes irradiating a second portion of the actinic radiation-polymerizable adhesive precursor composition through the actinic radiation-transparent substrate for a second irradiation dosage. The first portion and the second portion are adjacent to or overlapping with each other and the first irradiation dosage and the second irradiation dosage are not the same. The method forms an integral adhesive having a variable thickness in an axis normal to the surface of the actinic radiation-transparent substrate.

Abstract: A method of making an adhesive is provided, including obtaining an actinic radiation-polymerizable adhesive precursor composition disposed against a surface of an actinic radiation-transparent substrate and irradiating a first portion of the actinic radiation-polymerizable adhesive precursor composition through the actinic radiation-transparent substrate for a first irradiation dosage. The method further includes irradiating a second portion of the actinic radiation-polymerizable adhesive precursor composition through the actinic radiation-transparent substrate for a second irradiation dosage. The first portion and the second portion are adjacent to or overlapping with each other and the first irradiation dosage and the second irradiation dosage are not the same. The method forms an integral adhesive having a variable thickness in an axis normal to the surface of the actinic radiation-transparent substrate.

Abstract: A film including a resin layer comprising a structured major surface opposite a second major surface, the structured major surface including a plurality of features; a barrier layer on the structured major surface; and a first adhesive layer on the barrier layer.

Abstract: Low dielectric constant curable compositions include a first alkyl (meth)acrylate monomer with 12 or more carbon atoms, a crosslinking monomer, a copolymeric additive of a polyisobutylene-polysiloxane block copolymer, and at least one initiator. The curable composition is solvent free and inkjet printable. Upon curing the curable composition forms a non-crystalline, optically clear layer with a dielectric constant of less than or equal to 3.0 at 1 MegaHertz.

Abstract: A film including: a substrate; a first barrier layer on the substrate; a first resin layer on the first barrier layer; wherein the first resin layer includes a structured major surface and a plurality of features; a second barrier layer on the structured major surface of the first resin layer; and a second resin layer on the second barrier layer, wherein the second resin layer includes a structured major surface and a plurality of features.

Abstract: Wireless sensing devices including stable near-field antennas are provided. A spacer layer is attached to a portion of the substrate adjacent to the antenna. The spacer layer has a thickness T, a relative permittivity k, and a figure of merit defined as the ratio of T (in micrometers) by k. The spacer layer has the figure of merit no less than 20 (micrometers).

Abstract: Flexible, stretchable RFID tags are formed by a pocket that is formed from one or more substrates and layers of adhesive, and an electronic circuit that is located within this pocket. The RFID tags can include a stretchable substrate and an electronic circuit attached to the stretchable substrate by one or a finite number of discrete spaced apart attachment locations. When the pocket is formed by relatively thick adhesive layers adhering together one or more flexible substrates to form an internal cavity, the electronic circuit is located within this cavity and either is not adhered to any of the substrates of the cavity, and is free to move about within the cavity, or the electronic circuit can be attached to a substrate by a thin layer of adhesive.

Abstract: Wireless sensing devices including stable near-field antennas are provided. A spacer layer is attached to a portion of the substrate adjacent to the antenna. The spacer layer has a thickness T, a relative permittivity k, and a figure of merit defined as the ratio of T (in micrometers) by k. The spacer layer has the figure of merit no less than 20 (micrometers).

Abstract: Flexible, stretchable RFID tags are formed by a pocket that is formed from one or more substrates and layers of adhesive, and an electronic circuit that is located within this pocket. The RFID tags can include a stretchable substrate and an electronic circuit attached to the stretchable substrate by one or a finite number of discrete spaced apart attachment locations. When the pocket is formed by relatively thick adhesive layers adhering together one or more flexible substrates to form an internal cavity, the electronic circuit is located within this cavity and either is not adhered to any of the substrates of the cavity, and is free to move about within the cavity, or the electronic circuit can be attached to a substrate by a thin layer of adhesive.

Abstract: A barrier adhesive composition comprises polyisobutylene resin, hydrophobic nanoparticles and sorbent nanoparticles.

Abstract: The disclosed light directing article comprises a structured layer, an adhesive sealing layer, and barrier elements. The structured layer comprises multiple microstructured elements that are opposite a major surface. The adhesive sealing layer has a first region and a second region. The second region is in contact with the structured layer. The barrier element are at the first region. The first region with the barrier element and second region have sufficiently different properties to form a low refractive index layer between the adhesive sealing layer and the structured layer. The barrier element comprises a crosslinked polymeric matrix having a modulus of elasticity less than 4.4 GPa.

Abstract: A method of patterning a conductive layer to form transparent electrical conductors that does not require etching is disclosed. The method includes peeling a strippable polymer layer from a substrate coated with the conductive layer to pattern the conductive layer. In some embodiments, a resist matrix material is patterned over the conductive layer to prevent removal of the conductive layer beneath the resist matrix material. In other embodiments, a liner having a pressure sensitive adhesive surface is brought into contact with the patterned strippable polymer material to remove both the patterned strippable polymer material and the conductive layer beneath it.

Abstract: Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

Abstract: Surface-modified adhesives may be prepared by contacting an adhesive layer to an at least partially discontinuous layer on a releasing substrate and removing the adhesive layer such that at least a portion of the at least partially discontinuous layer adheres to the adhesive surface. The modified adhesive surface remains an adhesive surface. The modified adhesive layer can be used to prepare adhesive articles, including articles containing multiple surface-modified adhesive layers.