Abstract: A depletion mode FET having a source electrode connected to ground; and a bias circuit for producing a bias current for a gate electrode of the FET. The bias circuit includes a pair of source follower transistors circuits; a first one of the pair of two source follower transistor circuits being coupled between a first voltage supply having a first polarity relative to the ground potential and a second voltage supply having a second polarity relative to ground potential, the first polarity being opposite to the second polarity, the first one of the pair of the source follower transistor circuits supplying a control signal to a second one of the pair of source follower transistor circuits. The second one of the pair of source follower transistors circuits is coupled between the second voltage supply and the ground potential and wherein the second one of the pair of source follower transistor circuits produces a bias signal for the control electrode of the output transistor.

Abstract: A circuit having an amplifier, comprising: a depletion mode transistor having a source electrode coupled to a reference potential; a drain electrode coupled to a potential more positive than the reference potential; and a gate electrode for coupling to an input signal. The circuit includes a bias circuit, comprising: a current source; and biasing circuitry coupled to the current source and between the potential more positive than the reference potential and a potential more negative than the reference potential. A control circuit is connected to the current source for controlling the amount of current produced by the current source to the biasing circuitry.

Abstract: A semiconductor structure having a semiconductor layer having an active device therein. A dielectric structure is disposed over the semiconductor layer, such dielectric structure having open ended trench therein. An electrical interconnect level is disposed in the trench and electrically connected to the active device. A plurality of stacked metal layers is disposed in the trench. The stacked metal layers have disposed on bottom and sidewalls thereof conductive barrier metal layers.

Abstract: A field effect transistor structure having a semiconductor having a source region, a drain region, and a gate contact region disposed between the source region and the drain region; and a gate electrode having a stem section extending from a top section of the gate electrode to, and in Schottky contact with, the gate contact region. The stem section has an upper portion terminating at the top portion of the gate electrode and a bottom portion narrower than the upper portion, the bottom portion terminating at the gate contact region. The bottom portion of the stem has a step between the upper portion of the stem section and the bottom portion of the stem section in only one side of the stem section. The step of the stem section provides an asymmetric field plate for the field effect transistor.

Abstract: A semiconductor structure provided having: a dielectric; a non-column III-V doped semiconductor layer disposed over the dielectric; and an isolation barrier comprising column III-V material disposed vertically through the semiconductor layer to the dielectric. In one embodiment, the semiconductor layer is silicon and has CMOS transistors disposed in the semiconductor layer above a first region of the dielectric and a III-V transistor disposed above a different region of the dielectric. The barrier electrically isolates the column III-V transistor from the CMOS transistors. In one embodiment, the structure includes a passive device disposed over the semiconductor layer and a plurality of laterally spaced III-V structures, the III-V structures being disposed under the passive device, the III-V structures passing vertically through the semiconductor layer to the insulating layer.

Abstract: A field effect transistor structure having a semiconductor having a source region, a drain region, and a gate contact region disposed between the source region and the drain region; and a gate electrode having a stem section extending from a top section of the gate electrode to, and in Schottky contact with, the gate contact region. The stem section has an upper portion terminating at the top portion of the gate electrode and a bottom portion narrower than the upper portion, the bottom portion terminating at the gee contact region. The bottom portion of the stem has a step between the upper portion of the stem section and the bottom portion of the stem section in only one side of the stem section. The step of the stem section provides an asymmetric field plate for the fled effect transistor.

Abstract: A semiconductor structure, comprising: a substrate; a seed layer over an upper surface of the substrate; a semiconductor layer disposed over the seed layer; a transistor device in the semiconductor layer; wherein the substrate has an aperture therein, such aperture extending from a bottom surface of the substrate and terminating on a bottom surface of the seed layer; and an opto-electric structure disposed on the bottom surface of the seed layer.

Abstract: A current mirror circuit having formed in a semiconductor: a pair of transistors arranged to produce an output current through an output one of the transistors proportional to a reference current fed to an input one of the pair of transistors; a resistor comprising a pair of spaced electrodes in ohmic contact with the semiconductor, one of such pair of electrodes of the resistor being coupled to the input one of the pair of transistors; and circuitry for producing a voltage across the pair of electrodes of the resistor, such circuitry placing the resistor into saturation producing current through a region in the semiconductor between the pair of spaced ohmic contacts, such produced current being fed to the input one of the transistors as the reference current for the current mirror.

Abstract: A thermoelectric bias voltage generator having a substrate, an active device formed in a semiconductor region of the substrate, and a thermoelectric junction disposed on the substrate and connected to the active device to provide the bias voltage for the active device.

Abstract: A current mirror circuit having formed in a semiconductor: a pair of transistors arranged to produce an output current through an output one of the transistors proportional to a reference current fed to an input one of the pair of transistors; a resistor comprising a pair of spaced electrodes in ohmic contact with the semiconductor, one of such pair of electrodes of the resistor being coupled to the input one of the pair of transistors; and circuitry for producing a voltage across the pair of electrodes of the resistor, such circuitry placing the resistor into saturation producing current through a region in the semiconductor between the pair of spaced ohmic contacts, such produced current being fed to the input one of the transistors as the reference current for the current mirror.

Abstract: A semiconductor structure having a transistor and a thermo electronic structure. The transistor has a control electrode for controlling a flow of carriers through a semiconductor layer between a pair of electrodes. The thermo electronic structure has a first portion disposed on at least one of the pair of electrodes and a second portion disposed over a region of the semiconductor layer proximate the control electrode between the control electrode and said at least one of the pair of electrode. The thermo electronic structure extends from the first portion to the second portion for removing heat generated heat from said region in the semiconductor layer.

Abstract: An amplifier having a depletion mode output transistor and a bias circuit coupled to a negative voltage supply. A thermopile is provided to bias the output transistor to an “off” condition in the event of failure of the negative supply voltage.

Abstract: A system having: a digital pre-distortion circuit fed by a digital signal for distorting the digital signal; a digital to analog converter (DAC) core section coupled to an output of the calibration circuit for converting the distorted digital signal into a corresponding analog signal, the DAC core section performing the conversion in accordance with a control signal fed to the DAC core section; a power amplifier (PA) section coupled to an output of the DAC core section for amplifying power in the analog signal; and a calibration circuit coupled to the output of the power amplifier for producing, in response to the power in the power amplified analog signal, the control signal for the DAC core section.

Abstract: A semiconductor structure having a transistor and a thermo electronic structure. The transistor has a control electrode for controlling a flow of carriers through a semiconductor layer between a pair of electrodes. The thermo electronic structure has a first portion disposed on at least one of the pair of electrodes and a second portion disposed over a region of the semiconductor layer proximate the control electrode between the control electrode and said at least one of the pair of electrode. The thermo electronic structure extends from the first portion to the second portion for removing heat generated heat from said region in the semiconductor layer.

Abstract: A system having: a digital pre-distortion circuit fed by a digital signal for distorting the digital signal; a digital to analog converter (DAC) core section coupled to an output of the calibration circuit for converting the distorted digital signal into a corresponding analog signal, the DAC core section performing the conversion in accordance with a control signal fed to the DAC core section; a power amplifier (PA) section coupled to an output of the DAC core section for amplifying power in the analog signal; and a calibration circuit coupled to the output of the power amplifier for producing, in response to the power in the power amplified analog signal, the control signal for the DAC core section.

Abstract: A semiconductor structure comprising: a substrate; a seed layer supported by the substrate; an elemental semiconductor layer disposed over a first portion of the seed layer; and a compound semiconductor layer disposed on a second portion of the seed layer. The first portion of the seed layer is electrically insulated from the second portion of the seed layer. A first semiconductor device is formed in the elemental semiconductor layer. A second semiconductor device is formed in the compound semiconductor layer. The second semiconductor device includes: a first electrode in contact with a first region of the compound semiconductor layer; a second electrode in contact with a second region of the compound semiconductor layer; and a third electrode. The third electrode controls carriers passing in a third region of the compound semiconductor layer disposed between the first region and the second region. A fourth electrode is in electrical contact with the second portion of the seed layer.

Abstract: A network having a current mirror comprising: a output transistor having a gate electrode for controlling a first current between a first electrode and a second electrode, the first electrode being coupled to a positive reference potential and the second electrode being connected to ground. A second transistor has a gate electrode for controlling a second current between a first electrode and a second electrode of the second transistor. The gate electrodes are connected together to produce the first current and the second current with equal current densities. A first portion of current from a current source is fed to the first electrode of the second transistor and a second portion of current from the current source is fed to a bias voltage producing circuit producing a bias voltage at the gate electrode of the output transistor for tracking variations in the first current passing through the output transistor.

Abstract: A semiconductor structure comprising: a substrate; a seed layer supported by the substrate; an elemental semiconductor layer disposed over a first portion of the seed layer; and a compound semiconductor layer disposed on a second portion of the seed layer. The first portion of the seed layer is electrically insulated from the second portion of the seed layer. A first semiconductor device is formed in the elemental semiconductor layer. A second semiconductor device is formed in the compound semiconductor layer. The second semiconductor device includes: a first electrode in contact with a first region of the compound semiconductor layer; a second electrode in contact with a second region of the compound semiconductor layer; and a third electrode. The third electrode controls carriers passing in a third region of the compound semiconductor layer disposed between the first region and the second region. A fourth electrode is in electrical contact with the second portion of the seed layer.

Abstract: A semiconductor structure having a substrate, a seed layer over the substrate; a silicon layer disposed on the seed layer; a transistor device in the silicon layer; a III-V device disposed on the seed layer; and a plurality of electrical contacts, each one of the electrical contacts having a layer of TiN or TaN and a layer of copper or aluminum on the layer of TaN or TiN, one of the electrical contacts being electrically connected to the transistor and another one of the electrical contacts being electrically connected to the III-V device.

Abstract: A semiconductor structure, comprising: a substrate; a seed layer over an upper surface of the substrate; a semiconductor layer disposed over the seed layer; a transistor device in the semiconductor layer; wherein the substrate has an aperture therein, such aperture extending from a bottom surface of the substrate and terminating on a bottom surface of the seed layer; and an opto-electric structure disposed on the bottom surface of the seed layer.