Patents by Inventor John P. Franz

John P. Franz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040216911
    Abstract: A system and method for managing electric cables. A cable arm is utilized to contain cables running to an electronic device. The cable arm having a mounting bracket that enables movement between at least two vertical positions relative to a base bracket is thus selectively moveable between a plurality of positions to permit access to the electronic device.
    Type: Application
    Filed: May 1, 2003
    Publication date: November 4, 2004
    Inventors: John P. Franz, Arthur G. Volkmann, David L. Vaughn
  • Publication number: 20040174681
    Abstract: An assembly comprising a circuit board, a socket, and an electronic device. The socket is connected to the circuit board and comprises a surface having a plurality of receptacles into which are disposed a plurality of connector pins from the electronic device. A heat sink is in thermal contact with the electronic device and has a footprint extending beyond both the electronic device and the socket. A locking lever pivotally connects to an arm extending from the socket to a position outside of the footprint of the heat sink.
    Type: Application
    Filed: March 22, 2004
    Publication date: September 9, 2004
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: John P. Franz, Wade David Vinson
  • Publication number: 20040118584
    Abstract: Embodiments of the present invention overcome the deficiencies of the prior art by providing a tool-less, lever actuated, robust yet tolerant, high load delivery, low-profile component retention assembly for coupling components together. The assembly may comprise a plate and a lever coupled to the plate.
    Type: Application
    Filed: December 19, 2002
    Publication date: June 24, 2004
    Inventors: John P. Franz, Wade D. Vinson, Joseph R. Allen, David W. Deis
  • Patent number: 6724628
    Abstract: A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: April 20, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John P. Franz, Wade David Vinson
  • Publication number: 20030117777
    Abstract: A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.
    Type: Application
    Filed: December 26, 2001
    Publication date: June 26, 2003
    Inventors: John P. Franz, Wade David Vinson