Abstract: A portable testing apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board. Included is a housing assembly having a size and shape to simulate an integrated circuit assembly to be tested; a loading element coupled for movement relative to the housing assembly and engageable with a load detecting system for transferring forces thereto in response to forces applied by a force applying apparatus; an interposer which mates the housing assembly to a circuit board; and, a load detecting system associated with the housing assembly for providing signals representative of characteristics of loading forces applied thereto by a force applying apparatus, whereby the load delivery characteristics of a force applying apparatus can be determined. A method of testing is also provided.

Abstract: A heating and cooling apparatus to be applied to an object to control the temperature of the object. A number of thermoelectric modules are adapted to be positioned in contact with the object in a pattern. A voltage source is adapted to apply a voltage to the thermoelectric modules to cause a temperature change in each thermoelectric module so as to control the temperature of the object in accordance with the pattern and with the voltage applied to thermoelectric modules.

Abstract: A portable testing apparatus operable with a force applying apparatus for testing loading characteristics on an integrated circuit assembly coupled to a circuit board. Included is a housing assembly having a size and shape to simulate an integrated circuit assembly to be tested; a loading element coupled for movement relative to the housing assembly and engageable with a load detecting system for transferring forces thereto in response to forces applied by a force applying apparatus; an interposer which mates the housing assembly to a circuit board; and, a load detecting system associated with the housing assembly for providing signals representative of characteristics of loading forces applied thereto by a force applying apparatus, whereby the load delivery characteristics of a force applying apparatus can be determined. A method of testing is also provided.

Abstract: A livestock information system (10) for gathering information relating to livestock, such as calves, and making that information available for a variety of purposes. The system broadly comprises one or more site databases (12) each accessible by one or more site terminals (14) and a central database (16) for storing information relating to each of a plurality of calves (18). The site databases (12) preferably store information about each calf (18) collected through the site terminals (14). The site terminals (14) preferably include or connect to a scanner (20) to scan each of a plurality of unique tags (22) attached to one of the calves (18) and an input device to enter information about each calf (24). The information is preferably gathered frequently and made available even after the calves (18) have been slaughtered. Thus, owners, retailers, consumers, and other interested parties may learn about meat products they purchase.

Abstract: A heating and cooling apparatus to be applied to an object to control the temperature of the object. A number of thermoelectric modules are adapted to be positioned in contact with the object in a pattern. A voltage source is adapted to apply a voltage to the thermoelectric modules to cause a temperature change in each thermoelectric module so as to control the temperature of the object in accordance with the pattern and with the voltage applied to thermoelectric modules.

Abstract: Computational method for the design of a calculated drug space and for the use of such drug space to identify focused screening libraries for drug discovery, as well as drugs identified by the same.

Abstract: High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling.

Abstract: A vacuum pump of the scroll-type has a housing, a first fixed scroll member having an end plate and an involute spiral wrap attached thereto and a second orbital scroll member having an end plate and an involute spiral wrap attached thereto. The scroll members are arranged in the housing such that their respective wraps intermesh so that on orbital movement of the second scroll member relative to the first scroll member a volume of gas will be trapped and urged from one end of the wraps to the other end. A shaft for driving the second scroll member and wherein a member is provided which is adapted to separate the vacuum space in the housing from the shaft and also to prevent the second scroll member from rotating the said member being made from a polymer material.

Abstract: A multichip module subassembly is disclosed which provides for a heatsink, a thermal interface, a module cap upon which a multichip module is mounted, a land grid array interposer, and an assembly cover. The module cap has shimmed load posts and adjustable brackets for precise alignment and loading of the interposer onto the module. The cover may have a springplate for precise preloading of the interposer onto the multichip module for transportation. The multichip module subassembly is easily used as a field replaceable unit.

Abstract: An apparatus and method are disclosed to provide heat pipe cooling for semiconductor chips mounted on a module. Each chip is provided its own heat pipe for cooling. A piston on the end of each heat pipe is loaded against each chip with a predetermined force without the need for counting turns of a screw or use of torque measurement tools. Each heat pipe draws heat away from the chip it is loaded against, carrying the heat to a heat sink for dissipation into the ambient. A large multichip module can be loaded against a land grid array interposer with uniform loading of the interposer. This interposer loading is accomplished independently of the loading of the heat pipes against the chips.

Abstract: This invention features methods of biphasic synthesis for synthesizing combinatorial libraries and combinatorial libraries of chemical compounds utilizing the template, and combinatorial libraries of chemical compounds formed by the methods of this invention.

Abstract: A heatsink grounding mechanism and an associated circuit card and computer system. The circuit card includes a printed circuit board to an integrated circuit module is attached. A heatsink is positioned in contact with or in close proximity to the integrated circuit module package. A heatsink grounding piece of the grounding mechanism is utilized to ground the heatsink. The grounding piece includes a substantially rectangular and conductive grounding piece ring that defines an aperture. The dimensions are suitable for receiving and circumventing the integrated circuit module. The grounding piece includes a set of semi-rigid conductive spring arms that extend away from the grounding piece ring. The spring arms are positioned and oriented such that termination points of the spring arms contact grounding pads on the printed circuit board when the grounding piece is compressed between the heatsink and the circuit board.

Abstract: This invention features methods of biphasic synthesis for synthesizing combinatorial libraries and combinatorial libraries of chemical compounds utilizing the template, and combinatorial libraries of chemical compounds formed by the methods of this invention.

Abstract: A mechanism has a subassembly that contains a microprocessor. The mechanism allows the microprocessor to be easily installed through frontal or rear access into a rack drawer and subsequently docked into a receiving assembly. The docking mechanism is multi-axis in that installation of the subassembly occurs along a single axis, but docking of the microprocessor occurs along an axis that is normal to the installation axis. Actuation of the installation mechanism is accomplished with a front-to-rear motion which sequentially provides a power connection to the microprocessor and displaces it in a vertical motion. This vertical motion registers and mates the microprocessor with the assembly. The microprocessor is preloaded in its final latched position to restrain it from shock and vibration events while supporting the assembly in a fixed and stable position.

Abstract: An apparatus and a method of mounting an array of different heatsinks to a closely packed array of processors, cache controller devices, and any other type of data processing element utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the comers where the devices are attached to the printed circuit board.

Abstract: This invention relates to certain 3-aminomethylpyrrolidine derivatives of Formula (I): ##STR1## that are CCR-3 receptor antagonists, pharmaceutical compositions containing them, methods for their use and methods for preparing these compounds.

Abstract: A process for minimizing evaporator scaling during the recovery of liquids and solids from the aqueous effluent discharged during a partial oxidation gasification, wherein the aqueous effluent contains ammonium chloride (NH.sub.4 Cl). The aqueous effluent is evaporated to produce a distillate water and a brine having an NH.sub.4 Cl concentration of about 10 to 60 weight percent. The brine can be further concentrated and ammonium chloride crystals are recovered. The distillate water is recycled to the gasification reaction. No effluent discharges to the environment.

Abstract: A door lock system (20) comprising a door frame (22) mounted in an entry (24) of a building (26). An entrance door (28) is hinged at (30) along one side edge to the door frame (22). The entrance door (28) has a standard door lock unit (32) to engage with the door frame (22). A structure (34) is built into the entrance door (28), for engaging with the door frame (22) at a number of other locations thereabout, so that the entrance door (28) will be strengthened against a forced entry. An assemblage (36) is built into the entrance door (28), for retaining the engaging structure (34) to the door frame (22) in a releasing manner. When a person wants to open the entrance door (28) with the stand and a door lock unit (32), the retaining assemblage (36) must first be deactivated to allow the engaging structure (34) to disengage from the door frame (22).

Abstract: The present invention relates to a method for minimizing hydrogen halide corrosion in quench gasifier during the non-catalytic partial oxidation reaction of a halogen-containing hydrocarbonaceous feed, to produce a hydrogen halide-containing synthesis gas, finely divided particulate solids, and a nontoxic slag. The hydrogen halide-containing synthesis gas is contacted with water in the quench zone of the gasifier. The quench water contains a neutralizing agent, in excess of the amount necessary to neutralize hydrogen halide acids present therein, to thereby form halide salts. The quench water containing the halide salts is purified to recover the halide salts. The salt-free water is essentially environmentally non-toxic and can either be recycled to the process or discarded in conformity with environmental regulations.