Abstract: A method of forming an electrically conductive path through a portion of a semiconductor material, wherein the semiconductor material abuts a substrate and wherein the semiconductor material comprises multiple electronic devices, involves forming an annular trench in the portion, forming an island of semiconductor material within the annular trench, filling the annular trench with an electrically insulating material, removing at least some of the island of semiconductor material to create an exposed inner surface, metalizing at least a portion of the exposed inner surface with a material, and thinning an outer surface side of the substrate until at least the material from the metalizing is exposed on the outer surface side of the substrate.

Abstract: A semiconductor chip, having IC pads, the semiconductor chip having a device, electrically connected to at least one electrical contact through the IC pad, the electrical contact having a height and a cross sectional profile, through the height, configured to facilitate penetration of at least a portion of the electrical contact into a malleable contact on a second semiconductor chip.

Abstract: A method of joining contacts on two chips, each having multiple contacts, to each other involves maintaining a first of the chips at a first temperature, the first of the chips having a rigid electrical contact thereon, bringing a second chip, having an electrical contact that is malleable with respect to the rigid contact and matingly corresponding thereto, into contact with the first such that the corresponding rigid and malleable contacts are brought together, locally raising the second of the chips to a local temperature that is sufficiently high to cause material of the rigid and malleable contact to interdiffuse, interpenetrate or both, but below both a temperature that would cause the material to become liquidus and a fuse temperature, and allowing the second of the chips to cool to at least the first temperature.

Abstract: A method of electrically joining a first contact on a first wafer with a second contact on a second wafer, the first contact, a rigid material, and the second contact, a material that is malleable relative to the rigid material, such that when brought together the rigid material will penetrate the malleable material, the rigid and malleable materials both being electrically conductive involves bringing the rigid material into contact with the malleable material, applying a force to one of the first contact or the second contact so as to cause the rigid material to penetrate the malleable material, heating the rigid and malleable material so as to cause the malleable material to soften, and constraining the malleable material to within a pre-specified area.

Abstract: A chip having at least one electrical contact having a first end proximate to the chip and a second end removed from the chip, the second end including a pattern configured to facilitate penetration of the at least one contact into a malleable contact on another chip, the pattern comprising a non-planar surface having a perimeter and a surface area, the surface area being larger than a planar surface of an identical perimeter.

Abstract: A unit has an array of lasers having an emission surface through which beams can be emitted in a substantially vertical direction so as to define an emission side, drive electronics connected to a side opposite to the emission side of the array of lasers, and an array of modulators, located on the emission side of the array of lasers and connected to the drive electronics.

Abstract: An apparatus to accurately hold an optical fiber within a commercial fiber optic connector. The connector has a first high precision slice having multiple holes of a first area and a first alignment opening and a second high precision slice having multiple holes of a second area and a second alignment opening. The holes of the first high precision slice are arranged relative to the first alignment opening so that, when the second high precision slice and the first high precision slice are juxtaposed with one another and the first alignment opening and the second alignment opening are aligned, the holes of the first high precision slice and the holes of the second high precision slice will be offset relative to each other and will define an opening having an area less than a smaller of the first area and second area. The opening is capable of closely constraining an optical fiber inserted therethrough.

Abstract: A unit is made up of an electronic integrated circuit, a MEMS device, and an active optical device, electrically coupled to the electronic integrated circuit and located between the electronic integrated circuit and the MEMS device. Tthe MEMS device is electrically coupled to the electronic integrated circuit and positioned to affect the behavior of light, relative to the active optical device, based upon the position of an element in the MEMS device as controlled by the electronic integrated circuit.

Abstract: A multi-wavelength optical communication system includes a number of emitters each of which emits radiation at a different wavelength; a plurality of the detectors each of which senses radiation at a different wavelength corresponding to the radiation from one of the emitters and a shared waveguide including a scattering medium to transmit emitted radiation to the detectors.

Abstract: A long-throw, tight focussing optical coupler has a first passive optical element capable of coupling light between an optical source and an optical destination and a second passive optical element, capable of coupling light between the optical source and the optical destination, located between the first passive optical element and one of the optical source or the optical destination such that, a light beam from the optical source will be transferred to the optical destination when the optical source and optical destination are spaced apart by a distance.

Abstract: A multi-wavelength optical communication system includes a number of emitters each of which emits radiation at a different wavelength; a plurality of the detectors each of which senses radiation at a different wavelength corresponding to the radiation from one of the emitters and a shared waveguide including a scattering medium to transmit emitted radiation to the detectors.

Abstract: A method of integrating a chip with a topside active optical chip is described. The topside active optical chip has at least one optical laser device, having an active side including an optically active region, a laser cavity having a height, an optically inactive region, a bonding side opposite the active side, and a device thickness. The method involves bonding the optical chip to the electronic chip; applying a substrate to the active side, the substrate having a substrate thickness over the active region in the range of between a first amount and a second amount, and applying an anti-reflection without a special patterning or distinguishing between the at least one optical laser device and any other device. A hybrid electro-optical chip is also described as having an electronic chip; and a topside active optical chip. The hybrid electro-optical chip having been created by one of the methods herein. A module is also described.

Abstract: A method of making A fiber optic connector adapted to receive a fiber bearing unit involves coupling at least one high precision piece, having holes configured to accept an array of optical fibers, to a low precision piece to form a unit, inserting optical fibers into the unit and housing the unit within a fiber optic connector housing. A commercial fiber optic connector of a style constructed to accept a ferrule-like unit therein has a connector housing, at least 36 optical fibers, a low precision piece, and at least one high precision slice having at least 36 fiber holes each adapted to accept one of the optical fibers, the low precision piece and the at least one high precision slice being contained substantially within the connector housing and forming the ferrule like unit.

Abstract: An apparatus for use in a commercial fiber optic connector is made up of an assembly of a set of slices. Each of the slices having multiple through holes of a specified arrangement. At least some of the through holes on any two adjoining slices are aligned with respect to each other so as to define a conduit between them. A transmission medium is within the holes. A method of making a fiber optic connector adapted to receive a fiber bearing unit is also described. The method involves coupling at least two high precision pieces together, the at least two high precision pieces having holes configured with an optical medium inserted therein after the coupling and cured to form a waveguide structure, coupling the at least two high precision pieces to a low precision piece to form a unit, and housing the unit within a fiber optic connector housing.

Abstract: A detector is disposed on the passive side of a laser to detect photon leakage through the passive side mirror and measure as current created in the detector via a Schottkey contact.

Abstract: An optical transmission device configured as a central node, wherein each central node has dedicated pixels for receiving data and transmitting optical data so destination addressing is not required. The network is configured such that transmission on any particular receiver reserved pixels results in data being sent to a predetermined node. In particular, the star topology is configured as a receiver reserved scheme. The device is formed by constructing central node of transmitters and receivers that are attached to a silicon substrate with a processing means, and the optical interface to the transmitters and detectors on the central node establish a one-to-one correspondence with an individual fiber optic cable. The fiber optic cables are reconfigurable to different topologies or interconnections as each fiber optic cable has a known destination on the central node. Various topologies are possible using a star node as the building block.

Abstract: A ferrule has a body, peripherally dimensioned for receipt within a commercially available fiber optic connector, the body has a forward portion comprising a front side and a rear side, the front side defining a face of the ferrule, the rear side defining an inner surface. The forward portion has a large format array of fiber holes, each of the fiber holes in the array extending between the front side and the rear side and being sized to accept an optical fiber inserted therein, and the forward portion having a thickness, T, less than 3000 microns but at least a minimum thickness sufficient to support optical fibers inserted into the fiber holes. An optical connector, having a ferrule, and a fiber optic cable assembly are also described.

Abstract: An optical unit has multiple optical devices, a collimated coupler disposed relative to the multiple optical devices so that laser light can be transferred between at least two of the multiple optical devices and the collimated coupler without crosstalk, and a fused glass collimator, disposed within the collimated coupler, having multiple optical fibers arranged in a predetermined arrangement relative to the multiple optical devices so that the number of optical fibers is always equal or greater than the number of optical devices on a use basis.

Abstract: An apparatus for use in a commercial fiber optic connector is made up of an assembly of a set of slices. Each of the slices having multiple through holes of a specified arrangement. At least some of the through holes on any two adjoining slices are aligned with respect to each other so as to define a conduit between them. A transmission medium is within the holes. A method of making a fiber optic connector adapted to receive a fiber bearing unit is also described. The method involves coupling at least two high precision pieces together, the at least two high precision pieces having holes configured with an optical medium inserted therein after the coupling and cured to form a waveguide structure, coupling the at least two high precision pieces to a low precision piece to form a unit, and housing the unit within a fiber optic connector housing.

Abstract: An apparatus to accurately hold an optical fiber within a commercial fiber optic connector. The connector has a first high precision slice having multiple holes of a first area and a first alignment opening and a second high precision slice having multiple holes of a second area and a second alignment opening. The holes of the first high precision slice are arranged relative to the first alignment opening so that, when the second high precision slice and the first high precision slice are juxtaposed with one another and the first alignment opening and the second alignment opening are aligned, the holes of the first high precision slice and the holes of the second high precision slice will be offset relative to each other and will define an opening having an area less than a smaller of the first area and second area. The opening is capable of closely constraining an optical fiber inserted therethrough.