Patents by Inventor John Vu
John Vu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230385507Abstract: Systems, apparatuses and methods may provide for technology that receives parameter results and scores of one or more local sessions with respect to subcircuit components in a bounded area, aggregates the parameter results and scores, and generates a global placement model based on an output of the aggregated parameter results and scores.Type: ApplicationFiled: May 31, 2023Publication date: November 30, 2023Inventors: Jianfang Zhu, Adam Norman, Min Suet Lim, Miaomiao Ma, Mackenzie Norman, John Vu, Ching Leong Ooi, Eng Same Tan, Luis Carlos Alvarez Mata
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Publication number: 20230363763Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include a first permeable shell and a second permeable shell, where the second permeable shell sits within an interior cavity of the first permeable shell. The first and second permeable shells may each be made from a plurality of elongate filaments that are woven together to form a mesh. The mesh of the first permeable shell may have a larger mesh density and be softer than the mesh of the second permeable shell.Type: ApplicationFiled: July 13, 2023Publication date: November 16, 2023Inventors: John Vu, Nathan Luu, Todd Hewitt, Hung P. Tran
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Patent number: 11732183Abstract: Compositions and methods of fracturing including a hydrophobic rendered proppant or a proppant slurry and a fracturing fluid including an aqueous base fluid, a viscosifying agent or mixture of viscosifying agents, and an enhancing proppant suspending composition including an aldehyde, a mixture of aldehydes, a ketone, a mixture of ketones, or mixtures thereof, and optionally a crosslinking agent or a mixture of crosslinking agents.Type: GrantFiled: May 24, 2022Date of Patent: August 22, 2023Assignee: NexTier Completion Solutions Inc.Inventors: Sarkis Kakadjian, John Vu, Vidya Sagar Bammidi
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Publication number: 20230258055Abstract: A trigger including a carrier, a shuttle movably disposed on the carrier, an energy member disposed between the carrier and the shuttle, a degrade-on-demand trip member disposed to maintain potential energy in the energy member until activated. A method for operating a downhole tool including sending a signal to the trip member of the trigger, degrading the trip member, converting potential energy stored in the energy member from potential energy to kinetic energy, and actuating the downhole tool with the shuttle. A wellbore system including a borehole in a subsurface formation, a string in the borehole, a trigger disposed within or as a part of the string.Type: ApplicationFiled: February 11, 2022Publication date: August 17, 2023Applicant: Baker Hughes Oilfield Operations LLCInventors: Zhihui Zhang, Guijun Deng, John Vu, Emerson Nunez
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Patent number: 11702903Abstract: An actuator for another tool includes a housing that is either modular and attachable to the tool or may be incorporated into the another tool. Within the housing is a biasing member that may be retained in a compressed condition by a retainer. A trigger holding the retainer, the trigger having a trigger head anchorable to the housing, a separation neck having a helical groove therein and a trigger body, the body being connected to the retainer, the trigger being defeatable on command.Type: GrantFiled: April 6, 2021Date of Patent: July 18, 2023Assignee: BAKER HUGHES OILFIELD OPERATIONS LLCInventors: Daniel Sequera, John Vu, Daniel Ewing
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Publication number: 20230114169Abstract: Devices and methods for treatment of a patient’s vasculature are described. Embodiments may include a permeable implant having a radially constrained state configured for delivery within a catheter lumen, an expanded state, and a plurality of elongate filaments that are woven together. The implant may include a cavity in a proximal section that may optionally house embolic material, such as coils. Alternatively, the implant may have an expanded preset shape that is different than an expanded preset shape that is assumed after deployment in an aneurysm. The expanded preset shape may be frustoconical. Alternatively, the implant may include an outer skirt coupled to a proximal section of the permeable implant.Type: ApplicationFiled: August 26, 2022Publication date: April 13, 2023Inventors: Todd Hewitt, Parker Milhous, Hung P. Tran, John Vu, Hussain S. Rangwala, Hiroshi Shiono
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Publication number: 20220372365Abstract: Compositions and methods of fracturing including a hydrophobic rendered proppant or a proppant slurry and a fracturing fluid including an aqueous base fluid, a viscosifying agent or mixture of viscosifying agents, and an enhancing proppant suspending composition including an aldehyde, a mixture of aldehydes, a ketone, a mixture of ketones, or mixtures thereof, and optionally a crosslinking agent or a mixture of crosslinking agents.Type: ApplicationFiled: May 24, 2022Publication date: November 24, 2022Applicant: NexTier Completion Solutions Inc.Inventors: Sarkis Kakadjian, John Vu, Vidya Sagar Bammidi
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Publication number: 20220316298Abstract: An actuator including a housing, a biasing member within the housing, a retainer configured to retain the biasing member in a biased position, and a trigger holding the retainer, the trigger being defeatable on command.Type: ApplicationFiled: April 6, 2021Publication date: October 6, 2022Applicant: Baker Hughes Oilfield Operations LLCInventors: Daniel Sequera, John Vu, Daniel Ewing
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Publication number: 20220257260Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include an implant having multiple mesh layers. A first and second layer of the implant may be formed by folding over a single mesh and the third layer may be formed from a different mesh. The first, second, and third layers may be either a stasis or a structural layer and may be arranged in different orders. Embodiments may also include structures to assist in the expansion of the device. These structures may include an expandable loop or reinforcing finger extensions. Embodiments may also include a corrugation or ridge around a middle section of the implant to assist in deployment.Type: ApplicationFiled: December 14, 2021Publication date: August 18, 2022Inventors: Todd Hewitt, Joseph Emery, Hung Tran, John Vu, Karishma Desai, Parker Milhous
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Publication number: 20220257258Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include a permeable implant such as a permeable shell or mesh having a radially constrained state configured for delivery within a catheter lumen, an expanded state, and a plurality of elongate filaments that are woven together. The permeable implant may include a stiffer proximal portion that is configured to sit at the neck of an aneurysm. The stiffer proximal portion may include additional mesh layers on either the inside or the outside of a first permeable shell. The distal portion of the device may be softer and deformable.Type: ApplicationFiled: April 27, 2022Publication date: August 18, 2022Inventors: Todd Hewitt, Parker Milhous, Joseph Emery, Hung Tran, John Vu, Hussain S. Rangwala, William R. Patterson
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Patent number: 11390797Abstract: Compositions and methods of fracturing including a hydrophobic rendered proppant or a proppant slurry and a fracturing fluid including an aqueous base fluid, a viscosifying agent or mixture of viscosifying agents, and an enhancing proppant suspending composition including an aldehyde, a mixture of aldehydes, a ketone, a mixture of ketones, or mixtures thereof, and optionally a crosslinking agent or a mixture of crosslinking agents.Type: GrantFiled: April 24, 2020Date of Patent: July 19, 2022Assignee: NexTier Completion Solutions Inc.Inventors: Sarkis Kakadjian, John Vu, Vidya Sagar Bammidi
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Patent number: 11317921Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include a permeable implant such as a permeable shell or mesh having a radially constrained state configured for delivery within a catheter lumen, an expanded state, and a plurality of elongate filaments that are woven together. The permeable implant may include a stiffer proximal portion that is configured to sit at the neck of an aneurysm. The stiffer proximal portion may include additional mesh layers on either the inside or the outside of a first permeable shell. The distal portion of the device may be softer and deformable.Type: GrantFiled: March 12, 2020Date of Patent: May 3, 2022Assignee: SEQUENT MEDICAL, INC.Inventors: Todd Hewitt, Parker Milhous, Joseph Emery, Hung Tran, John Vu, Hussain S. Rangwala, William R. Patterson
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Publication number: 20210282789Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include a first permeable shell and a second permeable shell, where the second permeable shell sits within an interior cavity of the first permeable shell. The first and second permeable shells may each be made from a plurality of elongate filaments that are woven together to form a mesh. The mesh of the first permeable shell may have a larger mesh density and be softer than the mesh of the second permeable shell.Type: ApplicationFiled: March 10, 2021Publication date: September 16, 2021Inventors: John Vu, Nathan Luu, Todd Hewitt, Hung P. Tran
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Patent number: 10857647Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves include a series of biased grooves connecting a pair of adjacent radial feeder grooves. A majority of the biased grooves have either an inward bias toward the center or an outward bias toward the outer edge of the polishing pad. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad at a fixed distance from the center of the polishing pad increases polishing or planarizing removal rate of the wafer.Type: GrantFiled: October 5, 2017Date of Patent: December 8, 2020Assignee: Rohm and Haas Electronic Materials CMP HoldingsInventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
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Patent number: 10861702Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad, the rotating polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The polishing regions are circular sectors defined by two adjacent radial feeder grooves. The radial feeder grooves extend from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad adjusts polishing by either increasing or decreasing residence time of the polishing fluid under the wafer.Type: GrantFiled: October 5, 2017Date of Patent: December 8, 2020Assignee: Rohm and Haas Electronic Materials CMP HoldingsInventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
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Patent number: 10857648Abstract: The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix and radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region includes a series of spaced non-isosceles trapezoid groove structures having parallel base segments connecting two adjacent radial feeder grooves to form leg segments. The series of non-isosceles trapezoid groove structures extend from adjacent the outer edge toward the center of the polishing pad with the perimeter of the series of trapezoid structures also being a trapezoid.Type: GrantFiled: October 5, 2017Date of Patent: December 8, 2020Assignee: Rohm and Haas Electronic Materials CMP HoldingsInventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
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Publication number: 20200381258Abstract: The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.Type: ApplicationFiled: August 21, 2020Publication date: December 3, 2020Inventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
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Publication number: 20200354627Abstract: Compositions and methods of fracturing including a hydrophobic rendered proppant or a proppant slurry and a fracturing fluid including an aqueous base fluid, a viscosifying agent or mixture of viscosifying agents, and an enhancing proppant suspending composition including an aldehyde, a mixture of aldehydes, a ketone, a mixture of ketones, or mixtures thereof, and optionally a crosslinking agent or a mixture of crosslinking agents.Type: ApplicationFiled: April 24, 2020Publication date: November 12, 2020Applicant: NexTier Completion Solutions Inc.Inventors: Sarkis Kakadjian, John Vu, Vidya Sagar Bammidi
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Publication number: 20200289126Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include a permeable implant such as a permeable shell or mesh having a radially constrained state configured for delivery within a catheter lumen, an expanded state, and a plurality of elongate filaments that are woven together. The permeable implant may include a stiffer proximal portion that is configured to sit at the neck of an aneurysm. The stiffer proximal portion may include additional mesh layers on either the inside or the outside of a first permeable shell. The distal portion of the device may be softer and deformable.Type: ApplicationFiled: March 12, 2020Publication date: September 17, 2020Inventors: Todd Hewitt, Parker Milhous, Joseph Emery, Hung Tran, John Vu, Hussain S. Rangwala, William R. Patterson
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Patent number: 10777418Abstract: The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.Type: GrantFiled: October 5, 2017Date of Patent: September 15, 2020Assignee: Rohm and Haas Electronic Materials CMP Holdings, IInventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack