Patents by Inventor John Vu

John Vu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230385507
    Abstract: Systems, apparatuses and methods may provide for technology that receives parameter results and scores of one or more local sessions with respect to subcircuit components in a bounded area, aggregates the parameter results and scores, and generates a global placement model based on an output of the aggregated parameter results and scores.
    Type: Application
    Filed: May 31, 2023
    Publication date: November 30, 2023
    Inventors: Jianfang Zhu, Adam Norman, Min Suet Lim, Miaomiao Ma, Mackenzie Norman, John Vu, Ching Leong Ooi, Eng Same Tan, Luis Carlos Alvarez Mata
  • Publication number: 20230363763
    Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include a first permeable shell and a second permeable shell, where the second permeable shell sits within an interior cavity of the first permeable shell. The first and second permeable shells may each be made from a plurality of elongate filaments that are woven together to form a mesh. The mesh of the first permeable shell may have a larger mesh density and be softer than the mesh of the second permeable shell.
    Type: Application
    Filed: July 13, 2023
    Publication date: November 16, 2023
    Inventors: John Vu, Nathan Luu, Todd Hewitt, Hung P. Tran
  • Patent number: 11732183
    Abstract: Compositions and methods of fracturing including a hydrophobic rendered proppant or a proppant slurry and a fracturing fluid including an aqueous base fluid, a viscosifying agent or mixture of viscosifying agents, and an enhancing proppant suspending composition including an aldehyde, a mixture of aldehydes, a ketone, a mixture of ketones, or mixtures thereof, and optionally a crosslinking agent or a mixture of crosslinking agents.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: August 22, 2023
    Assignee: NexTier Completion Solutions Inc.
    Inventors: Sarkis Kakadjian, John Vu, Vidya Sagar Bammidi
  • Publication number: 20230258055
    Abstract: A trigger including a carrier, a shuttle movably disposed on the carrier, an energy member disposed between the carrier and the shuttle, a degrade-on-demand trip member disposed to maintain potential energy in the energy member until activated. A method for operating a downhole tool including sending a signal to the trip member of the trigger, degrading the trip member, converting potential energy stored in the energy member from potential energy to kinetic energy, and actuating the downhole tool with the shuttle. A wellbore system including a borehole in a subsurface formation, a string in the borehole, a trigger disposed within or as a part of the string.
    Type: Application
    Filed: February 11, 2022
    Publication date: August 17, 2023
    Applicant: Baker Hughes Oilfield Operations LLC
    Inventors: Zhihui Zhang, Guijun Deng, John Vu, Emerson Nunez
  • Patent number: 11702903
    Abstract: An actuator for another tool includes a housing that is either modular and attachable to the tool or may be incorporated into the another tool. Within the housing is a biasing member that may be retained in a compressed condition by a retainer. A trigger holding the retainer, the trigger having a trigger head anchorable to the housing, a separation neck having a helical groove therein and a trigger body, the body being connected to the retainer, the trigger being defeatable on command.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: July 18, 2023
    Assignee: BAKER HUGHES OILFIELD OPERATIONS LLC
    Inventors: Daniel Sequera, John Vu, Daniel Ewing
  • Publication number: 20230114169
    Abstract: Devices and methods for treatment of a patient’s vasculature are described. Embodiments may include a permeable implant having a radially constrained state configured for delivery within a catheter lumen, an expanded state, and a plurality of elongate filaments that are woven together. The implant may include a cavity in a proximal section that may optionally house embolic material, such as coils. Alternatively, the implant may have an expanded preset shape that is different than an expanded preset shape that is assumed after deployment in an aneurysm. The expanded preset shape may be frustoconical. Alternatively, the implant may include an outer skirt coupled to a proximal section of the permeable implant.
    Type: Application
    Filed: August 26, 2022
    Publication date: April 13, 2023
    Inventors: Todd Hewitt, Parker Milhous, Hung P. Tran, John Vu, Hussain S. Rangwala, Hiroshi Shiono
  • Publication number: 20220372365
    Abstract: Compositions and methods of fracturing including a hydrophobic rendered proppant or a proppant slurry and a fracturing fluid including an aqueous base fluid, a viscosifying agent or mixture of viscosifying agents, and an enhancing proppant suspending composition including an aldehyde, a mixture of aldehydes, a ketone, a mixture of ketones, or mixtures thereof, and optionally a crosslinking agent or a mixture of crosslinking agents.
    Type: Application
    Filed: May 24, 2022
    Publication date: November 24, 2022
    Applicant: NexTier Completion Solutions Inc.
    Inventors: Sarkis Kakadjian, John Vu, Vidya Sagar Bammidi
  • Publication number: 20220316298
    Abstract: An actuator including a housing, a biasing member within the housing, a retainer configured to retain the biasing member in a biased position, and a trigger holding the retainer, the trigger being defeatable on command.
    Type: Application
    Filed: April 6, 2021
    Publication date: October 6, 2022
    Applicant: Baker Hughes Oilfield Operations LLC
    Inventors: Daniel Sequera, John Vu, Daniel Ewing
  • Publication number: 20220257260
    Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include an implant having multiple mesh layers. A first and second layer of the implant may be formed by folding over a single mesh and the third layer may be formed from a different mesh. The first, second, and third layers may be either a stasis or a structural layer and may be arranged in different orders. Embodiments may also include structures to assist in the expansion of the device. These structures may include an expandable loop or reinforcing finger extensions. Embodiments may also include a corrugation or ridge around a middle section of the implant to assist in deployment.
    Type: Application
    Filed: December 14, 2021
    Publication date: August 18, 2022
    Inventors: Todd Hewitt, Joseph Emery, Hung Tran, John Vu, Karishma Desai, Parker Milhous
  • Publication number: 20220257258
    Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include a permeable implant such as a permeable shell or mesh having a radially constrained state configured for delivery within a catheter lumen, an expanded state, and a plurality of elongate filaments that are woven together. The permeable implant may include a stiffer proximal portion that is configured to sit at the neck of an aneurysm. The stiffer proximal portion may include additional mesh layers on either the inside or the outside of a first permeable shell. The distal portion of the device may be softer and deformable.
    Type: Application
    Filed: April 27, 2022
    Publication date: August 18, 2022
    Inventors: Todd Hewitt, Parker Milhous, Joseph Emery, Hung Tran, John Vu, Hussain S. Rangwala, William R. Patterson
  • Patent number: 11390797
    Abstract: Compositions and methods of fracturing including a hydrophobic rendered proppant or a proppant slurry and a fracturing fluid including an aqueous base fluid, a viscosifying agent or mixture of viscosifying agents, and an enhancing proppant suspending composition including an aldehyde, a mixture of aldehydes, a ketone, a mixture of ketones, or mixtures thereof, and optionally a crosslinking agent or a mixture of crosslinking agents.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: July 19, 2022
    Assignee: NexTier Completion Solutions Inc.
    Inventors: Sarkis Kakadjian, John Vu, Vidya Sagar Bammidi
  • Patent number: 11317921
    Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include a permeable implant such as a permeable shell or mesh having a radially constrained state configured for delivery within a catheter lumen, an expanded state, and a plurality of elongate filaments that are woven together. The permeable implant may include a stiffer proximal portion that is configured to sit at the neck of an aneurysm. The stiffer proximal portion may include additional mesh layers on either the inside or the outside of a first permeable shell. The distal portion of the device may be softer and deformable.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: May 3, 2022
    Assignee: SEQUENT MEDICAL, INC.
    Inventors: Todd Hewitt, Parker Milhous, Joseph Emery, Hung Tran, John Vu, Hussain S. Rangwala, William R. Patterson
  • Publication number: 20210282789
    Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include a first permeable shell and a second permeable shell, where the second permeable shell sits within an interior cavity of the first permeable shell. The first and second permeable shells may each be made from a plurality of elongate filaments that are woven together to form a mesh. The mesh of the first permeable shell may have a larger mesh density and be softer than the mesh of the second permeable shell.
    Type: Application
    Filed: March 10, 2021
    Publication date: September 16, 2021
    Inventors: John Vu, Nathan Luu, Todd Hewitt, Hung P. Tran
  • Patent number: 10857647
    Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves include a series of biased grooves connecting a pair of adjacent radial feeder grooves. A majority of the biased grooves have either an inward bias toward the center or an outward bias toward the outer edge of the polishing pad. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad at a fixed distance from the center of the polishing pad increases polishing or planarizing removal rate of the wafer.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: December 8, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings
    Inventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
  • Patent number: 10861702
    Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad, the rotating polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The polishing regions are circular sectors defined by two adjacent radial feeder grooves. The radial feeder grooves extend from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad adjusts polishing by either increasing or decreasing residence time of the polishing fluid under the wafer.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: December 8, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings
    Inventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
  • Patent number: 10857648
    Abstract: The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix and radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region includes a series of spaced non-isosceles trapezoid groove structures having parallel base segments connecting two adjacent radial feeder grooves to form leg segments. The series of non-isosceles trapezoid groove structures extend from adjacent the outer edge toward the center of the polishing pad with the perimeter of the series of trapezoid structures also being a trapezoid.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: December 8, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings
    Inventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
  • Publication number: 20200381258
    Abstract: The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.
    Type: Application
    Filed: August 21, 2020
    Publication date: December 3, 2020
    Inventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack
  • Publication number: 20200354627
    Abstract: Compositions and methods of fracturing including a hydrophobic rendered proppant or a proppant slurry and a fracturing fluid including an aqueous base fluid, a viscosifying agent or mixture of viscosifying agents, and an enhancing proppant suspending composition including an aldehyde, a mixture of aldehydes, a ketone, a mixture of ketones, or mixtures thereof, and optionally a crosslinking agent or a mixture of crosslinking agents.
    Type: Application
    Filed: April 24, 2020
    Publication date: November 12, 2020
    Applicant: NexTier Completion Solutions Inc.
    Inventors: Sarkis Kakadjian, John Vu, Vidya Sagar Bammidi
  • Publication number: 20200289126
    Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include a permeable implant such as a permeable shell or mesh having a radially constrained state configured for delivery within a catheter lumen, an expanded state, and a plurality of elongate filaments that are woven together. The permeable implant may include a stiffer proximal portion that is configured to sit at the neck of an aneurysm. The stiffer proximal portion may include additional mesh layers on either the inside or the outside of a first permeable shell. The distal portion of the device may be softer and deformable.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 17, 2020
    Inventors: Todd Hewitt, Parker Milhous, Joseph Emery, Hung Tran, John Vu, Hussain S. Rangwala, William R. Patterson
  • Patent number: 10777418
    Abstract: The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: September 15, 2020
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, I
    Inventors: John Vu Nguyen, Tony Quan Tran, Jeffrey James Hendron, Jeffrey Robert Stack