Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. The series of biased grooves separate a land area and have inner walls closer to the center and outer walls closer to the outer edge. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations polishes or planarizes the wafer with land areas wet by the overflowing polishing fluid.

Abstract: A bottom hole assembly supports a diverter for landing in an existing multilateral junction. Once landed set down weight allows the BHA to progress through the diverter opening into a main bore, for example. A protective sleeve for the seal assembly lands on a shoulder above the targeted seal bore. Further advancing of the BHA moves the seal assembly out of the protective sleeve that has landed on the shoulder by the polished bore. Once the seals are in position in the bore a treatment can be accomplished. On picking up the seal assembly retracts into the protective sleeve and the BHA engages the diverter to bring the BHA and the diverter out of the borehole at the same time.

Abstract: An adjustable tubular string nose uses axially relatively movable wedge segments to form a variable diameter ring shape using technology described in U.S. Pat. No. 7,128,146 in another context. The nose has a seat around a passage therethrough. After insertion of the nose into a first bore, typically a main bore, the nose is retracted out of the main bore and pressure against a seated bore in the nose expands the nose radially to a degree where re-entry into the main bore is precluded but entry into a lateral bore is still possible. The string advances onto a lateral no-go. This signals surface personnel to pick up and raise pressure to blow the seated ball through the seat to again open the passage in the nose. A seal stack behind the nose in advanced into a lateral seal bore and the treatment can then commence.

Abstract: A method of treating a first bore and at least one second bore connected to the first bore in one downhole trip includes guiding a treating tool including a seal assembly defining and a shroud extending about the seal assembly downhole, guiding the seal assembly and the shroud along a diverter positioned near an intersection of the first bore and the at least one second bore into the at least one second bore, shifting the shroud relative to the seal assembly exposing the seal assembly in the at least one second bore, performing a first treatment in the at least one second bore, positioning the seal assembly and the shroud uphole of the diverter, passing the seal assembly through an opening in the diverter having a diverter opening, and performing a second treatment in the first bore.

Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad, the rotating polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The polishing regions are circular sectors defined by two adjacent radial feeder grooves. The radial feeder grooves extend from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad adjusts polishing by either increasing or decreasing residence time of the polishing fluid under the wafer.

Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves include a series of biased grooves connecting a pair of adjacent radial feeder grooves. A majority of the biased grooves have either an inward bias toward the center or an outward bias toward the outer edge of the polishing pad. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations of the polishing pad at a fixed distance from the center of the polishing pad increases polishing or planarizing removal rate of the wafer.

Abstract: The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix and radial feeder grooves in the polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region includes a series of spaced non-isosceles trapezoid groove structures having parallel base segments connecting two adjacent radial feeder grooves to form leg segments. The series of non-isosceles trapezoid groove structures extend from adjacent the outer edge toward the center of the polishing pad with the perimeter of the series of trapezoid structures also being a trapezoid.

Abstract: The invention provides a method for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The method includes rotating a polishing pad having radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge. Each polishing region includes a series of biased grooves connecting a pair of adjacent radial feeder grooves. The series of biased grooves separate a land area and have inner walls closer to the center and outer walls closer to the outer edge. Pressing and rotating the wafer against the rotating polishing pad for multiple rotations polishes or planarizes the wafer with land areas wet by the overflowing polishing fluid.

Abstract: The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

Abstract: A method of treating a first bore and at least one second bore connected to the first bore in one downhole trip includes guiding a treating tool including a seal assembly defining and a shroud extending about the seal assembly downhole, guiding the seal assembly and the shroud along a diverter positioned near an intersection of the first bore and the at least one second bore into the at least one second bore, shifting the shroud relative to the seal assembly exposing the seal assembly in the at least one second bore, performing a first treatment in the at least one second bore, positioning the seal assembly and the shroud uphole of the diverter, passing the seal assembly through an opening in the diverter having a diverter opening, and performing a second treatment in the first bore.

Abstract: An adjustable tubular string nose uses axially relatively movable wedge segments to form a variable diameter ring shape using technology described in U.S. Pat. No. 7,128,146 in another context. The nose has a seat around a passage therethrough. After insertion of the nose into a first bore, typically a main bore, the nose is retracted out of the main bore and pressure against a seated bore in the nose expands the nose radially to a degree where re-entry into the main bore is precluded but entry into a lateral bore is still possible. The string advances onto a lateral no-go. This signals surface personnel to pick up and raise pressure to blow the seated ball through the seat to again open the passage in the nose. A seal stack behind the nose in advanced into a lateral seal bore and the treatment can then commence.

Abstract: A bottom hole assembly supports a diverter for landing in an existing multilateral junction. Once landed set down weight allows the BHA to progress through the diverter opening into a main bore, for example. A protective sleeve for the seal assembly lands on a shoulder above the targeted seal bore. Further advancing of the BHA moves the seal assembly out of the protective sleeve that has landed on the shoulder by the polished bore. Once the seals are in position in the bore a treatment can be accomplished. On picking up the seal assembly retracts into the protective sleeve and the BHA engages the diverter to bring the BHA and the diverter out of the borehole at the same time.

Abstract: A treatment to temporarily block highly permeable areas in a wellbore having a temperature of less than 160° F. A diverting agent, a catalyzer, and a viscosifier are mixed together and pumped in the wellbore where the treatment flows in the most highly permeable areas. The diverting agent then begins to block those areas as the well is treated finally causing the fluid to divert to other now more highly permeable areas of the wellbore. After less than 48 hours the diverting agent degrades sufficiently to restore the permeablility of the wellbore.

Abstract: A treatment to temporarily block highly permeable areas in a wellbore having a temperature of less than 160° F. A diverting agent, a catalyzer, and a viscosifier are mixed together and pumped in the wellbore where the treatment flows in the most highly permeable areas. The diverting agent then begins to block those areas as the well is treated finally causing the fluid to divert to other now more highly permeable areas of the wellbore. After less than 48 the diverting agent degrades sufficiently to restore the permeablility of the wellbore.

Abstract: A test fixture with an isolation plate grounds all of the solder balls of a ball grid array (BGA) of a chip scale package, except for a selected subset of the solder balls, to perform electrical characterization of the package. The isolation plate includes a recess ground into the plate, and a hole in the recess that permits access to the selected subset of solder balls. The recess provides clearance for a fixed compliant probe to land on the solder balls to be tested through the hole, and a probe contact surface for a ground portion of the probe to securely land.

Abstract: A test fixture with an isolation plate grounds all of the solder balls of a ball grid array (BGA) of a chip scale package, except for a selected subset of the solder balls, to perform electrical characterization of the package. The isolation plate includes at least one hole extending through the isolation plate that exposes the selected subset of the electrical contacts. The hole has a sidewall angled at a non-perpendicular angle from the horizontal plane of the isolation plate. The angle sidewall of the hole provides increased clearance for a fixed compliant probe to land on the solder balls to be tested in an electrical characterization process.