Patents by Inventor John W. Wood

John W. Wood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12107983
    Abstract: A computing device determines that the computing device is within wireless proximity to a secondary wireless device. Based on the computing device being within wireless proximity to the secondary wireless device, the computing device determines at least one function of the secondary wireless device, and generates an aggregate user interface for display on a display screen of the computing device. The aggregate user interface identifies the secondary wireless device and indicates the at least one function of the secondary wireless device. The computing device receives, via the aggregate user interface, a user input selecting the secondary wireless device. Responsive to the user input, the computing device presents a second user interface including one or more selectable features for operating the secondary wireless device.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: October 1, 2024
    Assignee: Uber Technologies, Inc.
    Inventors: Edward K. Y. Jung, Royce A. Levien, Robert W. Lord, Mark A. Malamud, John D. Rinaldo, Jr., Lowell L. Wood, Jr.
  • Publication number: 20240299927
    Abstract: Techniques for treating a detrimental physical condition are disclosed. In one embodiment, a method includes processing one or more samples obtained from the individual through use of one or more microfluidic chips to provide data indicating one or more constituents present within the one or more samples, and processing the data to determine a quantity of at least one constituent that indicates the detrimental physical condition of the individual. Next, the method determines at least one dosage of at least one treatment agent for mitigation of the detrimental physical condition based on the quantity of the at least one constituent that indicates the detrimental physical condition, and facilitates an administration of the at least one dosage for mitigation of the detrimental physical condition.
    Type: Application
    Filed: May 15, 2024
    Publication date: September 12, 2024
    Applicant: Inflammatix, Inc.
    Inventors: Edward K.Y. Jung, Eric C. Leuthardt, Royce A. Levien, Robert W. Lord, Mark A. Malamud, John D. Rinaldo, JR., Lowell L. Wood, JR.
  • Patent number: 8383007
    Abstract: The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: February 26, 2013
    Assignee: Siemens Energy, Inc.
    Inventors: James D. B. Smith, Gary Stevens, John W. Wood
  • Patent number: 8357433
    Abstract: Polymer brushes (50) in a resin that create phonon pathways therein. The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment (55).
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: January 22, 2013
    Assignee: Siemens Energy, Inc.
    Inventors: Gary C. Stevens, James D. B. Smith, John W. Wood
  • Patent number: 8313832
    Abstract: The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: November 20, 2012
    Assignee: Siemens Energy, Inc.
    Inventors: James D Smith, Gary Stevens, John W Wood
  • Patent number: 8277613
    Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
    Type: Grant
    Filed: January 20, 2010
    Date of Patent: October 2, 2012
    Assignee: Siemens Energy, Inc.
    Inventors: James D. B. Smith, Gary Stevens, John W. Wood
  • Publication number: 20120099652
    Abstract: A method and apparatus for scalable coding of a motion vector generated during motion estimation, in which a generated motion vector field is separated into a base layer and an enhancement layer according to pixel accuracies to obtain a layered structure for a motion vector. In addition, the motion vector field has a layered structure including a base layer composed of motion vectors of blocks larger than or equal to a predetermined size and at least one enhancement layer composed of motion vectors of blocks smaller than a predetermined size.
    Type: Application
    Filed: December 28, 2011
    Publication date: April 26, 2012
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: John W. WOODS, Yongjun Wu
  • Patent number: 8107535
    Abstract: A method and apparatus for scalable coding of a motion vector generated during motion estimation, in which a generated motion vector field is separated into a base layer and an enhancement layer according to pixel accuracies to obtain a layered structure for a motion vector. In addition, the motion vector field has a layered structure including a base layer composed of motion vectors of blocks larger than or equal to a predetermined size and at least one enhancement layer composed of motion vectors of blocks smaller than a predetermined size.
    Type: Grant
    Filed: March 9, 2006
    Date of Patent: January 31, 2012
    Assignee: Rensselaer Polytechnic Institute (RPI)
    Inventors: John W. Woods, Yongjun Wu
  • Publication number: 20120009408
    Abstract: The impregnation of a composite tape (56) having a porous matrix with HTC particles provides for permeating a fabric substrate layer (51) of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape (51). The HTC particles in the fabric (51) layer are comprised of a meso-micro mixture, which is between 1:4 to 4:1 meso sized particles to micro sized particles. Other smaller particles may also be included at lesser concentrations. The impregnating resin itself may also contain HTC particles.
    Type: Application
    Filed: September 19, 2011
    Publication date: January 12, 2012
    Inventors: GARY C. STEVENS, James D. B. Smith, John W. Wood, Andreas Lutz
  • Patent number: 8030818
    Abstract: A stator coil includes a plurality of copper strands and a layer of high thermal conductivity polymer disposed adjacent at least one of the copper strands. The high thermal conductivity polymer includes a host polymer and a high thermal conductivity filler. The high thermal conductivity polymer improves heat transfer from the plurality copper strands.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: October 4, 2011
    Assignee: Siemens Energy, Inc.
    Inventors: Thomas I. Nelson, John W. Wood, Lon W. Montgomery
  • Patent number: 7967938
    Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.
    Type: Grant
    Filed: May 13, 2010
    Date of Patent: June 28, 2011
    Assignee: Siemens Energy, Inc.
    Inventors: James D Smith, Gary Stevens, John W Wood
  • Patent number: 7955661
    Abstract: A method for the treatment of micro pores within a mica paper that includes: obtaining a silane with a molecular weight of between approximately 15 and 300, adding the silane to the mica paper, and reacting the silane with the inner surface of the micro pores within the mica paper. After this, a resin is impregnated into the mica paper, and the resin binds to the inner surfaces of the micro pores with the mica paper through the silane. In one embodiment, the mica paper is compressed by an amount between 5% and 30% of its original thickness. In another embodiment, the mica paper is compressed both prior to reacting the silane and during impregnation with the resin.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: June 7, 2011
    Assignee: Siemens Energy, Inc.
    Inventors: Gary Stevens, James D. B. Smith, John W. Wood
  • Patent number: 7917760
    Abstract: Methods, apparati and computer-readable media for securely loading a software module over a communications network from a software provider (SP)(101) onto a tamper resistant module (TRM)(103).
    Type: Grant
    Filed: June 20, 2007
    Date of Patent: March 29, 2011
    Assignee: Multos Limited
    Inventors: Brian B. McKeon, John W. Wood, David Barrington Everett
  • Patent number: 7851059
    Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: December 14, 2010
    Assignee: Siemens Energy, Inc.
    Inventors: Gary Stevens, James D. B. Smith, John W. Wood
  • Patent number: 7846853
    Abstract: An electrical insulation paper that is made of mica flakelets (22), having an average size range of 0.01 to 0.05 mm in their thinnest dimension, hexagonal boron nitride (26), which has an average size range of 10 to 1,000 nm in their longest dimension, and a resin matrix. The mica flakelets and the hexagonal boron nitride are mixed and formed into a paper (17), and the resin is added to the paper after formation, the ratio by weight of the hexagonal boron nitride to the mica flakelets is directly proportional to the average size of the hexagonal boron nitride compared to the average size of the mica flakelets, within an adjustment factor.
    Type: Grant
    Filed: January 23, 2007
    Date of Patent: December 7, 2010
    Assignee: Siemens Energy, Inc.
    Inventors: Gary Stevens, James D. B. Smith, John W. Wood, Peter Groeppel
  • Patent number: 7837817
    Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: November 23, 2010
    Assignee: Siemens Energy, Inc.
    Inventors: James D Smith, Gary Stevens, John W Wood
  • Publication number: 20100276628
    Abstract: The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.
    Type: Application
    Filed: July 16, 2010
    Publication date: November 4, 2010
    Inventors: James D. Smith, Gary Stevens, John W. Wood
  • Publication number: 20100239851
    Abstract: A high thermal conductivity resin that is made up of a host resin matrix (42) and high thermal conductivity fillers (30) that are mixed within the host resin to form a resin mixture. The fillers comprise at least 3-5% by weight of the resin mixture, and the fillers are from an average of 1-100 nm in at least one dimension, and where the particles are smaller than an average of 1000 nm in the particles' longest dimension. The host resin matrix forms an ordered resin shell (40) around the high thermal conductivity fillers (30), whereby resin molecules are aligned perpendicular to the surface of the high thermal conductivity fillers. An overlap of the ordered resin shells (44) is formed between the high thermal conductivity fillers such that continuous pathways for ordered resin shells are created through the resin mixture.
    Type: Application
    Filed: September 28, 2006
    Publication date: September 23, 2010
    Inventors: Gary Stevens, James D.B. Smith, John W. Wood
  • Publication number: 20100215861
    Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.
    Type: Application
    Filed: May 13, 2010
    Publication date: August 26, 2010
    Inventors: James D. Smith, Gary Stevens, John W. Wood
  • Publication number: 20100213413
    Abstract: The present invention provides for a resin mixture that comprises a highly structured resin 40 and a less structured resin 50. The highly structured resin 40 and the less structured resin 50 are mixed to a ratio of between 1:9 and 4:1 by volume, with a more particular ratio of 1:5 to 3:1. The highly structured resin forms ordered micro regions and the ordered micro regions impose order on surrounding less structured resin molecules. The micro regions are essentially groups of the HS resin that will naturally form order structures.
    Type: Application
    Filed: May 13, 2010
    Publication date: August 26, 2010
    Inventors: James D. B. Smith, Gary Stevens, John W. Wood