Patents by Inventor John W. Wood

John W. Wood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7776392
    Abstract: In one embodiment of the present invention as used for impregnating a composite tape (56) with HTC particles provides for permeating a fabric layer (51) of the composite tape with HTC particles and impregnating an impregnating resin into the composite tape through the fabric layer (51). At least 5% of the HTC particles permeated into the fabric layer are carried out of the fabric layer and into a mica layer (52) bound to the fabric layer by the impregnating resin. In some embodiments the impregnating resin itself contains HTC particles.
    Type: Grant
    Filed: April 3, 2006
    Date of Patent: August 17, 2010
    Assignee: Siemens Energy, Inc.
    Inventors: James D. B. Smith, Gary Stevens, John W. Wood
  • Publication number: 20100120928
    Abstract: In one application the mix grafted and non grafted invention provides for high thermal conductivity resin that comprises a host resin matrix 32 with a first class of grafted 31 high thermal conductivity particles that are grafted to the host resin matrix. Also a second class of non-grafted 30 high thermal conductivity particles that are not directly grafted the host resin matrix 32. The first class and the second class comprise approximately 2-60% by volume of the high thermal conductivity resin. The first class of grafted particles and the second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.
    Type: Application
    Filed: January 28, 2010
    Publication date: May 13, 2010
    Inventors: James D. B. Smith, Gary Stevens, John W. Wood
  • Publication number: 20100112303
    Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
    Type: Application
    Filed: January 20, 2010
    Publication date: May 6, 2010
    Inventors: James D.B. Smith, Gary Stevens, John W. Wood
  • Publication number: 20100108278
    Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers my have patterning.
    Type: Application
    Filed: January 20, 2010
    Publication date: May 6, 2010
    Inventors: James D.B. Smith, Gary Stevens, John W. Wood
  • Patent number: 7655295
    Abstract: In one application the mix grafted and non grafted invention provides for high thermal conductivity resin that comprises a host resin matrix with a first class of grafted high thermal conductivity particles that are grafted to the host resin matrix. Also a second class of non-grafted high thermal conductivity particles that are not directly grafted the host resin matrix. The first class and the second class comprise approximately 2-60% by volume of the high thermal conductivity resin. The first class of grafted particles and the second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.
    Type: Grant
    Filed: April 3, 2006
    Date of Patent: February 2, 2010
    Assignee: Siemens Energy, Inc.
    Inventors: James D. B. Smith, Gary Stevens, John W. Wood
  • Patent number: 7651963
    Abstract: The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers may have patterning.
    Type: Grant
    Filed: April 3, 2006
    Date of Patent: January 26, 2010
    Assignee: Siemens Energy, Inc.
    Inventors: James D. B. Smith, Gary Stevens, John W. Wood
  • Patent number: 7653133
    Abstract: A method, computer program product, and computer system for processing video frames. A current frame is divided into M blocks that include at least two differently sized blocks. M is at least 9. Each block in the current frame is classified as being a motion block or an I-BLOCK. Overlapped block motion compensation (OBMC) is performed on each block of the M blocks according to a predetermined scan order. The block on which OBMC is being performed is denoted as a self block. The OBMC is performed on the self block with respect to its neighbor blocks. The neighbor blocks consist of nearest neighbor blocks of the self block. Performing OBMC on the self block includes generating a weighting window for the self block and for each of its neighbor blocks.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: January 26, 2010
    Assignee: Rensselaer Polytechnic Institute (RPI)
    Inventors: John W. Woods, Yongjun Wu, Robert A. Cohen
  • Patent number: 7627040
    Abstract: A method, system, computer program product, and computer system for processing video frames. Frames A and B of a pair of successive video frames each comprise blocks of pixels. Frame A is earlier in time than frame B. A connection state of each pixel in frame B relative to the pixels of frame A is determined. The connection state is a connected state or an unconnected state. Each block in frame B is classified as either unconnected or uni-connected. Uni-connected blocks in frame B satisfying a reclassification criteria are reclassified as being unconnected. Each unconnected block in frame B is categorized as being a P-block or an I-block. Values for the pixels of each I-block in frame B are calculated by spatial interpolation based on values of nearest available neighbor pixels relative to each I-block. A residual error block for each I-block in frame B is generated.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: December 1, 2009
    Assignee: Rensselaer Polytechnic Institute (RPI)
    Inventors: John W. Woods, Peisong Chen, Yongjun Wu
  • Publication number: 20090238959
    Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.
    Type: Application
    Filed: June 8, 2009
    Publication date: September 24, 2009
    Inventors: James D. Smith, Gary Stevens, John W. Wood
  • Patent number: 7592045
    Abstract: In one embodiment the present invention provides for a method of forming HTC dendritic fillers 40 within a host resin matrix that comprises adding HTC seeds 42 to the host resin matrix. The HTC seeds have been surface functionalized to not substantially react with one another. The seeds then accumulate HTC building blocks 42, and the HTC building blocks have also been surface functionalized to not substantially react with one another. Then assembling the HTC building blocks with the HTC seeds to produce HTC dendritic fillers 40 within the host resin matrix.
    Type: Grant
    Filed: April 3, 2006
    Date of Patent: September 22, 2009
    Assignee: Siemens Energy, Inc.
    Inventors: James D. B. Smith, Gary Stevens, John W. Wood
  • Patent number: 7553781
    Abstract: The present invention facilitates the thermal conductivity of fabrics by surface coating of the fabrics with high thermal conductivity materials 6. The fabrics may be surface coated when they are individual fibers or strands 4, bundles of strands, formed fabric or combinations therefore. A particular type of fibrous matrix used with the present invention is glass. Some fabrics may be a combination of more than one type of material, or may have different materials in alternating layers. HTC coatings of the present invention include diamond like coatings (DLC) and metal oxides, nitrides, carbides and mixed stoichiometric and non-stoichiometric combinations that can be applied to the host matrix.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: June 30, 2009
    Assignee: Siemens Energy, Inc.
    Inventors: James D Smith, Gary Stevens, John W Wood
  • Patent number: 7553438
    Abstract: The present invention provides for a method of impregnating a matrix with a high thermal conductivity filled resin 32, which produces a resin impregnated matrix. The high thermal conductivity material 30 comprises 5-60% by volume of the resin 32. This is compressed by approximately 5-30%, and the distances between the high thermal conductivity materials loaded in the resin are reduced, and the resin is then cured.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: June 30, 2009
    Assignee: Siemens Energy, Inc.
    Inventors: James D Smith, Gary Stevens, John W Wood, Andreas Lutz
  • Publication number: 20080284262
    Abstract: A stator coil includes a plurality of copper strands and a layer of high thermal conductivity polymer disposed adjacent at least one of the copper strands. The high thermal conductivity polymer includes a host polymer and a high thermal conductivity filler. The high thermal conductivity polymer improves heat transfer from the plurality copper strands.
    Type: Application
    Filed: June 30, 2008
    Publication date: November 20, 2008
    Applicant: SIEMENS POWER GENERATION, INC.
    Inventors: Thomas I. Nelson, John W. Wood, Lon W. Montgomery
  • Publication number: 20080262128
    Abstract: Polymer brushes (50) in a resin that create phonon pathways therein The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment (55).
    Type: Application
    Filed: June 30, 2008
    Publication date: October 23, 2008
    Applicant: SIEMENS POWER GENERATION, INC.
    Inventors: Gary Stevens, James D.B. Smith, John W. Wood
  • Patent number: 7268293
    Abstract: An electrically insulated object 13 with a heat conduit at the interface between the layers of insulating tape 16. The tape 16 has been, surface coated with a high thermal conductivity (HTC) material, so that the interface between the layers of tape 23 provides a pathway for the heat to reach the environment 24. The radiation of heat through the tape layers is also increased by the surface coatings.
    Type: Grant
    Filed: April 15, 2005
    Date of Patent: September 11, 2007
    Assignee: Siemen Power Generation, Inc.
    Inventors: James D B Smith, Gary Stevens, John W Wood
  • Publication number: 20040264576
    Abstract: A method, system, computer program product, and computer system for processing video frames. Frames A and B of a pair of successive video frames each comprise blocks of pixels. Frame A is earlier in time than frame B. A connection state of each pixel in frame B relative to the pixels of frame A is determined. The connection state is a connected state or an unconnected state. Each block in frame B is classified as either unconnected or uni-connected. Uni-connected blocks in frame B satisfying a reclassification criteria are reclassified as being unconnected. Each unconnected block in frame B is categorized as being a P-block or an I-block. Values for the pixels of each I-block in frame B are calculated by spatial interpolation based on values of nearest available neighbor pixels relative to each I-block. A residual error block for each I-block in frame B is generated.
    Type: Application
    Filed: June 9, 2004
    Publication date: December 30, 2004
    Inventors: John W. Woods, Peisong Chen, Yongjun Wu
  • Patent number: 6453209
    Abstract: A computer-implemented method and apparatus for designing and manufacturing vehicles in a distributed design environment and manufacturing plant environment. A database is provided for storing vehicle design data (e.g., tool, part, weld, and torque data) related to the vehicles. A process sheet data structure is used to interrelate the tool, part, weld, and torque data in order to generate process sheet data that depicts the assembly process of the vehicles. The assembling process contains the steps to assemble the vehicles. A manufacturing plant data structure is linked to the process sheet data structure for containing station data and production data for assembling the vehicles in the manufacturing plants. The manufacturing plant data structure associates the station data with the process sheet data in order to indicate the assembly steps for a station contained within the manufacturing data structure.
    Type: Grant
    Filed: September 1, 1999
    Date of Patent: September 17, 2002
    Assignee: DaimlerChrysler Corporation
    Inventors: Cameron T. Hill, John W. Wood, Daniel J. Rakoczy, Deborah A. Honnila, Andrew J. Moro
  • Patent number: 6298788
    Abstract: A modular crowd control munition 10 fires a large number of non-lethal soft pellets into a crowd 100 using an explosive charge. The munition 10 contains a pellet matrix 22 that houses the soft pellets 40, and uses a low energy explosive sheet material 50 at the back of the munition 10 to disperse the soft pellets 40. The munition 10 is used for close-in, “last resort”, crowd control to replace the necessity of using deadly force.
    Type: Grant
    Filed: July 7, 2000
    Date of Patent: October 9, 2001
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: John W. Woods, Brian Edward Fuchs, Gerard I. Gillen, Gary G. Fairbanks
  • Patent number: 4577307
    Abstract: An apparatus for clamping and unclamping an optical disk in an information storage and retrieval device having removabe media. The apparatus has rotating and a non-rotating disk support assemblies, the non-rotating disk support assembly being attached to an elevator which reciprocatively raises and lowers the rotating and non-rotating disk support assemblies. The rotating disk support assembly is magnetically clamped to the non-rotating disk support assembly by an electromagnet during the loading and centering operation. The rotating disc support assembly has a centering stem which cooperates with a hole in the device spindle to center the rotating disk support assembly relative to the device spindle. In the preferred embodiment, the disk has a flexure and a tapered disk centering hub which cooperates with a taper on the hole in the device spindle to center the disk relative to the device spindle.
    Type: Grant
    Filed: September 27, 1984
    Date of Patent: March 18, 1986
    Assignee: Storage Technology Partners II
    Inventors: John W. Woods, Paul Kummli, Edward M. White