Patents by Inventor Jon Zuo

Jon Zuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10638639
    Abstract: A cooling unit positioned between a first gas stream and a second gas stream, the first gas stream and the second gas stream having no direct fluid contact therebetween. The cooling unit includes a double-sided heat exchanger with a first side that is in thermal communication with the first gas stream and a second side that is in thermal communication with the second gas stream. The double-sided heat exchanger provides a direct path of thermal conduction between the first gas stream and the second gas stream. First fins are provided on the first side of the double-sided heat exchanger and second fins are provided on the second side of the double-sided heat exchanger. A first surface area of the first side of the double-sided heat exchanger is at least 5% greater than a second surface area of the second side of the double-sided heat exchanger.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: April 28, 2020
    Assignee: ADVANCED COOLING TECHNOLOGIES, INC.
    Inventors: Scott D. Garner, Peter Dussinger, Jon Zuo, Daniel T. Reist
  • Patent number: 7306028
    Abstract: A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.
    Type: Grant
    Filed: June 23, 2005
    Date of Patent: December 11, 2007
    Assignee: Thermal Corp.
    Inventors: Jon Zuo, Ernest H. Dubble, Donald M. Ernst
  • Publication number: 20060289147
    Abstract: A modular based heat sink which can be easily optimized for a given heat source relies upon both phase change based heat transfer and condenser modules that combine the efficiency of folded fin cooling and the efficiency of the two phase heat transfer.
    Type: Application
    Filed: June 23, 2005
    Publication date: December 28, 2006
    Inventors: Jon Zuo, Ernest Dubble, Donald Ernst
  • Patent number: 7005738
    Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: February 28, 2006
    Assignee: Thermal Corp.
    Inventors: Jon Zuo, Donald M. Ernst
  • Patent number: 6990816
    Abstract: The apparatus is a hybrid cooler which includes one loop within which a heated evaporator forms vapor that moves to a condenser because of the vapor pressure which also drives the liquid condensate from the condenser to a liquid reservoir. A second loop is powered by a mechanical pump that supplies liquid from the reservoir to the evaporator and the second loop also returns excess liquid not vaporized to the reservoir. An optional reservoir cooler can be used to assure that the reservoir temperature and vapor pressure are always lower that the temperatures and pressures of the evaporator and condenser.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: January 31, 2006
    Assignee: Advanced Cooling Technologies, Inc.
    Inventors: Jon Zuo, David Sarraf
  • Publication number: 20050269063
    Abstract: A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.
    Type: Application
    Filed: July 1, 2004
    Publication date: December 8, 2005
    Inventors: Jon Zuo, Donald Ernst
  • Patent number: 6948556
    Abstract: A heat transfer loop system includes a primary passive two-phase flow segment with an evaporator, a condenser and a liquid reservoir, and a secondary actively pumped liquid flow segment in which the liquid in the reservoir is drawn by a liquid pump into the evaporator, where a portion of the liquid is vaporized by the heat input and moves into the primary segment while the excess liquid is pumped back to the reservoir. The evaporator consists of a porous wick and one or more liquid arteries encased in the porous wick. The liquid arteries have porous walls to allow liquid phase working fluid to flow into the surrounding porous wick. The liquid arteries have porous walls to allow liquid phase working fluid to flow into the surrounding porous wick. The excess liquid continues to move through the arteries and eventually out of the evaporator and into the reservoir. The porous wick provides sufficient capillary force to separate the liquid inside the arteries and the vapor in the evaporator.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: September 27, 2005
    Inventors: William G. Anderson, G. Yale Eastman, David B. Sarraf, Jon Zuo
  • Patent number: 6889755
    Abstract: A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.
    Type: Grant
    Filed: February 18, 2003
    Date of Patent: May 10, 2005
    Assignee: Thermal Corp.
    Inventors: Jon Zuo, Donald M. Ernst
  • Publication number: 20050093139
    Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.
    Type: Application
    Filed: November 30, 2004
    Publication date: May 5, 2005
    Inventors: Jon Zuo, Donald Ernst
  • Patent number: 6858929
    Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: February 22, 2005
    Assignee: Thermal Corp.
    Inventors: Jon Zuo, Donald M. Ernst
  • Publication number: 20040159422
    Abstract: A wick for use in a heat pipe is provided incorporating particles of micro-encapsulated phase change material bonded together to form the wick. Use of a wick structure comprising micro-encapsulated PCM particles has the advantage of providing an additional heat absorber. This greatly enhances the ability of the heat pipe to absorb excess heat and may help to prevent damage to the heat pipe or heat generating component, such as an electronic device, especially at times of peak thermal loads.
    Type: Application
    Filed: February 18, 2003
    Publication date: August 19, 2004
    Inventors: Jon Zuo, Donald M. Ernst
  • Patent number: 6631077
    Abstract: A heat spreader includes a plate having a first and second ends and a plurality of channels between the ends. A reservoir is located at the first end. A fluid oscillator oscillates a fluid between the first and second ends with a reciprocating flow. The oscillator is integrally contained within the plate.
    Type: Grant
    Filed: February 11, 2002
    Date of Patent: October 7, 2003
    Assignee: Thermal Corp.
    Inventor: Jon Zuo
  • Publication number: 20030151895
    Abstract: A heat spreader includes a plate having a first and second ends and a plurality of channels between the ends. A reservoir is located at the first end. A fluid oscillator oscillates a fluid between the first and second ends with a reciprocating flow. The oscillator is integrally contained within the plate.
    Type: Application
    Filed: February 11, 2002
    Publication date: August 14, 2003
    Inventor: Jon Zuo
  • Patent number: 6579747
    Abstract: Method of making semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a heat-dissipating device coupled to the housing, the heat-dissipating device including at least one area formed of a material with a low coefficient of thermal expansion.
    Type: Grant
    Filed: August 15, 2002
    Date of Patent: June 17, 2003
    Inventor: Jon Zuo
  • Patent number: 6566743
    Abstract: A semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a heat-dissipating device coupled to the housing, the heat-dissipating device including at least one area formed of a material with a low coefficient of thermal expansion.
    Type: Grant
    Filed: February 21, 2002
    Date of Patent: May 20, 2003
    Assignee: Thermal Corp.
    Inventor: Jon Zuo
  • Publication number: 20030075306
    Abstract: A LHP/CPL wick includes an unconsolidated wick portion positioned within a first consolidated wick portion and a second consolidated wick portion. This wick provides a large &Dgr;T across the wick, and sufficient capillary action for miniature LHP/CPL applications. Furthermore, the unconsolidated wick portion allows accommodation of mismatched coefficients of thermal expansion. A LHP/CPL having this wick is particularly applicable to silicon cooling devices.
    Type: Application
    Filed: October 19, 2001
    Publication date: April 24, 2003
    Inventors: Jon Zuo, Dmitry Khrustalev, Alfred L. Phillips
  • Patent number: 6536510
    Abstract: A thermal bus is provided for cabinets housing high power electronics equipment that includes two spaced-apart horizontally oriented parallel evaporators interconnected in flow communication with a condenser. Each evaporator is mounted in a support having a central recess and each having a tube having a capillary wick disposed on an internal surface and being mounted within the central recess of the support. Each of the tubes includes a closed distal end and a closed proximal end with a liquid-working fluid entrance port located at the closed proximal end of the first tube and a vaporous-working fluid exit port located at the closed proximal end of the second tube. A duct defining a central passageway and having a capillary wick disposed on the walls of the central passageway is disposed in fluid communication with the first tube and the second tube.
    Type: Grant
    Filed: July 10, 2001
    Date of Patent: March 25, 2003
    Assignee: Thermal Corp.
    Inventors: Dmitry Khrustalev, Jon Zuo
  • Patent number: 6525420
    Abstract: The invention provides a semiconductor package having a substrate, a top surface and at least one semiconductor device attached to the top surface of the substrate. A cover is secured to the substrate creating a space between the cover and the substrate, with the semiconductor device residing within the space. The cover includes an inner chamber that is defined by an upper wall and a lower wall of the cover. The cavity contains a two-phase vaporizable liquid and a wick. Advantageously, the wick on the lower wall includes at least one recess that forms a thinned wall adjacent to a high heat generation portion of the semiconductor device. In one embodiment, the wick on the lower wall includes at least one channel that communicates with at least one of the recesses.
    Type: Grant
    Filed: January 30, 2001
    Date of Patent: February 25, 2003
    Assignee: Thermal Corp.
    Inventors: Jon Zuo, Donald M. Ernst
  • Publication number: 20030030987
    Abstract: A method and apparatus for cooling heat-producing equipment, the method comprising the steps of directing heat from the heat producing equipment to a cooling loop and, circulating liquid through said cooling loop from a liquid reservoir to a radiator structure. In a first exemplary embodiment, the apparatus comprises a liquid reservoir, a pump, a radiator and a plurality of interface members. In a second exemplary embodiment, the apparatus comprises a liquid reservoir, a pump, a radiator and an air-to-liquid heat exchanger.
    Type: Application
    Filed: September 26, 2002
    Publication date: February 13, 2003
    Inventors: Jon Zuo, Brian D. Fritsch
  • Publication number: 20030030981
    Abstract: A method and apparatus for cooling heat-producing equipment, the method comprising the steps of directing heat from the heat producing equipment to a cooling loop and, circulating liquid through said cooling loop from a liquid reservoir to a radiator structure. In a first exemplary embodiment, the apparatus comprises a liquid reservoir, a pump, a radiator and a plurality of interface members. In a second exemplary embodiment, the apparatus comprises a liquid reservoir, a pump, a radiator and an air-to-liquid heat exchanger.
    Type: Application
    Filed: August 9, 2001
    Publication date: February 13, 2003
    Inventors: Jon Zuo, Brian D. Fritsch