Patents by Inventor Jonathan Almeria Noquil
Jonathan Almeria Noquil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11930590Abstract: In a described example, an apparatus includes: a package substrate having a planar die mount surface; recesses extending into the planar die mount surface; and a semiconductor device die flip chip mounted to the package substrate on the planar die mount surface, the semiconductor device die having post connects having proximate ends on bond pads on an active surface of the semiconductor device die, and extending to distal ends away from the semiconductor device die having solder bumps, wherein the solder bumps form solder joints to the package substrate within the recesses.Type: GrantFiled: March 31, 2021Date of Patent: March 12, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Tianyi Luo, Osvaldo Jorge Lopez, Jonathan Almeria Noquil, Satyendra Singh Chauhan, Bernardo Gallegos
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Patent number: 11908780Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.Type: GrantFiled: November 3, 2021Date of Patent: February 20, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Jonathan Almeria Noquil, Satyendra Singh Chauhan, Lance Cole Wright, Osvaldo Jorge Lopez
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Publication number: 20240047330Abstract: In some examples, a semiconductor package comprises a multi-layer package substrate. The multi-layer package substrate includes first and second metal layers, the first metal layer positioned above the second metal layer and coupled to the second metal layer by way of a via. The substrate also includes a dielectric covering at least part of the first and second metal layers and the via. The package includes a plated metal layer plated on at least part of the first metal layer and positioned above the dielectric, a combination of the first metal layer and the plated metal layer being thicker than the second metal layer. The package includes a semiconductor die having a device side, the device side vertically aligned with and coupled to the plated metal layer.Type: ApplicationFiled: October 10, 2023Publication date: February 8, 2024Inventors: Jonathan Almeria NOQUIL, Makarand Ramkrishna KULKARNI, Osvaldo Jorge LOPEZ, Yiqi TANG, Rajen Manicon MURUGAN, Liang WAN
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Patent number: 11817375Abstract: A method of making a semiconductor device includes separating a conductive structure of a leadframe into interior conductive leads using an etching process. The method includes forming a first molded structure by applying a first molding compound to a leadframe having a conductive structure, separating the conductive structure into at least two interior contact portions, attaching a semiconductor die to at least one of the interior contact portions, the at least two interior contact portions being supported by the first molding compound, and forming a second molded structure by applying a second molding compound to at least part of the semiconductor die and at least two interior contact portions.Type: GrantFiled: February 13, 2019Date of Patent: November 14, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Osvaldo Jorge Lopez, Tianyi Luo, Jonathan Almeria Noquil
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Patent number: 11784114Abstract: In some examples, a semiconductor package comprises a multi-layer package substrate. The multi-layer package substrate includes first and second metal layers, the first metal layer positioned above the second metal layer and coupled to the second metal layer by way of a via. The substrate also includes a dielectric covering at least part of the first and second metal layers and the via. The package includes a plated metal layer plated on at least part of the first metal layer and positioned above the dielectric, a combination of the first metal layer and the plated metal layer being thicker than the second metal layer. The package includes a semiconductor die having a device side, the device side vertically aligned with and coupled to the plated metal layer.Type: GrantFiled: May 28, 2021Date of Patent: October 10, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Jonathan Almeria Noquil, Makarand Ramkrishna Kulkarni, Osvaldo Jorge Lopez, Yiqi Tang, Rajen Manicon Murugan, Liang Wan
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Publication number: 20230268253Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.Type: ApplicationFiled: April 25, 2023Publication date: August 24, 2023Inventors: Tianyi Luo, Jonathan Almeria Noquil, Osvaldo Jorge Lopez
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Patent number: 11658130Abstract: A packaged electronic device includes a semiconductor die, a conductive plate coupled to a lead, a solder structure and a package structure. The semiconductor die has opposite first and second sides and a terminal exposed along the second side. The conductive plate has opposite first and second sides and an indent that extends into the first side, the conductive plate, and the solder structure extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal, and the solder structure extends into the indent. The package structure encloses the semiconductor die, the conductive plate and a portion of the lead.Type: GrantFiled: December 31, 2020Date of Patent: May 23, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Tianyi Luo, Jonathan Almeria Noquil, Satyendra Singh Chauhan, Osvaldo Jorge Lopez, Lance Cole Wright
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Patent number: 11640932Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.Type: GrantFiled: May 12, 2021Date of Patent: May 2, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Tianyi Luo, Jonathan Almeria Noquil, Osvaldo Jorge Lopez
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Publication number: 20230063343Abstract: An electronic device includes a multilevel package substrate with first and second levels extending in planes of first and second directions and spaced apart from one another along a third direction, the first level having a first side with landing areas and the second level having a second side with conductive landing pads. The electronic device includes a die with conductive terminals electrically coupled to respective ones of the landing areas, as well as solder balls attached to respective ones of the landing pads, and a package structure that encloses the die and a portion of the multilevel package substrate.Type: ApplicationFiled: August 24, 2021Publication date: March 2, 2023Applicant: Texas Instruments IncorporatedInventors: Rajen Manicon Murugan, Yiqi Tang, Jonathan Almeria Noquil, Makarand Ramkrishna Kulkarni
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Publication number: 20220208692Abstract: A packaged electronic device includes a semiconductor die, a conductive plate coupled to a lead, a solder structure and a package structure. The semiconductor die has opposite first and second sides and a terminal exposed along the second side. The conductive plate has opposite first and second sides and an indent that extends into the first side, the conductive plate, and the solder structure extends between the second side of the semiconductor die and the first side of the conductive plate to electrically couple the conductive plate to the terminal, and the solder structure extends into the indent. The package structure encloses the semiconductor die, the conductive plate and a portion of the lead.Type: ApplicationFiled: December 31, 2020Publication date: June 30, 2022Applicant: Texas Instruments IncorporatedInventors: Tianyi Luo, Jonathan Almeria Noquil, Satyendra Singh Chauhan, Osvaldo Jorge Lopez, Lance Cole Wright
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Publication number: 20220210911Abstract: In a described example, an apparatus includes: a package substrate having a planar die mount surface; recesses extending into the planar die mount surface; and a semiconductor device die flip chip mounted to the package substrate on the planar die mount surface, the semiconductor device die having post connects having proximate ends on bond pads on an active surface of the semiconductor device die, and extending to distal ends away from the semiconductor device die having solder bumps, wherein the solder bumps form solder joints to the package substrate within the recesses.Type: ApplicationFiled: March 31, 2021Publication date: June 30, 2022Inventors: Tianyi Luo, Osvaldo Jorge Lopez, Jonathan Almeria Noquil, Satyendra Singh Chauhan, Bernardo Gallegos
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Publication number: 20220181241Abstract: In some examples, a semiconductor package comprises a multi-layer package substrate. The multi-layer package substrate includes first and second metal layers, the first metal layer positioned above the second metal layer and coupled to the second metal layer by way of a via. The substrate also includes a dielectric covering at least part of the first and second metal layers and the via. The package includes a plated metal layer plated on at least part of the first metal layer and positioned above the dielectric, a combination of the first metal layer and the plated metal layer being thicker than the second metal layer. The package includes a semiconductor die having a device side, the device side vertically aligned with and coupled to the plated metal layer.Type: ApplicationFiled: May 28, 2021Publication date: June 9, 2022Inventors: Jonathan Almeria NOQUIL, Makarand Ramkrishna KULKARNI, Osvaldo Jorge LOPEZ, Yiqi TANG, Rajen Manicon MURUGAN, Liang WAN
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Publication number: 20220115308Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.Type: ApplicationFiled: November 3, 2021Publication date: April 14, 2022Inventors: Jonathan Almeria Noquil, Satyendra Singh Chauhan, Lance Cole Wright, Osvaldo Jorge Lopez
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Publication number: 20220028593Abstract: An electronic device includes a multilevel package substrate, conductive leads, a die, and a package structure. The multilevel package substrate has a first level, a second level, and a third level, each having patterned conductive features and molded dielectric features. The first level includes a first patterned conductive feature with multiple turns that form a first winding. The second level includes a second patterned conductive feature, and the third level includes a third patterned conductive feature with multiple turns that form a second winding. A first terminal of the die is coupled to the first end of the first winding, a second terminal of the die is coupled to the second end of the first winding, and a third terminal of the die is coupled to a first conductive lead. The package structure encloses the first die, the second die, and a portion of the multilevel package substrate.Type: ApplicationFiled: July 23, 2021Publication date: January 27, 2022Applicant: Texas Instruments IncorporatedInventors: Yiqi Tang, Rajen Manicon Murugan, Jonathan Almeria Noquil
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Patent number: 11177246Abstract: A self-powered electronic system comprises a first chip of single-crystalline semiconductor embedded in a second chip of single-crystalline semiconductor shaped as a container bordered by ridges. The assembled chips are nested and form an electronic device assembled, in turn, in a slab of weakly p-doped low-grade silicon shaped as a container bordered by ridges. The flat side of the slab includes a heavily n-doped region forming a pn-junction with the p-type bulk. A metal-filled deep silicon via through the p-type ridge connects the n-region with the terminal on the ridge surface as cathode of the photovoltaic cell with the p-region as anode. The voltage across the pn-junction serves as power source of the device.Type: GrantFiled: August 21, 2019Date of Patent: November 16, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Osvaldo Jorge Lopez, Walter Hans Paul Schroen, Jonathan Almeria Noquil, Thomas Eugene Grebs, Simon John Molloy
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Patent number: 11177197Abstract: A semiconductor package includes a leadframe including a die pad and a plurality of lead terminals. A vertical semiconductor device is attached on a first side by a die attach material to the die pad. A first clip is on the first vertical device that is solder connected to a terminal of the first vertical device on a second side opposite to the first side providing a first solder bonded interface, wherein the first clip is connected to at least a first of the lead terminals. The first solder bonded interface includes a first protruding surface standoff therein that extends from a surface on the second side of the first vertical device to physically contact the first clip.Type: GrantFiled: September 25, 2019Date of Patent: November 16, 2021Assignee: Texas Instruments IncorporatedInventors: Jonathan Almeria Noquil, Satyendra Singh Chauhan, Lance Cole Wright, Osvaldo Jorge Lopez
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Publication number: 20210320093Abstract: A multichip module (MCM) power package includes a multilayer routable leadframe substrate (MRLF) substrate including a first and a second RLF layer. A multilayer extending via extends from the first into the second RLF layer. A first vertical FET has a side flipchip attached to a bottom side of the second RLF. A second vertical FET has a side flipchip attached to a bottom side of the second RLF layer, and contacts the multilayer extending via. A controller integrated circuit (IC) is flipchip attached a top side of the MRLF substrate at least partially over the first vertical FET. A top mold compound is on a top side of the MRLF substrate lateral to the controller IC that is lateral to a metal pad on the multilayer extending via. A bottom side of the first and second vertical FET are exposed by a bottom mold compound layer.Type: ApplicationFiled: June 24, 2021Publication date: October 14, 2021Inventors: Jonathan Almeria Noquil, Makarand Ramkrishna Kulkarni
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Publication number: 20210265246Abstract: A packaged electronic device includes a stacked configuration of a first semiconductor die in a first recess in a first side of a first conductive plate, a second semiconductor die in a second recess in a first side of a second conductive plate, a third conductive plate electrically coupled to a second side of the second semiconductor die, and a package structure that encloses the first semiconductor die, and the second semiconductor die, where the package structure includes a side that exposes a portion of a second side of the first conductive plate.Type: ApplicationFiled: May 12, 2021Publication date: August 26, 2021Inventors: Tianyi Luo, Jonathan Almeria Noquil, Osvaldo Jorge Lopez
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Patent number: 11081472Abstract: A multichip module (MCM) power package includes a multilayer routable leadframe substrate (MRLF) substrate including a first and a second RLF layer. A multilayer extending via extends from the first into the second RLF layer. A first vertical FET has a side flipchip attached to a bottom side of the second RLF. A second vertical FET has a side flipchip attached to a bottom side of the second RLF layer, and contacts the multilayer extending via. A controller integrated circuit (IC) is flipchip attached a top side of the MRLF substrate at least partially over the first vertical FET. A top mold compound is on a top side of the MRLF substrate lateral to the controller IC that is lateral to a metal pad on the multilayer extending via. A bottom side of the first and second vertical FET are exposed by a bottom mold compound layer.Type: GrantFiled: September 18, 2019Date of Patent: August 3, 2021Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Jonathan Almeria Noquil, Makarand Ramkrishna Kulkarni
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Patent number: 11043477Abstract: A power converter (100) comprising a semiconductor chip (101) with a first (101a) and a parallel second (101b) surface, and through-silicon vias (TSVs, 110). The chip embedding a high-side (HS) field-effect transistor (FET) interconnected with a low side (LS) FET. Surface (101a) includes first metallic pads (111) as inlets of the TSVs, and an attachment site for an integrated circuit (IC) chip (150). Surface (101b) includes second metallic pads (115) as outlets of the TSVs, and third metallic pads as terminals of the converter: Pad (123a) as HS FET inlet, pad (122a) as HS FET gate, pad (131a) as LS FET outlet, pad (132a) as LS FET gate, and gate (140a) as common HS FET and LS FET switch-node. Driver-and-controller IC chip 150) has the IC terminals connected to respective first pads.Type: GrantFiled: July 3, 2018Date of Patent: June 22, 2021Assignee: Texas Instruments IncorporatedInventors: Jonathan Almeria Noquil, Osvaldo Jorge Lopez, Haian Lin