Patents by Inventor Jonathan E. Buck

Jonathan E. Buck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11139620
    Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: October 5, 2021
    Assignee: SAMTEC, INC.
    Inventors: John A. Mongold, Jonathan E. Buck
  • Publication number: 20210305740
    Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.
    Type: Application
    Filed: October 8, 2019
    Publication date: September 30, 2021
    Inventors: John A. MONGOLD, Jonathan E. BUCK, Jignesh H. SHAH, Chadrick P. FAITH, Randall E. MUSSER, Jean Karlo WILLIAMS BARNET, Norman S. MCMORROW
  • Publication number: 20210265785
    Abstract: A cable connector includes a cable including a center conductor and a housing supporting a portion of the center conductor. An imaginary line divides a cross-section of the center conductor into two semicircles, and when the cable connector is mated with a mating connector, only one of the two semicircles is directly connected with a corresponding contact of the mating connector.
    Type: Application
    Filed: July 11, 2019
    Publication date: August 26, 2021
    Inventors: John A. MONGOLD, Jonathan E. BUCK, Jignesh H. SHAH, Chadrick P. FAITH, Randall E. MUSSER, Jean Karlo WILLIAMS BARNET, Norman S. MCMORROW
  • Patent number: 11081822
    Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: August 3, 2021
    Assignee: Samtec, Inc.
    Inventor: Jonathan E. Buck
  • Publication number: 20210126401
    Abstract: To help maintain and improve signal integrity, a connector housing can include one or more of the following: asymmetric keying features, asymmetric alignment features, and alternating stitched electrical contacts.
    Type: Application
    Filed: July 3, 2019
    Publication date: April 29, 2021
    Inventors: Randall E. MUSSER, Jonathan E. BUCK
  • Publication number: 20200373696
    Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
    Type: Application
    Filed: August 10, 2020
    Publication date: November 26, 2020
    Inventor: Jonathan E. Buck
  • Publication number: 20200350731
    Abstract: An electrical connector has a row of signal contacts, and a ground shield disposed inwardly from the signal contacts. Each of the signal and ground contacts has a first segment and a second segment. Each first segment defines a mounting end that can mount to a first electrical component, and each second segment defines a mating end that can mate with a second electrical component. The first and second segments of each signal contact and the ground contact are angularly offset from one another so as to define an angle of between 75 degrees and 105 degrees between the first and second segments. The first and second segments of each signal contact and the ground contact can be coupled to one another to define the angle. Alternatively, the signal and ground contacts can be bent along a common bend line that intersects the signal contacts and the ground contact.
    Type: Application
    Filed: October 24, 2018
    Publication date: November 5, 2020
    Inventors: Jonathan E. BUCK, John MONGOLD, Madhumitha RENGARAJAN
  • Patent number: 10784608
    Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: September 22, 2020
    Assignee: SAMTEC, INC.
    Inventor: Jonathan E. Buck
  • Patent number: 10720721
    Abstract: An electrical connector includes a dielectric housing, a plurality of electrical signal contacts carried by the dielectric housing, and a ground plate carried by the dielectric housing. The electrical signal contacts are arranged along a first plane, wherein the signal contacts define signal pairs. The signal contacts further define respective mating and mounting ends. The ground plate includes a ground plate body oriented in a second plane that is substantially parallel to the first plane and offset from the first plane. The ground plate body defines first and second opposed surfaces. The ground plate includes at least one rib that defines first and second opposed surfaces, wherein the first surface of the rib projects from the first surface of the ground plate body in a direction toward the first plane between adjacent signal pairs, and the second surface is recessed into the second surface of the ground plate body.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: July 21, 2020
    Assignee: FCI USA LLC
    Inventors: Douglas M. Johnescu, Jonathan E. Buck, Stuart C. Stoner
  • Publication number: 20200212631
    Abstract: An orthogonal electrical connector system includes vertical electrical connectors that are configured to be mated to each other so as to place respective pluralities of first and second substrates that are oriented orthogonal to each other in data communication with each other through the mated electrical connectors. Other connector systems are also disclosed.
    Type: Application
    Filed: June 13, 2018
    Publication date: July 2, 2020
    Inventors: Jonathan E. BUCK, John MONGOLD
  • Publication number: 20200185862
    Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
    Type: Application
    Filed: February 13, 2020
    Publication date: June 11, 2020
    Inventors: John A. MONGOLD, Jonathan E. BUCK
  • Publication number: 20200176905
    Abstract: An electrical connector includes a substrate that includes a plurality of ground traces at first and second surfaces of the substrate, and a ground coupling assembly that couples pairs of ground traces at each of the first and second surfaces, and further couples the ground traces at the first surface to the ground traces at the second surface.
    Type: Application
    Filed: May 15, 2018
    Publication date: June 4, 2020
    Inventor: Jonathan E. BUCK
  • Patent number: D877084
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: March 3, 2020
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John A. Mongold
  • Patent number: D877700
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: March 10, 2020
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John A. Mongold
  • Patent number: D879724
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: March 31, 2020
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John A. Mongold
  • Patent number: D881133
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: April 14, 2020
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John A. Mongold
  • Patent number: D881134
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: April 14, 2020
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Patent number: D924169
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: July 6, 2021
    Assignee: SAMTEC, INC.
    Inventors: Jonathan E. Buck, John A. Mongold
  • Patent number: D926144
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: July 27, 2021
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck
  • Patent number: D926705
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: August 3, 2021
    Assignee: SAMTEC, INC.
    Inventors: Randall E. Musser, Jonathan E. Buck