Contact wafer
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Description
Claims
The ornamental design for contact wafer, as shown and described.
Referenced Cited
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Foreign Patent Documents
Other references
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Patent History
Patent number: D881133
Type: Grant
Filed: Dec 20, 2018
Date of Patent: Apr 14, 2020
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Bridget L Eland
Application Number: 29/652,017
Type: Grant
Filed: Dec 20, 2018
Date of Patent: Apr 14, 2020
Assignee: SAMTEC, INC. (New Albany, IN)
Inventors: Jonathan E. Buck (New Albany, IN), John A. Mongold (New Albany, IN)
Primary Examiner: Bridget L Eland
Application Number: 29/652,017
Classifications
Current U.S. Class:
Element Or Attachment (D13/154)