Abstract: A machine may be configured as a vehicle identification machine to identify a model of a vehicle based on an image that depicts a dashboard of the vehicle. As configured, the machine may receive an image of the dashboard, where the image depicts a layout of instrumentation within the dashboard. The machine may identify the layout of instrumentation by processing the image. For example, the machine may process the image by determining a position of an instrument within the layout of instrumentation, determining an outline of instrument, or both. The machine may access a data record that correlates a model of the vehicle with the identified layout of instrumentation and, based on the data record, identify the model of the vehicle. The machine may then provide a notification that references the vehicle, references the identified model of the vehicle, or references both.

Abstract: A machine may be configured as a vehicle identification machine to identify a model of a vehicle based on an image that depicts a dashboard of the vehicle. As configured, the machine may receive an image of the dashboard, where the image depicts a layout of instrumentation within the dashboard. The machine may identify the layout of instrumentation by processing the image. For example, the machine may process the image by determining a position of an instrument within the layout of instrumentation, determining an outline of instrument, or both. The machine may access a data record that correlates a model of the vehicle with the identified layout of instrumentation and, based on the data record, identify the model of the vehicle. The machine may then provide a notification that references the vehicle, references the identified model of the vehicle, or references both.

Abstract: Methods and systems for knockdown and neutralization of toxic clouds of aerosolized chemical or biological warfare (CBW) agents and toxic industrial chemicals using a non-toxic, non-corrosive aqueous decontamination formulation.

Abstract: Methods and systems for knockdown and neutralization of toxic clouds of aerosolized chemical or biological warfare (CBW) agents and toxic industrial chemicals using a non-toxic, non-corrosive aqueous decontamination formulation.

Abstract: Embodiments relate to a substrate or wafer edge support having an emmisivity greater than that of a silicon wafer, where the edge support is for supporting a wafer during processing to form circuit devices on or in the wafer. Embodiments also include temperature sensors, heat conducting gas jets, and photonic energy can be directed to sense and control the temperature of the edge support and/or wafer edge during annealing to reduce temperature roll-off or roll-up at the edge as compared to the center of the wafer. Specifically, use of an edge support having an emmisivity greater than or equal to that of the wafer during processing allows helium gas jets directed at the edge support and/or wafer edge to reduce temperature roll-up at the edge during annealing. Because wafers from different processes and anneal locations may all have different emmisivities, use of the feedback loop will enable one edge ring to support the uniform anneal of wafers with a range of different emmisivities.

Abstract: Embodiments relate to a substrate or wafer edge support having an emmisivity greater than that of a silicon wafer, where the edge support is for supporting a wafer during processing to form circuit devices on or in the wafer. Embodiments also include temperature sensors, heat conducting gas jets, and photonic energy can be directed to sense and control the temperature of the edge support and/or wafer edge during annealing to reduce temperature roll-off or roll-up at the edge as compared to the center of the wafer. Specifically, use of an edge support having an emmisivity greater than or equal to that of the wafer during processing allows helium gas jets directed at the edge support and/or wafer edge to reduce temperature roll-up at the edge during annealing. Because wafers from different processes and anneal locations may all have different emmisivities, use of the feedback loop will enable one edge ring to support the uniform anneal of wafers with a range of different emmisivities.