Patents by Inventor Jonathan P. Comeau
Jonathan P. Comeau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11949164Abstract: Register banks are used to allow for fast beam switching in a phased array system. Each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be pre-programmed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: GrantFiled: January 27, 2023Date of Patent: April 2, 2024Assignee: Anokiwave, Inc.Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Publication number: 20240088555Abstract: A beamforming IC operates in a transmit mode or a receive mode to respectively transmit and receive signals at different times. To that end, the beamforming IC has an element interface, a transmit branch configured to produce an output transmit signal through the element interface when in the transmit mode, and a receive branch configured to receive an input signal through the element interface when in the receive mode. The beamforming circuit also has a sampling circuit with an electrical coupling with the transmit branch. The sampling circuit is configured to sample the output transmit signal with the electrical coupling to produce a sample signal. The sampling circuit also is configured to direct the sample signal through the receive branch, which is configured to modify the phase of the sample signal to produce a modified sample signal. This modified sample signal can be used to manage the IC transmission.Type: ApplicationFiled: May 5, 2023Publication date: March 14, 2024Inventors: Saeed Farsi, Vipul Jain, Zarion Jacobs, Jonathan P. Comeau, Shmuel Ravid, Hakan Coskun
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Publication number: 20230275363Abstract: Register banks are used to allow for fast beam switching in a phased array system. Each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be pre-programmed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: ApplicationFiled: January 27, 2023Publication date: August 31, 2023Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Patent number: 11652267Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.Type: GrantFiled: July 7, 2021Date of Patent: May 16, 2023Assignee: Anokiwave, Inc.Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
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Patent number: 11637371Abstract: A phased array system has a plurality of beam-forming elements, and a plurality of beam-forming integrated circuits in communication with the beam-forming elements. Each beam-forming integrated circuit has a corresponding register bank with a plurality of addressable and programmable register sets. In addition, each beam-forming integrated circuit has at least two different types of beam-forming ports. Specifically, each beam-forming element has a serial data port for receiving serial messages, and a parallel mode data port for receiving broadcast messages. Both the serial and broadcast messages manage the data in its register bank. The beam-forming integrated circuits receive the broadcast messages in parallel with the other beam-forming integrated circuits, while the beam-forming integrated circuits receive the serial messages serially—sequentially with regard to other beam-forming integrated circuits.Type: GrantFiled: June 30, 2021Date of Patent: April 25, 2023Assignee: Anokiwave, Inc.Inventors: Vipul Jain, Scott Humphreys, David W. Corman, Robert Ian Gresham, Kristian N. Madsen, Robert J. McMorrow, Jonathan P. Comeau, Nitin Jain, Gaurav Menon
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Publication number: 20220013922Abstract: In certain exemplary embodiments, register banks are used to allow for fast beam switching (FBS) in a phased array system. Specifically, each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be pre-programmed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Additionally or alternatively, active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: ApplicationFiled: September 23, 2021Publication date: January 13, 2022Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Patent number: 11177227Abstract: A phased array has a laminar substrate, a plurality of elements on the laminar substrate forming a patch phased array, and integrated circuits on the laminar substrate. Each integrated circuit is a high frequency integrated circuit configured to control receipt and/or transmission of signals by the plurality of elements in the patch phased array. In addition, each integrated circuit has a substrate side coupled with the laminar substrate, and a back side. The phased array also has a plurality of heat sinks. Each integrated circuit is coupled with at least one of the heat sinks. At least one of the integrated circuits has a thermal interface material in conductive thermal contact with its back side. The thermal interface material thus is between the at least one integrated circuit and one of the heat sinks. Preferably, the thermal interface material has a magnetic loss tangent value of between 0.5 and 4.5.Type: GrantFiled: May 28, 2020Date of Patent: November 16, 2021Assignee: Anokiwave, Inc.Inventors: Gaurav Menon, Jonathan P. Comeau, Nitin Jain
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Publication number: 20210344099Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.Type: ApplicationFiled: July 7, 2021Publication date: November 4, 2021Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
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Publication number: 20210328345Abstract: A phased array system has a plurality of beam-forming elements, and a plurality of beam-forming integrated circuits in communication with the beam-forming elements. Each beam-forming integrated circuit has a corresponding register bank with a plurality of addressable and programmable register sets. In addition, each beam-forming integrated circuit has at least two different types of beam-forming ports. Specifically, each beam-forming element has a serial data port for receiving serial messages, and a parallel mode data port for receiving broadcast messages. Both the serial and broadcast messages manage the data in its register bank. The beam-forming integrated circuits receive the broadcast messages in parallel with the other beam-forming integrated circuits, while the beam-forming integrated circuits receive the serial messages serially—sequentially with regard to other beam-forming integrated circuits.Type: ApplicationFiled: June 30, 2021Publication date: October 21, 2021Inventors: Vipul Jain, Scott Humphreys, David W. Corman, Robert Ian Gresham, Kristian N. Madsen, Robert J. McMorrow, Jonathan P. Comeau, Nitin Jain, Gaurav Menon
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Patent number: 11133603Abstract: In certain exemplary embodiments, register banks are used to allow for fast beam switching (FBS) in a phased array system. Specifically, each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be pre-programmed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Additionally or alternatively, active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: GrantFiled: November 16, 2020Date of Patent: September 28, 2021Assignee: Anokiwave, Inc.Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Patent number: 11081792Abstract: A phased array system has a plurality of beam-forming elements, and a plurality of beam-forming integrated circuits in communication with the beam-forming elements. Each beam-forming integrated circuit has a corresponding register bank with a plurality of addressable and programmable register sets. In addition, each beam-forming integrated circuit has at least two different types of beam-forming ports. Specifically, each beam-forming element has a serial data port for receiving serial messages, and a parallel mode data port for receiving broadcast messages. Both the serial and broadcast messages manage the data in its register bank. The beam-forming integrated circuits receive the broadcast messages in parallel with the other beam-forming integrated circuits, while the beam-forming integrated circuits receive the serial messages serially—sequentially with regard to other beam-forming integrated circuits.Type: GrantFiled: March 7, 2019Date of Patent: August 3, 2021Assignee: Anokiwave, Inc.Inventors: Vipul Jain, Scott Humphreys, David W. Corman, Robert Ian Gresham, Kristian N. Madsen, Robert J. McMorrow, Jonathan P. Comeau, Nitin Jain, Gaurav Menon
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Patent number: 11063336Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.Type: GrantFiled: April 4, 2019Date of Patent: July 13, 2021Assignee: Anokiwave, Inc.Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
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Publication number: 20210151876Abstract: A beamforming IC operates in a transmit mode or a receive mode to respectively transmit and receive signals at different times. To that end, the beamforming IC has an element interface, a transmit branch configured to produce an output transmit signal through the element interface when in the transmit mode, and a receive branch configured to receive an input signal through the element interface when in the receive mode. The beamforming circuit also has a sampling circuit with an electrical coupling with the transmit branch. The sampling circuit is configured to sample the output transmit signal with the electrical coupling to produce a sample signal. The sampling circuit also is configured to direct the sample signal through the receive branch, which is configured to modify the phase of the sample signal to produce a modified sample signal. This modified sample signal can be used to manage the IC transmission.Type: ApplicationFiled: November 13, 2020Publication date: May 20, 2021Inventors: Saeed Farsi, Vipul Jain, Zarion Jacobs, Jonathan P. Comeau, Shmuel Ravid, Hakan Coskun
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Publication number: 20210075125Abstract: In certain exemplary embodiments, register banks are used to allow for fast beam switching (FBS) in a phased array system. Specifically, each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be pre-programmed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Additionally or alternatively, active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: ApplicationFiled: November 16, 2020Publication date: March 11, 2021Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Publication number: 20210043996Abstract: An integrated circuit system has a die with first and second sides, and contains high frequency circuitry operating at mm-wave frequencies. The system also has a plurality of interfaces (on the first side) in electrical communication with the high frequency circuitry, and a heat sink having a bottom surface with a first region and an aperture region. The first region is in physical and conductive contact with the die, while the aperture region forms a concavity with an inner concave surface that is spaced from the die.Type: ApplicationFiled: October 12, 2020Publication date: February 11, 2021Inventors: Gaurav Menon, Jonathan P. Comeau, Andrew M. Street, Scott Mitchell, Robert J. McMorrow, Christopher Jones
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Patent number: 10862222Abstract: In certain exemplary embodiments, register banks are used to allow for fast beam switching (FBS) in a phased array system. Specifically, each beam forming channel is associated with a register bank containing M register sets for configuring such things as gain/amplitude and phase parameters of the beam forming channel. The register banks for all beam forming channels can be preprogrammed and then fast beam switching circuitry allows all beam forming channels across the array to be switched to use the same register set from its corresponding register bank at substantially the same time, thereby allowing the phased array system to be quickly switched between various beam patterns and orientations. Additionally or alternatively, active power control circuitry may be used to control the amount of electrical power provided to or consumed by one or more individual beam forming channels such as to reduce DC power consumption of the array and/or to selectively change the effective directivity of the array.Type: GrantFiled: June 10, 2019Date of Patent: December 8, 2020Assignee: Anokiwave, Inc.Inventors: Kristian N. Madsen, Wade C. Allen, Jonathan P. Comeau, Robert J. Mcmorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain
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Patent number: 10833391Abstract: An integrated circuit system has a die with first and second sides, and contains high frequency circuitry operating at mm-wave frequencies. The system also has a plurality of interfaces (on the first side) in electrical communication with the high frequency circuitry, and a heat sink having a bottom surface with a first region and an aperture region. The first region is in physical and conductive contact with the die, while the aperture region forms a concavity with an inner concave surface that is spaced from the die.Type: GrantFiled: October 5, 2018Date of Patent: November 10, 2020Assignee: ANOKIWAVE, INC.Inventors: Gaurav Menon, Jonathan P. Comeau, Andrew Street, Scott Mitchell, Robert J. McMorrow, Christopher Jones
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Publication number: 20200350677Abstract: A phased array system has a plurality of beam-forming elements, and a plurality of beam-forming integrated circuits in communication with the beam-forming elements. Each beam-forming integrated circuit has a corresponding register bank with a plurality of addressable and programmable register sets. In addition, each beam-forming integrated circuit has at least two different types of beam-forming ports. Specifically, each beam-forming element has a serial data port for receiving serial messages, and a parallel mode data port for receiving broadcast messages. Both the serial and broadcast messages manage the data in its register bank. The beam-forming integrated circuits receive the broadcast messages in parallel with the other beam-forming integrated circuits, while the beam-forming integrated circuits receive the serial messages serially—sequentially with regard to other beam-forming integrated circuits.Type: ApplicationFiled: March 7, 2019Publication date: November 5, 2020Inventors: Vipul Jain, Scott Humphreys, David W. Corman, Robert Ian Gresham, Kristian N. Madsen, Robert J. McMorrow, Jonathan P. Comeau, Nitin Jain, Gaurav Menon
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Publication number: 20200294942Abstract: A phased array has a laminar substrate, a plurality of elements on the laminar substrate forming a patch phased array, and integrated circuits on the laminar substrate. Each integrated circuit is a high frequency integrated circuit configured to control receipt and/or transmission of signals by the plurality of elements in the patch phased array. In addition, each integrated circuit has a substrate side coupled with the laminar substrate, and a back side. The phased array also has a plurality of heat sinks. Each integrated circuit is coupled with at least one of the heat sinks. At least one of the integrated circuits has a thermal interface material in conductive thermal contact with its back side. The thermal interface material thus is between the at least one integrated circuit and one of the heat sinks. Preferably, the thermal interface material has a magnetic loss tangent value of between 0.5 and 4.5.Type: ApplicationFiled: May 28, 2020Publication date: September 17, 2020Inventors: Gaurav Menon, Jonathan P. Comeau, Nitin Jain
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Patent number: 10763226Abstract: A phased array has a laminar substrate, a plurality of elements on the laminar substrate forming a patch phased array, and integrated circuits on the laminar substrate. Each integrated circuit is a high frequency integrated circuit configured to control receipt and/or transmission of signals by the plurality of elements in the patch phased array. In addition, each integrated circuit has a substrate side coupled with the laminar substrate, and a back side. The phased array also has a plurality of heat sinks. Each integrated circuit is coupled with at least one of the heat sinks. At least one of the integrated circuits has a thermal interface material in conductive thermal contact with its back side. The thermal interface material thus is between the at least one integrated circuit and one of the heat sinks. Preferably, the thermal interface material has a magnetic loss tangent value of between 0.5 and 4.5.Type: GrantFiled: October 5, 2018Date of Patent: September 1, 2020Assignee: ANOKIWAVE, INC.Inventors: Gaurav Menon, Jonathan P. Comeau, Nitin Jain