Patents by Inventor Jonathan S. Hacker

Jonathan S. Hacker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of manufacturing multi-die semiconductor device packages and related assemblies
    Patent number: 9865578
    Abstract: Methods of making semiconductor device packages may involve attaching a first semiconductor die to a carrier wafer, an inactive surface of the first semiconductor die facing the carrier wafer. One or more additional semiconductor die may be stacked on the first semiconductor die on a side of the first semiconductor die opposite the carrier wafer to form a stack of semiconductor dice. A protective material may be positioned over the stack of semiconductor dice, a portion of the protective material extending along side surfaces of the first semiconductor die to a location proximate the inactive surface of the first semiconductor die. The carrier wafer may be detached from the first semiconductor die.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: January 9, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Wei Zhou, Aibin Yu, Zhaohui Ma, Sony Varghese, Jonathan S. Hacker, Bret K. Street, Shijian Luo
  • METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AND RELATED ASSEMBLIES
    Publication number: 20160358898
    Abstract: Methods of making semiconductor device packages may involve attaching a first semiconductor die to a carrier wafer, an inactive surface of the first semiconductor die facing the carrier wafer. One or more additional semiconductor die may be stacked on the first semiconductor die on a side of the first semiconductor die opposite the carrier wafer to form a stack of semiconductor dice. A protective material may be positioned over the stack of semiconductor dice, a portion of the protective material extending along side surfaces of the first semiconductor die to a location proximate the inactive surface of the first semiconductor die. The carrier wafer may be detached from the first semiconductor die.
    Type: Application
    Filed: June 4, 2015
    Publication date: December 8, 2016
    Inventors: Wei Zhou, Aibin Yu, Zhaohui Ma, Sony Varghese, Jonathan S. Hacker, Bret K. Street, Shijian Luo