Abstract: A device comprising a chip including a substrate defining one or more electronic devices and a printed circuit board electrically connected to the chip via one or more solder elements sandwiched between the chip and the printed circuit board, and the solder elements, said buffer layers having a Young's Modulus of 2.5GPa or less.

Abstract: A security apparatus for securing a portable device includes a housing having a first housing portion configured to partially surround a first portion of the portable device, and a second housing portion configured to partially surround a second portion of the portable device. The second housing portion is selectively secured to the first housing portion when the housing is engaged with the portable device. The security apparatus also includes an attachment device extending from the housing. The attachment device is configured to engage a locking head. The security apparatus further includes a modular accessory coupled to the housing. The modular accessory is connected to the housing when the first and second housing portions are secured together to surround the portable device. The modular accessory is only removable from the housing when the first and second housing portions are disconnected from the portable electronic device.

Abstract: An electrical interconnect for connecting an IC chip to a PCB, the electrical interconnect comprising a plurality of connection elements for connection to the PCB attached to a first surface of the electrical interconnect, wherein the amount of thermal and/or mechanical stress that each solder element connection can take before failing is improved.

Abstract: A security apparatus for a portable electronic device is provided. The security apparatus may include a plurality of shell portions, each shaped to wrap around part of a perimeter of the portable electronic device. The security apparatus may further include a connecting portion that engages at least one of the plurality of shell portions and to thereby couple the plurality of shell portions to each other. At least one of the connecting portion and one or more of the plurality of shell portions may include an attachment device, the attachment device being configured to engage with a locking head, thereby locking relative positions of the plurality of shell portions and the connecting portion.

Abstract: Methods of fabricating a QFN with wettable flank are described. In an embodiment, a leadframe is used which comprises regions of reduced thickness dam bar which extend across an edge of a kerf width and the QFN are formed using film assisted molding with a shaped mold chase that comprises raised portions which correspond in shape and position to the one or more regions of reduced thickness in the leadframe. The shaped mold chase prevents mold compound from filling recesses under the regions of reduced thickness of leadframe and once diced, each QFN has an edge structure which comprises a small step, into which solder will wet where there are exposed plated leads.

Abstract: In some embodiments of the invention, a security apparatus for a portable electronic device is provided. The security apparatus may include a plurality of shell portions, each shaped to wrap around part of a perimeter of the portable electronic device. The security apparatus may further include a connecting portion that engages at least one of the plurality of shell portions and to thereby couple the plurality of shell portions to each other. At least one of the connecting portion and one or more of the plurality of shell portions may include an attachment device, the attachment device being configured to engage with a locking head, thereby locking relative positions of the plurality of shell portions and the connecting portion.

Abstract: A security apparatus for securing a portable device includes a housing having a first housing portion configured to partially surround a first portion of the portable device, and a second housing portion configured to partially surround a second portion of the portable device. The second housing portion is selectively secured to the first housing portion when the housing is engaged with the portable device. The security apparatus also includes an attachment device extending from the housing. The attachment device is configured to engage a locking head. The security apparatus further includes a modular accessory coupled to the housing. The modular accessory is connected to the housing when the first and second housing portions are secured together to surround the portable device. The modular accessory is only removable from the housing when the first and second housing portions are disconnected from the portable electronic device.

Abstract: A method for forming a stacked integrated circuit package of primary dies on a carrier die, includes forming electrically conductive pillars at connection pads defined on an active face of a carrier wafer incorporating carrier integrated circuits, the electrically conductive pillars providing electrical connections to said carrier integrated circuits; attaching primary dies to the active face of the carrier wafer, each supporting electrically conductive pillars at connection pads defined on an active face of the primary die; encapsulating the active face of the carrier wafer and the primary dies attached thereto in an insulating material; producing a wafer package by removing a thickness of the insulating layer sufficient to expose the electrically conductive pillars; and singulating the carrier wafer to form stacked integrated circuit packages, each package comprising at least one primary die on a carrier die.

Abstract: In some embodiments of the invention, a security apparatus for a portable electronic device is provided. The security apparatus may include a plurality of interlocking shell portions, wherein the interlocking shell portions are shaped to, when interlocked, wrap around at least part of a perimeter of the portable electronic device, and wherein at least two shell portions comprise an aperture. The security apparatus may also include an attachment device configured to be at least partly inserted into the apertures of the at least two shell portions.

Abstract: In some embodiments of the invention, a security apparatus for a portable electronic device is provided. The security apparatus may include a plurality of shell portions, each shaped to wrap around part of a perimeter of the portable electronic device. The security apparatus may further include a connecting portion that engages at least one of the plurality of shell portions and to thereby couple the plurality of shell portions to each other. At least one of the connecting portion and one or more of the plurality of shell portions may include an attachment device, the attachment device being configured to engage with a locking head, thereby locking relative positions of the plurality of shell portions and the connecting portion.

Abstract: An electrical interconnect for connecting an IC chip to a PCB, the electrical interconnect comprising a plurality of connection elements for connection to the PCB attached to a first surface of the electrical interconnect, wherein the amount of thermal and/or mechanical stress that each solder element connection can take before failing is improved.

Abstract: A method for forming a stacked integrated circuit package of primary dies on a carrier die, includes forming electrically conductive pillars at connection pads defined on an active face of a carrier wafer incorporating carrier integrated circuits, the electrically conductive pillars providing electrical connections to said carrier integrated circuits; attaching primary dies to the active face of the carrier wafer, each supporting electrically conductive pillars at connection pads defined on an active face of the primary die; encapsulating the active face of the carrier wafer and the primary dies attached thereto in an insulating material; producing a wafer package by removing a thickness of the insulating layer sufficient to expose the electrically conductive pillars; and singulating the carrier wafer to form stacked integrated circuit packages, each package comprising at least one primary die on a carrier die.

Abstract: A method of providing connections to a chip having contact pads on the surface thereof, comprising: locating a discrete solder element on each pad; and melting the discrete solder elements so as to cause each of them to adhere to the respective pad, thereby forming a solder bump extending from the surface of the chip; wherein the size of each discrete solder element relative to the area of the pad on which it is located is such that the height of each bump is less than 70% of the diameter of the solder element that formed it.

Abstract: A test probe is configured to provide conductive contact with a surface on application of the probe to the surface. The probe includes a probe body having a proximal and distal end, a probe tip located at the distal end of the probe body, the probe being configured such that, when the probe tip is applied to the surface, the probe tip is moved to rotate about its axis, whereby the shaft tip can rotatably remove oxidation and/or contamination debris from between the shaft tip and the surface.

Abstract: A method of providing connections to a chip having contact pads on the surface thereof, comprising: locating a discrete solder element on each pad; and melting the discrete solder elements so as to cause each of them to adhere to the respective pad, thereby forming a solder bump extending from the surface of the chip; wherein the size of each discrete solder element relative to the area of the pad on which it is located is such that the height of each bump is less than 70% of the diameter of the solder element that formed it.

Abstract: A method of semiconductor wafer fabrication. The wafer is fabricated by receiving a semiconductor wafer having a substrate layer and at least one processed layer, cutting a trench into the wafer, wherein the trench penetrates through the at least one processed layer and only partially through the thickness of the substrate layer, and depositing a passivation layer over the at least one processed layer such that the trench is filled with the passivation material.

Abstract: A device comprising a chip including a substrate defining one or more electronic devices and a printed circuit board electrically connected to the chip via one or more solder elements sandwiched between the chip and the printed circuit board, and the solder elements, said buffer layers having a Young's Modulus of 2.5 GPa or less.

Abstract: A holding device. The holding device can hold portable objects such as MP3 players, mobile phones, navigation devices, etc. The holding device has one or more arms, which can grip the portable object. In predetermined orientations, one arm is prevented from moving outward, to prevent the held portable object from falling even when it is being inserted or removed from the holder.

Abstract: A docking assembly including a port replicating apparatus is disclosed. The docking assembly includes a port replicating apparatus including (i) a housing having a major dimension defined by a first terminal end and a second terminal end, (ii) at least one interface for connecting to a portable electronic device, and (iii) a plurality of connectors in the housing for connecting to a plurality of peripheral devices. A base is also included in the docking assembly. It is capable of mechanically coupling to at least the first terminal end of the housing of the port replicating apparatus, such that the major dimension of the housing is vertically oriented.