Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than the top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall includes: a first inner wall extending from the bottom surface and having a first inclination angle; and a second inner wall extending from the first inner wall and having a second inclination angle different from the first inclination angle.

Abstract: A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a plurality of pads disposed on the first insulating layer and having top surfaces exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned higher than a top surface of the first insulating layer; and an inner wall extending from the bottom surface, wherein the inner wall is perpendicular to top or bottom surface of the second insulating layer, wherein the bottom surface of the cavity includes: a first bottom surface positioned lower than a top surface of the pad and positioned outside an arrangement region of the plurality of pads; and a second bottom surface positioned lower than the top surface of the pad and positioned inside the arrangement region of the plurality of pads, and wherein a height of the first bottom surface is different from a height of the second bottom surface.

Abstract: A circuit board according to an embodiment includes a first insulating layer; a first circuit pattern disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and including a cavity, wherein an upper surface of the first insulating layer includes a first region that does not vertically overlap the cavity; a second region vertically overlapping the cavity; and a boundary region between the first region and the second region, the first circuit pattern includes a first-first circuit pattern disposed on the boundary region of the first insulating layer, the first-first circuit pattern includes a first portion that does not vertically overlap the cavity; and a second portion connected to the first portion and vertically overlapping the cavity, and a thickness of the first portion of the first-first circuit pattern is different from a thickness of the second portion of the first-first circuit pattern.

Abstract: A printed circuit board according to an embodiment comprises: a first insulation layer; a first circuit pattern disposed on one surface of the first insulation layer and including a pad; and a second insulation layer disposed on one surface of the first insulation layer and including a cavity exposing the pad, wherein the first circuit pattern includes a 1-1 metal layer disposed on one surface of the first insulation layer, and a 1-2 metal layer disposed on one surface of the 1-1 metal layer, wherein the area of the 1-1 metal layer is greater than the area of the 1-2 metal layer, and at least a portion of a side surface of the 1-1 metal layer is exposed through the cavity.

Abstract: A printed circuit board according to an embodiment includes a first insulating layer, a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and having an upper surface exposed through the cavity; wherein the cavity includes a first part including a first inner wall; and a second part including a second inner wall under the first part; and wherein an inclination angle of the first inner wall is different from an inclination angle of the second inner wall.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: An embodiment of the present invention relates to a vehicle lamp structure capable of removing condensation from a lens part, in which a heat source is supplied to a heat absorbing part of a thermoelectric module to increase a temperature of a cooling region, together with a temperature of a heat generation part (a heat generation region) of the thermoelectric module, thereby improving limited heat conversion efficiency of the thermoelectric module, and furthermore, a hot current of air and a high-temperature heat source are supplied to a lens part of a head lamp, thereby maximizing dehumidification efficiency in the lamp.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: According to one embodiment, a cup holder is disclosed. The cup holder comprises: a holder body; a thermoelectric element disposed at a lower part of the holder body; a heat sink disposed at a lower part of the thermoelectric element; and a fan disposed on a side surface of the holder body, and discharging, through the heat sink, air suctioned from the side surface of the holder body.

Abstract: Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other; a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively; and a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.

Abstract: An embodiment of the present invention relates to a vehicle lamp structure capable of removing condensation from a lens part, in which a heat source is supplied to a heat absorbing part of a thermoelectric module to increase a temperature of a cooling region, together with a temperature of a heat generation part (a heat generation region) of the thermoelectric module, thereby improving limited heat conversion efficiency of the thermoelectric module, and furthermore, a hot current of air and a high-temperature heat source are supplied to a lens part of a head lamp, thereby maximizing dehumidification efficiency in the lamp.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: Embodiments of the present invention relate to a beverage keeping apparatus capable of cooling and warming, and a container accommodation apparatus that includes an accommodation unit including a container accommodation member configured to accommodate a container therein and a thermoelectric module which is disposed at an external surface of the container accommodation member and applies thermal conversion effect, an extension unit which is coupled to a lower portion of the accommodation unit, extends from an inside to an outside of a case member, and fixes and supports the accommodation unit, and a housing unit which includes a circulation control module which performs control of the thermoelectric module from an outside thereof.

Abstract: Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.

Abstract: The embodiment of the present invention relates to equipment for accommodating a beverage for a vehicle capable of performing cooling and heating operations and an apparatus for accommodating a beverage for a vehicle which provides a cup holder for a vehicle having an improved structure capable of being detachably attached to places at a cup holder provided in the vehicle so that the convenience of use can be improved, and at the same time may combine frames having various sizes to change an insertion diameter of the cup holder to allow the apparatus to be easily mounted in a conventional cup holder for a vehicle so that the apparatus can be applied to various kinds of vehicles.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module, and may provide a thermoelectric element and a thermoelectric module having notably improved cooling capacity (Qc) and rate of temperature change (AT) to be provided by constructing the thermoelectric element by stacking unit members, each of which comprises a semiconductor layer on a substrate, thereby lowering thermal conductivity and raising electric conductivity.

Abstract: Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other; a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively; and a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.