Abstract: A camera module includes: a first body including a substrate; an image sensor mounted on the substrate; a second body including a lens module; a ball bearing disposed between the first body and the second body to enable movement of the second body relative to the first body; and a driving member disposed between the first body and the second body to provide driving force to move the second body in at least one direction intersecting an optical axis.

Abstract: A printed circuit board includes a first insulating layer; a first metal layer having a part protruding beyond the first insulating layer and another part buried in the first insulating layer; and a barrier layer disposed on the first insulating layer. The barrier layer includes an inorganic oxide film.

Abstract: A printed circuit board includes an insulating layer and a wiring pattern disposed on or within the insulating layer, wherein the wiring pattern includes a first metal layer, a second metal layer disposed on an upper surface of the first metal layer, and an inorganic oxide film disposed on a side surface of the second metal layer.

Abstract: A ceiling-mounted shower booth includes: an upper frame unit mounted on top of an installation space; a lower bottom unit located under the upper frame unit and having an accommodation space whose top is open formed therein to accommodate water falling down thereabove; and an ascending and descending unit adapted to selectively move the lower bottom unit so that the lower bottom unit becomes close to and distant from the upper frame unit.

Abstract: A printed circuit board includes a wiring portion including one or more insulating layers, one or more wiring layers respectively disposed on or in the one or more insulating layers, a first pad disposed on a lowermost insulating layer, of the one or more insulating layers, and a second pad disposed on an uppermost insulating layer, of the one or more insulating layers, a first solder resist layer disposed on a lower side of the wiring portion to cover at least a portion of the first pad, the first solder resist layer having a first opening, on the first pad, a second solder resist layer disposed on an upper side of the wiring portion to cover at least a portion of the second pad, a first surface treatment layer disposed on at least a portion of the first pad, and a barrier layer disposed on the first solder resist layer.

Abstract: A printed circuit board includes: a first insulating layer; a first wiring layer embedded in the first insulating layer on one side thereof; a glass layer disposed on the other side, opposite to the one side of the first insulating layer; a second wiring layer disposed on the glass layer; and a first via layer connecting the first wiring layer and the second wiring layer to each other, and including a first via portion penetrating the glass layer and a second via portion penetrating the first insulating layer. In a cross-sectional view of the printed circuit board, at least one of the first via portion and the second via portion has a width becoming substantially narrower toward the first wiring layer.

Abstract: The present disclosure relates to a printed circuit board, including: a plurality of insulating layers having a through-portion; a plurality of wiring layers respectively disposed on or in the plurality of insulating layers; a plurality of via layers respectively penetrating through at least a portion of at least one of the plurality of insulating layers and respectively connected to at least one of the plurality of wiring layers; an electronic component at least partially disposed in the through-portion, and embedded in at least one of the plurality of insulating layers; and an insulating film disposed in the plurality of insulating layers, and covering at least a portion of a side surface of the electronic component and at least a portion of a wall surface of the through-portion.

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first insulating layer, a first metal layer disposed on an upper side of the first insulating layer, a second metal layer disposed on a lower side of the first insulating layer, and a first via layer penetrating through at least a portion of the first insulating layer to connect the first metal layer to the second metal layer. The first via layer has a tapered shape becoming narrower toward a top of the first insulating layer, and an upper surface of the first metal layer is substantially flat, and a side surface of the first metal layer has a curved surface.

Abstract: A printed circuit board includes a first insulating layer; a first wiring layer disposed on an upper surface of the first insulating layer; a second insulating layer disposed on the upper surface of the first insulating layer and having a cavity; and a first barrier layer having at least a portion disposed between the first and second insulating layers and in contact with a side surface of at least a portion of the first wiring layer.

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first insulating layer, a first metal layer having a first portion protruding upwardly of the first insulating layer and a second portion embedded in the first insulating layer, and a barrier layer disposed at a boundary between the first insulating layer and the second portion and extending to a lower surface of the first insulating layer. The first portion and the second portion are integrated.

Abstract: The present disclosure relates to a printed circuit board include: a core layer including an inorganic insulating layer, a resin layer covering at least a portion of an external side surface of the inorganic insulating layer, and a second insulating layer covering at least a portion of a lower surface of each of the inorganic insulating layer and the resin layer and having an interlayer boundary with the resin layer; a first wiring layer disposed on an upper surface of the core layer; and a second wiring layer disposed on a lower surface of the core layer. The external side surface of the inorganic insulating layer is substantially perpendicular to at least one of the upper surface and the lower surface of the inorganic insulating, and a manufacturing method therefor.

Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.

Abstract: A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.

Abstract: An opening and closing structure of a glove box is proposed. The opening and closing structure of a glove box includes a handle rotatably provided at a front panel, a rotation unit connected to a longitudinal first portion of the handle, a first locking rod connected to the rotation unit, a gear unit connected to a longitudinal first portion of the first locking rod, and a second locking rod of which a longitudinal first portion is connected to the gear unit, wherein the rotation unit is configured to transmit power generated by the handle to the first locking rod while being rotatably disposed on the longitudinal first portion of the handle and an upper portion of a longitudinal center portion of the first locking rod.

Abstract: A printed circuit board includes a first substrate portion including a first insulating layer, a second insulating layer disposed on the first insulating layer, and a third insulating layer disposed on the second insulating layer; and a second substrate portion disposed on the first substrate portion and including a first fine insulating layer as a build-up insulating layer on an uppermost side of the first substrate portion and the second substrate portion. A thickness of the first insulating layer, a thickness of the second insulating layer, and a thickness of the third insulating layer are sequentially reduced. A thickness of the first fine insulating layer is lower than the thickness of the third insulating layer.

Abstract: An image sensor includes a substrate, a photoelectric conversion region disposed inside the substrate, a first active region disposed inside the substrate to include a ground region, a floating diffusion region, and a channel region for connecting the ground region and the floating diffusion region, a substrate trench disposed inside the channel region, a transfer gate disposed on a face of the substrate to include a lower gate which fills a part of the substrate trench and has a first width, and an upper gate having a second width smaller than the first width on the lower gate, and a gate spacer disposed inside the substrate trench to be interposed between the ground region and the upper gate.

Abstract: A method of manufacturing a printed circuit board includes: forming a resist layer; exposing first areas of the resist layer spaced apart from each other; after exposing the first areas, exposing second areas of the resist layer, the second areas being spaces between the first areas; forming first and second openings spaced apart from each other in the first and second areas by developing the resist layer; and forming a plurality of conductor patterns by filling the first and second openings with conductors.

Abstract: A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic insulating layer; a second seed metal layer disposed on the first seed metal layer and extending onto a wall surface of the via hole and the exposed upper surface of the first metal layer; and a second metal layer disposed on the second seed metal layer and filling at least a portion of the via hole, wherein the first seed metal layer includes a first sputtering layer including titanium (Ti), and the second seed metal layer includes an electroless plating layer.

Abstract: A coil component includes a body having a first surface and a second surface opposing each other in a first direction, a support member disposed in the body, the support member having a first surface and a second surface opposing each other, a coil disposed on the support member, a pad portion disposed on the first surface of the support member to be connected to the coil, an external electrode disposed on the first surface of the body, and a via electrode connecting the pad portion and the external electrode to each other.

Abstract: A printed circuit board including a first insulating layer; a plurality of first circuit patterns respectively disposed on the first insulating layer; a second insulating layer disposed on the first insulating layer and covering a portion of a side surface of each of the plurality of first circuit patterns; and an insulator disposed between at least one pair of adjacent first circuit patterns, among the plurality of first circuit patterns, and integrated with the first insulating layer, and a method for manufacturing a printed circuit board, are provided.