Patents by Inventor Jong-Geon Lee
Jong-Geon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12293081Abstract: The present disclosure relates to field of Dual In-Line Memory Modules that discloses method and system for generating memory maps. The method comprises detecting, by computing system, at least one of DIMM and one or more Dynamic Random Access Memory (DRAM) chips associated with computing system. The one or more accelerators are configured in at least one of DIMM and one or more DRAM chips. Further, the method includes determining accelerator information for each of one or more accelerators via at least one of Serial Presence Detect (SPD) and Multi-Purpose Register (MPR) associated with at least one of DIMM and one or more DRAM chips. Method includes generating unique memory map for each of one or more accelerators based on accelerator information of corresponding one or more accelerators. As a result, performance of computing system may be improved as accelerator capabilities of one or more accelerators are effectively utilized.Type: GrantFiled: May 2, 2023Date of Patent: May 6, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Raghu Vamsi Krishna Talanki, Archita Khare, Eldho P. Mathew, Jin In So, Jong-Geon Lee, Venkata Ravi Shankar Jonnalagadda, Vishnu Charan Thummala
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Publication number: 20250132093Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer, wherein the electrode layer includes a connection electrode layer including copper (Cu) and glass, and a band electrode layer including silver (Ag) and glass, and the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin.Type: ApplicationFiled: July 23, 2024Publication date: April 24, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Hoon YOO, Ji Hyun LEE, Dong Geon YOO, Eun Hye CHO
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Publication number: 20250125097Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, the body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, an external electrode including a lower electrode layer, the lower electrode layer disposed between extension lines of the first and second surfaces, an upper electrode layer disposed on the lower electrode layer, the upper electrode layer disposed to extend onto a portion of the first and the second surfaces, and a glass layer disposed between the lower and upper electrode layers. The lower electrode layer includes Ag and a first glass. The upper electrode layer includes Cu and a second glass.Type: ApplicationFiled: July 17, 2024Publication date: April 17, 2025Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Hoon YOO, Ji Hyun LEE, Dong Geon YOO, Eun Hye CHO
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Publication number: 20250077433Abstract: Memory systems and methods for operating the same. A memory system comprises a first memory, a second memory having an operating speed different from that of the first memory, a storage unit configured to store an instruction, a prefetcher configured to update prefetcher data in response to occurrence of cache hits and a processor configured to execute the instruction stored in the storage unit. When the instruction is executed, the processor is configured to generate prefetcher friendly data by filtering the prefetcher data, set a prefetcher friendly bit in a first pointer area corresponding to the first memory and a second pointer area corresponding to the second memory based on the prefetcher friendly data, and determine whether data of the first pointer area and the second pointer area are migrated, in consideration of a reference bit and the prefetcher friendly bit of the first and second pointer areas.Type: ApplicationFiled: March 14, 2024Publication date: March 6, 2025Applicants: SAMSUNG ELECTRONICS CO., LTD., Daegu Gyeongbuk Institute of Science and TechnologyInventors: Daehoon Kim, Hyungwon Park, Jin Jung, Minho Kim, Jin In So, Jong-Geon Lee, Hwanjun Lee, Minwoo Jang, Yeaji Jung
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Publication number: 20240394331Abstract: A compute express link (CXL) memory device includes a memory device storing data, and a controller configured to read the data from the memory device based on a first command received through a first protocol, select a calculation engine based on a second command received through a second protocol different from the first protocol, and control the calculation engine to perform a calculation on the read data.Type: ApplicationFiled: March 18, 2024Publication date: November 28, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sangsu PARK, Kyungsoo Kim, Nayeon Kim, Jinin So, Kyoungwan Woo, Younghyun Lee, Jong-Geon Lee, Jin Jung, Jeonghyeon Cho
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Patent number: 12138992Abstract: An air supply system for a vehicle includes a first system including a first compressor compressing ambient air, a heat exchanger connected to the first compressor to allow compressed air to flow therethrough, and a first condenser connected to the heat exchanger. The air supply system further includes a second system including a second compressor compressing a refrigerant, a second condenser disposed at a rear end of the second compressor, an expansion valve disposed at a rear end of the second compressor, and an evaporator disposed at a rear end of the expansion valve. The second compressor, the second condenser, the expansion valve, and the evaporator of the second system are sequentially connected by a refrigerant flow line, and a refrigerant pipe disposed in the evaporator of the second system and connected to the refrigerant flow line is connected to a refrigerant pipe for a first condenser.Type: GrantFiled: October 26, 2022Date of Patent: November 12, 2024Assignees: Hyundai Motor Company, Kia CorporationInventor: Jong Geon Lee
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Publication number: 20240295963Abstract: The present disclosure relates to field of Dual In-Line Memory Modules that discloses method and system for generating memory maps. The method comprises detecting, by computing system, at least one of DIMM and one or more Dynamic Random Access Memory (DRAM) chips associated with computing system. The one or more accelerators are configured in at least one of DIMM and one or more DRAM chips. Further, the method includes determining accelerator information for each of one or more accelerators via at least one of Serial Presence Detect (SPD) and Multi-Purpose Register (MPR) associated with at least one of DIMM and one or more DRAM chips. Method includes generating unique memory map for each of one or more accelerators based on accelerator information of corresponding one or more accelerators. As a result, performance of computing system may be improved as accelerator capabilities of one or more accelerators are effectively utilized.Type: ApplicationFiled: May 2, 2023Publication date: September 5, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Raghu Vamsi Krishna TALANKI, Archita KHARE, Eldho P. MATHEW, Jin In SO, Jong-Geon LEE, Venkata Ravi Shankar JONNALAGADDA, Vishnu Charan THUMMALA
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Publication number: 20240256185Abstract: A method for operating a Near Memory Processing (NMP) Dual In-line Memory Module (DIMM) for DIMM-to-DIMM communication is provided. The NMP DIMM includes one or more ports for communicative connection to other NMP DIMMs. The method includes parsing, by one NMP DIMM, a NMP command received from a processor of a host platform, identifying data dependencies on one or more other NMP DIMMs based on the parsing, establishing communication with the one or more other NMP DIMMs through one or more ports of the one NMP DIMM, receiving data from the one or more other NMP DIMMs through one or more ports of the one NMP DIMM, processing the NMP command using the data received from one of the one or more other NMP DIMMs and data present in the one NMP DIMM, and sending a NMP command completion notification to the processor of the host platform.Type: ApplicationFiled: April 8, 2024Publication date: August 1, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eldho Mathew PATHIYAKKARA THOMBRA, Prashant Vishwanath Mahendrakar, Jin In So, Jong-Geon Lee
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Patent number: 12045510Abstract: A Near Memory Processing (NMP) module including: a plurality of memory units; an Input/Output (I/O) interface configured to receive commands from a host system, wherein the host system includes a host memory controller configured to access the plurality of memory units; a decoder configured to decode the commands and generate a trigger; and an NMP memory controller configured to: receive the trigger from the decoder; and generate a signal in response to the trigger to synchronize the NMP module with the host system.Type: GrantFiled: July 27, 2022Date of Patent: July 23, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Eldho Pathiyakkara Thombra Mathew, Prashant Vishwanath Mahendrakar, Jin In So, Jong-Geon Lee
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Patent number: 11977780Abstract: A method for operating a Near Memory Processing (NMP) Dual In-line Memory Module (DIMM) for DIMM-to-DIMM communication is provided. The NMP DIMM includes one or more ports for communicative connection to other NMP DIMMs. The method includes parsing, by one NMP DIMM, a NMP command received from a processor of a host platform, identifying data dependencies on one or more other NMP DIMMs based on the parsing, establishing communication with the one or more other NMP DIMMs through one or more ports of the one NMP DIMM, receiving data from the one or more other NMP DIMMs through one or more ports of the one NMP DIMM, processing the NMP command using the data received from one of the one or more other NMP DIMMs and data present in the one NMP DIMM, and sending a NMP command completion notification to the processor of the host platform.Type: GrantFiled: May 17, 2022Date of Patent: May 7, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eldho Mathew Pathiyakkara Thombra, Prashant Vishwanath Mahendrakar, Jin In So, Jong-Geon Lee
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Patent number: 11922068Abstract: A Near Memory Processing (NMP) Dual In-line Memory Module (DIMM) is provided that includes random access memory (RAM), a Near-Memory-Processing (NMP) circuit and a first control port. The NMP circuit is for receiving a command from a host system, determining an operation to be performed on the RAM in response to the command, and a location of data within the RAM with respect to the determined operation. The first control port interacts with a second control port of the host system to enable the NMP circuit to exchange control information with the host system in response to the received command.Type: GrantFiled: February 7, 2022Date of Patent: March 5, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eldho Mathew Pathiyakkara Thombra, Ravi Shankar Venkata Jonnalagadda, Prashant Vishwanath Mahendrakar, Jinin So, Jong-Geon Lee, Vishnu Charan Thummala
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Publication number: 20240025377Abstract: An actuator for supplying compressed air for cleaning and drying a sensor of a vehicle, includes a compression unit configured to compress air from outside to form high-pressure compressed air, a drying unit configured to receive the compressed air compressed to a high pressure by the compression unit via a movement passage to remove moisture from the compressed air, and a storage tank connected to the drying unit via a connecting passage and configured to store the compressed air passing through the drying unit to be supplied to the vehicle, wherein the compressed air is stored in the storage tank so that high-pressure compressed air is generated and sprayed to the sensor of the vehicle, cleaning and drying the same in a short time.Type: ApplicationFiled: May 30, 2023Publication date: January 25, 2024Applicants: Hyundai Motor Company, Kia Corporation, DAEDONG MOVEL SYSTEM Co., Ltd.Inventors: Je Yeon Kim, Jong Geon Lee, Yoon Geun Cho, Byoung Jo Kim, Wan Cheol Lee, Yun Soo Kim
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Patent number: 11797440Abstract: A Near Memory Processing (NMP) dual in-line memory module (DIMM) for managing an address map is provided. The NMP DIMM includes: a static random-access memory (SRAM) provided on a Double Data Rate (DDR) interface; and an address management controller coupled to the SRAM, and configured to control the NMP DIMM to: receive a first indication from a host system to perform interface training for operating an SRAM space; perform the interface training using a first address map based on the first indication; receive a second indication from the host system indicating completion of the interface training for operating the SRAM space; switch from the first address map to a second address map for operating the SRAM space in response based on the second indication; and operate the SRAM space using the second address map.Type: GrantFiled: June 30, 2022Date of Patent: October 24, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Raghu Vamsi Krishna Talanki, Eldho Pathiyakkara Thombra Mathew, Vishnu Charan Thummala, Vinod Kumar Srinivasan, Jin In So, Jong-Geon Lee
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Publication number: 20230303036Abstract: A sensor cleaning apparatus includes an air compressor for compressing air, a compressor distributor connected to the air compressor, a nozzle connected to the compressor distributor for providing air to a sensor, and a control unit connected to at least one of the air compressor or the compressor distributor. The air compressor includes a housing that forms an internal space in which air may be compressed, and a cooling member provided on an external surface of the housing and connected to the compressor distributor.Type: ApplicationFiled: October 21, 2022Publication date: September 28, 2023Inventor: Jong Geon Lee
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Publication number: 20230302878Abstract: An air supply system for a vehicle includes a first system including a first compressor compressing ambient air, a heat exchanger connected to the first compressor to allow compressed air to flow therethrough, and a first condenser connected to the heat exchanger. The air supply system further includes a second system including a second compressor compressing a refrigerant, a second condenser disposed at a rear end of the second compressor, an expansion valve disposed at a rear end of the second compressor, and an evaporator disposed at a rear end of the expansion valve. The second compressor, the second condenser, the expansion valve, and the evaporator of the second system are sequentially connected by a refrigerant flow line, and a refrigerant pipe disposed in the evaporator of the second system and connected to the refrigerant flow line is connected to a refrigerant pipe for a first condenser.Type: ApplicationFiled: October 26, 2022Publication date: September 28, 2023Inventor: Jong Geon Lee
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Publication number: 20230185487Abstract: A Near Memory Processing (NMP) Dual In-line Memory Module (DIMM) is provided that includes random access memory (RAM), a Near-Memory-Processing (NMP) circuit and a first control port. The NMP circuit is for receiving a command from a host system, determining an operation to be performed on the RAM in response to the command, and a location of data within the RAM with respect to the determined operation. The first control port interacts with a second control port of the host system to enable the NMP circuit to exchange control information with the host system in response to the received command.Type: ApplicationFiled: February 7, 2022Publication date: June 15, 2023Inventors: ELDHO MATHEW PATHIYAKKARA THOMBRA, RAVI SHANKAR VENKATA JONNALAGADDA, PRASHANT VISHWANATH MAHENDRAKAR, JININ SO, JONG-GEON LEE, VISHNU CHARAN THUMMALA
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Publication number: 20230046552Abstract: A Near Memory Processing (NMP) module including: a plurality of memory units: an Input/Output (I/O) interface configured to receive commands from a host system, wherein the host system includes a host memory controller configured to access the plurality of memory units: a decoder configured to decode the commands and generate a trigger; and an NMP memory controller configured to: receive the trigger from the decoder; and generate a signal in response to the trigger to synchronize the NMP module with the host system.Type: ApplicationFiled: July 27, 2022Publication date: February 16, 2023Inventors: Eldho Pathiyakkara Thombra Mathew, Prashant Vishwanath Mahendrakar, Jin In SO, Jong-Geon LEE
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Publication number: 20230012707Abstract: A method and system for exchanging network packets in a memory system is provided. A size of each network packet to be transmitted is determined. Each network packets is segregated into one of plural queues based on the size of the network packet. Each network packet is transmitted over a shared memory, according to the queue in which the network packet is segregated.Type: ApplicationFiled: July 12, 2022Publication date: January 19, 2023Applicant: SAMSUNG ELECTRONICS CO, LTD.Inventors: Nitesh SHETTY, Rahul T R, Jin In SO, Jong- Geon LEE, Ravi Shankar Venkata JONNALAGADDA
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Publication number: 20230004489Abstract: A Near Memory Processing (NMP) dual in-line memory module (DIMM) for managing an address map is provided. The NMP DIMM includes: a static random-access memory (SRAM) provided on a Double Data Rate (DDR) interface; and an address management controller coupled to the SRAM, and configured to control the NMP DIMM to: receive a first indication from a host system to perform interface training for operating an SRAM space; perform the interface training using a first address map based on the first indication; receive a second indication from the host system indicating completion of the interface training for operating the SRAM space; switch from the first address map to a second address map for operating the SRAM space in response based on the second indication; and operate the SRAM space using the second address map.Type: ApplicationFiled: June 30, 2022Publication date: January 5, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Raghu Vamsi Krishna TALANKI, Eldho Pathiyakkara Thombra Mathew, Vishnu Charan Thummala, Vinod Kumar Srinivasan, Jin ln So, Jong-Geon Lee
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Patent number: 11531618Abstract: A memory module includes a first memory device, a second memory device, and a processing buffer circuit that is connected to the first memory device and the second memory device (independently of each other) and a host. A processing buffer circuit is provided, which includes a processing circuit and a buffer. The processing circuit processes at least one of data received from the host, data stored in the first memory device, or data stored in the second memory device based on a processing command received from the host. The buffer is configured to store data processed by the processing circuit. The processing buffer circuit is configured to communicate with the host in compliance with a DDR SDRAM standard.Type: GrantFiled: January 25, 2021Date of Patent: December 20, 2022Inventors: Kyungsoo Kim, Jinin So, Jong-Geon Lee, Yongsuk Kwon, Jin Jung, Jeonghyeon Cho