Abstract: The present invention relates to a method for preparing a tricyclic derivative, and more particulary, to a method for preparing a tricyclic derivative inetermediate with high yield and purity, the method including: introducing a hydroxy group by esterifying and substituting 2-fluoroisophthalic acid compound; introducing a piperidyl group; introducing a hydroxy group through reduction reaction; and then hydrolyzing the resultant compound, and to a method for preparing the tricyclic derivative using said intermediate. According to the method of the present invention, it is possible to provide a tricyclic derivative and an intermediate thereof with high productivity and economic feasibility as well as high purity and yield, by purifying a compound using re-crystallization unlike typical methods of using column chromatography.

Abstract: The present invention relates to a novel tricyclic derivative with efficient inhibitory activity against poly(ADP-ribose)polymerases (PARP) or pharmaceutically acceptable salts thereof, a preparation method thereof, and a pharmaceutical composition containing the same. The tricyclic derivative of the invention is useful for the prevention or treatment of diseases caused by excess PARP activity, especially neuropathic pain, neurodegenerative diseases, cardiovascular diseases, diabetic nephropathy, inflammatory diseases, osteoporosis, and cancer, by inhibiting the activity of poly(ADP-ribose)polymerases.

Abstract: A multi-chip stack package does not include a die pad. The elimination of the die pad provides more room for elements in the package which. Thus, a balanced inner package structure can be achieved, and a poor molding which may expose one of the package elements can be avoided. In the package, an upper chip is bonded to the top surface of a lower chip. To stabilize the chips, auxiliary or inner leads of a lead frame attach to the top surface of a lower chip. This shortens wire lengths between the chips and the inner leads. The shorter wires reduce wire loop heights and thus reduce the probability of exposing wires in a subsequent transfer-molding. A multi-chip stack package which includes an auxiliary lead(s) is also disclosed. The auxiliary leads attach to the top surface of the lower chip and can provide a stable support of a semiconductor chip and prevent the chip from tilting and shifting in transfer-molding. An auxiliary lead can be between the lower and upper chips.