Abstract: A jig for processing a via hole according to an embodiment is an auxiliary member having a plate shape disposed between a processing plate in which a suction portion is disposed at a lower portion and a workpiece, wherein the auxiliary member includes a plurality of first suction holes for sucking and supporting the workpiece by suction air provided through the suction portion, and each of the plurality of first suction holes includes a first suction hole portion extending in a first direction, and a second hole portion extending in a second direction different from the first direction, wherein the first direction is perpendicular to the second direction.

Abstract: A magnetic sheet according to an embodiment comprises: a first magnetic sheet part comprising a first surface; a second magnetic sheet part comprising a second surface facing the first surface; and an adhesion part disposed between the first surface and the second surface, wherein the adhesion part comprises a plurality of magnetic particles, and the plurality of magnetic particles may have a concentration gradient in the thickness direction of the adhesion part.

Abstract: A magnetic sheet according to an embodiment comprises: a first magnetic sheet part comprising a first surface; a second magnetic sheet part comprising a second surface facing the first surface; and an adhesion part disposed between the first surface and the second surface, wherein the adhesion part comprises a plurality of magnetic particles, and the plurality of magnetic particles may have a concentration gradient in the thickness direction of the adhesion part.

Abstract: A magnetic sheet according to an embodiment comprises: a first magnetic sheet portion comprising a first surface; a second magnetic sheet portion comprising a second surface that faces the first surface; and an attachment portion arranged between the first surface and the second surface, wherein the attachment portion may comprise a plurality of magnetic particles and a coating layer that is coated with the plurality of magnetic particles and comprises an organic material.

Abstract: An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).

Abstract: An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.

Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains alumina (Al2O3) and boron nitride (BN).

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes alumina (Al2O3) and aluminum nitride (AlN).

Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (Al2O3).

Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.

Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (Al2O3).

Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains alumina (Al2O3) and boron nitride (BN).

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes alumina (Al2O3) and aluminum nitride (AlN).

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN).

Abstract: An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.

Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.

Abstract: An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

Abstract: Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.