Patents by Inventor Jong-Heum YOON

Jong-Heum YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME
    Publication number: 20140290986
    Abstract: An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
    Type: Application
    Filed: July 12, 2012
    Publication date: October 2, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Eun Jin Kim, Hae Yeon Kim, Sung Bae Moon, Jae Man Park, Jeung Ook Park, Hyun Gyu Park, Jong Heum Yoon, In Hee Cho, Jin Hwan Kim, Thanh Kieu Giang
  • EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME
    Publication number: 20140048316
    Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.
    Type: Application
    Filed: August 16, 2013
    Publication date: February 20, 2014
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sung Jin YUN, Hyuk Soo LEE, In Hee CHO, Jae Man PARK, Myeong Jeong KIM, Jong Heum YOON, Jeung Ook PARK, Jong Sik LEE, Gun Young GIL, Thanh Kieu GIANG, Jin Hwan KIM
  • PHOTORESIST COMPOSITION, METHOD OF FORMING PATTERN BY USING THE PHOTORESIST COMPOSITION, AND METHOD OF MANUFACTURING THIN-FILM TRANSISTOR SUBSTRATE
    Publication number: 20110269309
    Abstract: Provided are a photoresist composition having superior adhesion to an etch target film, a method of forming a pattern by using the photoresist composition, and a method of manufacturing a thin-film transistor (TFT) substrate. The photoresist composition includes an alkali-soluble resin; a photosensitive compound; a solvent; and 0.01 to 0.1 parts by weight of a compound represented by Formula 1: wherein R is one of hydrogen, an alkyl having 1 to 10 carbon atoms, a cycloalkyl having 4 to 8 carbon atoms, and a phenyl group.
    Type: Application
    Filed: December 29, 2010
    Publication date: November 3, 2011
    Applicants: DONGWOO FINE-CHEM CO., LTD, SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Pil-Soon HONG, Gwui-Hyun PARK, Jin-Ho JU, Jean-Ho SONG, Sang-Tae KIM, Seong-Hyeon KIM, Won-Young CHANG, Jong-Heum YOON, Eun-Sang LEE, Min-Ju IM