Abstract: Provided is a drill device for removing plugging in pipes, the drill device comprising: a drill bit for breaking plugging in pipes; a vertical control handle capable of controlling a vertical movement of the drill bit; a drill handle capable of controlling a rotational movement of the drill bit; a screw disposed coaxially with the drill bit; a drill shaft having a first portion surrounding the screw and a second portion to which the drill bit is fixed; and a guide shaft surrounding the first portion of the drill shaft, wherein: the vertical control handle and the drill handle are disposed on an extension line of the axis of the screw; the screw is vertically moved by rotations of the vertical control handle, and in conjunction therewith, the drill bit can be vertically moved; and the guide shaft is rotated by rotations of the drill handle, and in conjunction therewith, the drill bit can be rotated.

Abstract: A wavy metal nanowire network thin film, a stretchable transparent electrode including the metal nanowire network thin film, and a method for forming the metal nanowire network thin film. More specifically, it relates to a wavy nanowire network structure based on straight metal nanowires, a method for producing the nanowire network structure, and a flexible electrode including the wavy metal nanowire structure. The flexible electrode of the present invention is transparent and stretchable and exhibits stable performance even when subjected to various deformations.

Abstract: A selective catalytic reduction (SCR) system having a catalytic layer. The SCR includes a plurality of baffle members located in a position spaced apart from a front end of the catalytic layer, the plurality of baffle members reduces a flow deviation due to enlargement of a flow cross-section of a fluid in at least one direction, each of the plurality of baffle members includes a first part and a second part, the first part and the second part of each of the plurality of baffle members extends in an orthogonal direction with respect to the at least one direction of enlargement of the flow cross-section, the first part and the second part are integrated, and each of the plurality of baffle members protrudes in an inlet direction of the fluid.

Abstract: A method of forming a semiconductor device, includes: forming a design pattern on a substrate, wherein the design pattern protrudes from the substrate; forming a filling layer on the substrate, wherein the filling layer at least partially covers the design pattern; forming a polishing resistance pattern adjacent to the design pattern in the filling layer using a laser irradiation process and/or an ion implantation process; and removing the filling layer using a chemical mechanical polishing (CMP) process to expose the design pattern.

Abstract: An electrochemical method for ammonia synthesis including the steps of: preparing a single-crystalline metal thin film; and synthesizing ammonia by using the single-crystalline metal thin film electrode. More particularly, it relates to improvement of the production yield and synthesis rate of ammonia trough the method for preparing ammonia by using an electrochemical reactor which includes a cathode including a single-crystalline metal thin film on the surface thereof, an anode and an electrolyte, wherein the method includes the steps of: supplying nitrogen to the cathode; supplying aqueous electrolyte solution to the anode; and applying an electric voltage between the cathode and the anode.

Abstract: A polyamide/hybrid carbon filler composite is disclosed. The composite includes a polyamide as a matrix and a hybrid carbon filler dispersed in and bonded to the polyamide matrix. The hybrid carbon filler is composed of a nano carbon and a carbon fiber. Also disclosed is a method for preparing the polyamide/hybrid carbon filler. The method includes simultaneously subjecting a mixture of a polyamide and a hybrid carbon filler to mechanofusion and plasma treatments.

Abstract: An electrochemical method for ammonia synthesis including the steps of: preparing a single-crystalline metal thin film; and synthesizing ammonia by using the single-crystalline metal thin film electrode. More particularly, it relates to improvement of the production yield and synthesis rate of ammonia trough the method for preparing ammonia by using an electrochemical reactor which includes a cathode including a single-crystalline metal thin film on the surface thereof, an anode and an electrolyte, wherein the method includes the steps of: supplying nitrogen to the cathode; supplying aqueous electrolyte solution to the anode; and applying an electric voltage between the cathode and the anode.

Abstract: A polyamide/hybrid carbon filler composite is disclosed. The composite includes a polyamide as a matrix and a hybrid carbon filler dispersed in and bonded to the polyamide matrix. The hybrid carbon filler is composed of a nano carbon and a carbon fiber. Also disclosed is a method for preparing the polyamide/hybrid carbon filler. The method includes simultaneously subjecting a mixture of a polyamide and a hybrid carbon filler to mechanofusion and plasma treatments.

Abstract: A resistance-switchable material containing: an insulating support; and a complementary resistance switchable filler dispersed in the insulating support, wherein the complementary resistance switchable filler has a spherical core-shell structure containing: a spherical conductive core containing a conductive material; and an insulating shell formed on the surface of the core and containing an insulating material.

Abstract: A wavy metal nanowire network thin film, a stretchable transparent electrode including the metal nanowire network thin film, and a method for forming the metal nanowire network thin film. More specifically, it relates to a wavy nanowire network structure based on straight metal nanowires, a method for producing the nanowire network structure, and a flexible electrode including the wavy metal nanowire structure. The flexible electrode of the present invention is transparent and stretchable and exhibits stable performance even when subjected to various deformations.

Abstract: A resistance-switchable material containing: an insulating support; and a complementary resistance switchable filler dispersed in the insulating support, wherein the complementary resistance switchable filler has a core-shell structure containing: a wire-type conductive core containing a conductive material; and an insulating shell formed on the surface of the core and containing an insulating material. Because a first resistive layer, a conductive layer and a second resistive layer are formed as one layer and bipolar conductive filaments are formed on the substantially different resistive layers, the memory can exhibit complementary resistive switching characteristics. In addition, the complementary resistance switchable memory of the present disclosure can be prepared through a simplified process at low cost by introducing a simple process of coating a paste in which a complementary resistance switchable filler and a supporting material are mixed.

Abstract: Provided are a chemical mechanical polishing (CMP) slurry composition and a method of fabricating a semiconductor device using the same. The chemical mechanical polishing (CMP) slurry composition includes abrasive particles, a first cationic compound which comprises at least any one of an amino acid, a polyalkylene glycol, a polymer polysaccharide to which a glucosamine compound is bonded, and a polymer containing an amine group, a second cationic compound which comprises an organic acid, and a nonionic compound which comprises polyetheramine.

Abstract: A slurry composition for polishing a metal layer and a method for fabricating a semiconductor device using the same are provided. The slurry composition for polishing a metal layer includes polishing particles including a metal oxide, an oxidizer including hydrogen peroxide, and a first polishing regulator including at least one selected from a group consisting of phosphate, phosphite, hypophosphite, and metaphosphate, wherein a content of the oxidizer is 0.01 wt % to 0.09 wt % with respect to 100 wt % of the slurry composition for polishing the metal layer.

Abstract: Disclosed is a multilevel nonvolatile resistive random-access memory device including a lower electrode, an upper electrode, and an insulation film interposed between the lower electrode and the upper electrode. Each of the lower electrode and the upper electrode includes a plate-shaped portion, and a patterned portion formed on the plate-shaped portion, and the patterned portion includes a protruding 3-dimensional prism structure pattern in which a plurality of prism-shaped structures is repeatedly arranged at a constant interval in a given direction. The patterned portion of the lower electrode and the patterned portion of the upper electrode are arranged to face each other, and a longitudinal direction of the prism-shaped structures of the lower electrode patterned portion and a longitudinal direction of the prism-shaped structures of the upper electrode patterned portion cross each other.

Abstract: Disclosed is a multilevel nonvolatile resistive random-access memory device including a lower electrode, an upper electrode, and an insulation film interposed between the lower electrode and the upper electrode. Each of the lower electrode and the upper electrode includes a plate-shaped portion, and a patterned portion formed on the plate-shaped portion, and the patterned portion includes a protruding 3-dimensional prism structure pattern in which a plurality of prism-shaped structures is repeatedly arranged at a constant interval in a given direction. The patterned portion of the lower electrode and the patterned portion of the upper electrode are arranged to face each other, and a longitudinal direction of the prism-shaped structures of the lower electrode patterned portion and a longitudinal direction of the prism-shaped structures of the upper electrode patterned portion cross each other.

Abstract: One or more apparatuses and methods for enabling easy diagnosis, repair, and maintenance of a commercial display screen are disclosed. In one embodiment of the invention, this apparatus includes a removable commercial display kit box, a corresponding base plate interface unit attached to a rear panel of the commercial display screen, and a guiding mechanism for docking the removable commercial display kit box and the corresponding base plate interface unit. Furthermore, in one embodiment of the invention, the removable display kit box contains an analog-to-digital converter board, a power board, automatic-switching dual data ports, maintenance check visual indicators, and a removable fuse inlet. In case of a commercial display screen malfunction, the removable display kit box allows a quick inspection and a modular repair or replacement of a malfunctioning part, without requiring the entire commercial display screen to be dismounted from a wall or another attached structure.

Abstract: Disclosed are nonvolatile resistance random access memory device and a fabrication method thereof. The nonvolatile resistance random access memory device includes a lower electrode, an insulator film formed on a surface of the lower electrode, and an upper electrode formed over the insulator film, the lower electrode includes a base, and a thin metal layer formed on a surface of the base, and the lower electrode has a 3D structural pattern in which a plurality of protruding structures is repeatedly arranged at a constant interval. The 3D metal structures have a shape selected from among a pyramid (quadrangular pyramid), a trapezoidal pyramid (pyramid with a flat top), a pillar, and a prism. Uniform conductive filaments are formed via the space between the 3D metal structures, whereby the nonvolatile resistance random access memory device is capable of being driven at a low operating voltage and has long-term stability.

Abstract: A method of manufacturing a semiconductor device includes: preparing a wafer in which a first cell area and a second cell area are defined; forming a bottom electrode structure in the first cell area and a dummy structure located in the second cell area; and sequentially forming a dielectric layer and a top electrode on the bottom electrode structure and the dummy structure, wherein the bottom electrode structure includes a plurality of bottom electrodes extending in a first direction in the first cell area and first and second supporters to support the plurality of bottom electrodes, wherein the dummy structure includes a first mold film, a first supporter film, a second mold film, and a second supporter film that are sequentially formed to cover the second cell area, and the second supporter and the second supporter film are at a same level relative to the wafer.

Abstract: Methods of manufacturing a semiconductor device are provided. Methods may include forming first to third regions having densities different from one another on a substrate, covering the first to third regions to form an upper interlayer insulating film including a low step portion and a high step portion higher than the low step portion, forming an organic film on the upper interlayer insulating film, removing a part of the organic film to expose an upper surface of the high step portion, removing the high step portion so that an upper surface of the high step portion is disposed on at least the same line as the organic film disposed on the upper surface of the lower step portion, removing the remaining part of the organic film to expose the upper surface of the upper interlayer insulating film and flattening the upper surface of the upper interlayer insulating film.