Patents by Inventor Jong-hyun Ahn
Jong-hyun Ahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10918856Abstract: A graphene bio-device for electrotherapy, includes: a flexible substrate; An electrode made of graphene on the flexible substrate; and an insulation layer on the graphene electrode; wherein the graphene bio-device comprises electrodes for ground, reference, recording and stimulation, wherein the graphene bio-device is measured corticography with low noise and alleviated seizure signals successfully by imposing electrical stimulation.Type: GrantFiled: July 10, 2018Date of Patent: February 16, 2021Assignee: gBrain Inc.Inventors: Sunggu Yang, Jong-Hyun Ahn, Jejung Kim, Wonho Lee, Minpyo Kang
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Patent number: 10910415Abstract: The present disclosure discloses a three-dimensional photodetector and a method of manufacturing the same. The three-dimensional photodetector according to an embodiment of the present disclosure includes a base part formed in the center region of the three-dimensional photodetector; a first bending part formed around the base part; at least one branch part connected to the base part through the first bending part; second bending parts formed on the at least one branch part; bonding parts connected to the at least one branch part through the second bending parts; at least one photoresistor formed on the surface of at least one of the base part and the branch parts; and a stretchable substrate to which the bonding parts are attached, wherein the bonding parts are attached to the stretchable substrate so that the base part has a gap in the thickness direction of the stretchable substrate; and the at least one photoresistor is responsible for tracking the traveling direction of light.Type: GrantFiled: December 28, 2018Date of Patent: February 2, 2021Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: Jong Hyun Ahn, Won Ho Lee, Yong Jun Lee
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Patent number: 10852891Abstract: Disclosed are an ultra-thin touch panel and a method of fabricating the same. Particularly, the ultra-thin touch panel according to an embodiment of the present disclosure includes a flexible substrate, a plurality of first sensing electrodes arranged in a first direction on the flexible substrate, an adhesive insulating layer formed on the flexible substrate and the first sensing electrodes, and a plurality of second sensing electrodes arranged in a second direction, which intersects the first direction, on the flexible substrate and the adhesive insulating layer using a wet transfer method, wherein the flexible substrate is patterned in a shape corresponding to the first and second sensing electrodes by oxygen plasma etching to form a polygonal mesh structure.Type: GrantFiled: September 6, 2018Date of Patent: December 1, 2020Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: Jong Hyun Ahn, Minpyo Kang
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Patent number: 10840377Abstract: Provided is a method for manufacturing an inorganic material having a tensile stress, which includes: forming an inorganic stressor from an inorganic wafer made of an inorganic matter; forming an inorganic layer on the inorganic stressor; and etching a bulk inorganic matter at a lower portion of the inorganic stressor to generate an inorganic material having a tensile stress, wherein the inorganic layer has a tensile stress by etching the bulk inorganic matter to relieve a compressive stress applied to the inorganic stressor when the inorganic stressor is being formed. Therefore, FET and various circuits having higher charge mobility may be realized, and also, since characteristics may be maintained even when being applied to a plastic substrate, high performance flexible electronic device may be manufactured.Type: GrantFiled: October 21, 2019Date of Patent: November 17, 2020Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: Jong Hyun Ahn, Wonho Lee
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Patent number: 10811162Abstract: Provided are method for healing defect of conductive layer, method for forming metal-carbon compound layer, 2D nano materials, and transparent electrode and method for manufacturing the same. According to an embodiment of present invention, the method for healing defect of conductive layer comprises: forming a conductive layer on a first metal substrate; contacting the first metal substrate with a salt solution containing a second metal in an ionic form, and forming a second metal particle at least in a portion of a conductive area, the second metal having greater reduction potential than a first metal.Type: GrantFiled: June 29, 2016Date of Patent: October 20, 2020Assignees: Industry-Academic Cooperation Foundation, Yonsei University, Incheon University Industry Academic Cooperation FoundationInventors: Taeyoon Lee, Jong Hyun Ahn, Juree Hong, Jae-Bok Lee, Han-Bo-Ram Lee
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Publication number: 20200208261Abstract: The present invention discloses a transient sensor using molybdenum disulfide and a method of manufacturing the same. According to one embodiment of the present invention, the transient sensor using molybdenum disulfide includes a water-soluble substrate; a water-soluble insulating layer deposited on the water-soluble substrate; an electrode layer formed of any one of molybdenum (Mo) and magnesium (Mg) and formed on the water-soluble insulating layer; and a channel layer formed of molybdenum disulfide and formed on the water-soluble insulating layer to be connected to the electrode layer. In addition, when the transient sensor is inserted into living matter, the transient sensor can be dissolved within a critical time in the living matter.Type: ApplicationFiled: December 31, 2018Publication date: July 2, 2020Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: Jong Hyun AHN, Xiang CHEN, Yong Ju PARK, Min Pyo KANG
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Publication number: 20200212080Abstract: The present disclosure discloses a three-dimensional photodetector and a method of manufacturing the same. The three-dimensional photodetector according to an embodiment of the present disclosure includes a base part formed in the center region of the three-dimensional photodetector; a first bending part formed around the base part; at least one branch part connected to the base part through the first bending part; second bending parts formed on the at least one branch part; bonding parts connected to the at least one branch part through the second bending parts; at least one photoresistor formed on the surface of at least one of the base part and the branch parts; and a stretchable substrate to which the bonding parts are attached, wherein the bonding parts are attached to the stretchable substrate so that the base part has a gap in the thickness direction of the stretchable substrate; and the at least one photoresistor is responsible for tracking the traveling direction of light.Type: ApplicationFiled: December 28, 2018Publication date: July 2, 2020Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: Jong Hyun AHN, Won Ho Lee, Yong Jun Lee
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Publication number: 20200161291Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: ApplicationFiled: October 29, 2019Publication date: May 21, 2020Inventors: John A. ROGERS, Ralph NUZZO, Matthew MEITL, Etienne MENARD, Alfred BACA, Michael MOTALA, Jong-Hyun AHN, Sang-Il PARK, Chang-Jae YU, Heung Cho KO, Mark STOYKOVICH, Jongseung YOON
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Publication number: 20200052118Abstract: Provided is a method for manufacturing an inorganic material having a tensile stress, which includes: forming an inorganic stressor from an inorganic wafer made of an inorganic matter; forming an inorganic layer on the inorganic stressor; and etching a bulk inorganic matter at a lower portion of the inorganic stressor to generate an inorganic material having a tensile stress, wherein the inorganic layer has a tensile stress by etching the bulk inorganic matter to relieve a compressive stress applied to the inorganic stressor when the inorganic stressor is being formed. Therefore, FET and various circuits having higher charge mobility may be realized, and also, since characteristics may be maintained even when being applied to a plastic substrate, high performance flexible electronic device may be manufactured.Type: ApplicationFiled: October 21, 2019Publication date: February 13, 2020Applicant: Industry-Academic Cooperation Foundation, Yonsei UniversityInventors: Jong Hyun AHN, Wonho LEE
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Patent number: 10504882Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: January 10, 2017Date of Patent: December 10, 2019Assignees: The Board of Trustees of the University of Illinois, X-Celeprint LimitedInventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
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Patent number: 10490664Abstract: Provided is a method for manufacturing an inorganic material having a tensile stress, which includes: forming an inorganic stressor from an inorganic wafer made of an inorganic matter; forming an inorganic layer on the inorganic stressor; and etching a bulk inorganic matter at a lower portion of the inorganic stressor to generate an inorganic material having a tensile stress, wherein the inorganic layer has a tensile stress by etching the bulk inorganic matter to relieve a compressive stress applied to the inorganic stressor when the inorganic stressor is being formed. Therefore, FET and various circuits having higher charge mobility may be realized, and also, since characteristics may be maintained even when being applied to a plastic substrate, high performance flexible electronic device may be manufactured.Type: GrantFiled: April 14, 2016Date of Patent: November 26, 2019Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: Jong Hyun Ahn, Wonho Lee
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Patent number: 10424572Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: January 10, 2017Date of Patent: September 24, 2019Assignees: The Board of Trustees of the University of Illinois, X-Celeprint LimitedInventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
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Publication number: 20190224474Abstract: A graphene bio-device for electrotherapy, includes: a flexible substrate; An electrode made of graphene on the flexible substrate; and an insulation layer on the graphene electrode; wherein the graphene bio-device comprises electrodes for ground, reference, recording and stimulation, wherein the graphene bio-device is measured corticography with low noise and alleviated seizure signals successfully by imposing electrical stimulation.Type: ApplicationFiled: July 10, 2018Publication date: July 25, 2019Applicants: INCHEON UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION, Industry-Academic Cooperation Foundation, Yonsei UniversityInventors: Sunggu Yang, Jong-Hyun Ahn, Jejung Kim, Wonho Lee, Minpyo Kang
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Patent number: 10361180Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities.Type: GrantFiled: January 10, 2017Date of Patent: July 23, 2019Assignees: The Board of Trustees of the University of Illinois, X-Celeprint LimitedInventors: John Rogers, Ralph Nuzzo, Matthew Meitl, Etienne Menard, Alfred Baca, Michael Motala, Jong-Hyun Ahn, Sang-Il Park, Chang-Jae Yu, Heung Cho Ko, Mark Stoykovich, Jongseung Yoon
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Patent number: 10292261Abstract: Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device.Type: GrantFiled: May 7, 2015Date of Patent: May 14, 2019Assignees: The Board of Trustees of the University of Illinois, Northwestern UniversityInventors: John A Rogers, Yonggang Huang, Heung Cho Ko, Mark Stoykovich, Won Mook Choi, Jizhou Song, Jong Hyun Ahn, Dae Hyeong Kim
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Publication number: 20190073057Abstract: Disclosed are an ultra-thin touch panel and a method of fabricating the same. Particularly, the ultra-thin touch panel according to an embodiment of the present disclosure includes a flexible substrate, a plurality of first sensing electrodes arranged in a first direction on the flexible substrate, an adhesive insulating layer formed on the flexible substrate and the first sensing electrodes, and a plurality of second sensing electrodes arranged in a second direction, which intersects the first direction, on the flexible substrate and the adhesive insulating layer using a wet transfer method, wherein the flexible substrate is patterned in a shape corresponding to the first and second sensing electrodes by oxygen plasma etching to form a polygonal mesh structure.Type: ApplicationFiled: September 6, 2018Publication date: March 7, 2019Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: Jong Hyun AHN, Minpyo KANG
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Patent number: 10213985Abstract: A graphene sheet and a method of manufacturing the graphene sheet are provided. The method includes: growing a graphene sheet on a graphene growth support by applying carbon sources and heat to the graphene growth support, the graphene growth support including a carbonization catalyst; and forming at least one ripple on the graphene sheet by cooling at least one of the graphene growth support and the graphene sheet, wherein the graphene growth support and the graphene sheet have different thermal expansion coefficients.Type: GrantFiled: March 20, 2015Date of Patent: February 26, 2019Assignees: SUNGKYUNKWAN UNIVERSITY FOUNDATION FOR CORPORATE COLLABORATION, HANWHA AEROSPACE CO., LTD.Inventors: Keun-soo Kim, Jong-hyun Ahn, Byung-hee Hong
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Patent number: 10147746Abstract: A flexible display device includes a flexible substrate, an adhesion layer disposed on a surface of the flexible substrate, and a plurality of pixel structures in respective pixels on the adhesion layer. Each of the pixel structures on the adhesion layer includes a light emitting diode including an inorganic light emitting layer, and a thin film transistor which is connected to the light emitting diode and switches a state of the light emitting diode.Type: GrantFiled: March 20, 2018Date of Patent: December 4, 2018Assignees: SAMSUNG DISPLAY CO., LTD., INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITYInventors: Kihyun Kim, Taewoong Kim, Jong-hyun Ahn, Wonho Lee, Minwoo Choi
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Patent number: D880437Type: GrantFiled: May 3, 2018Date of Patent: April 7, 2020Assignee: ASM IP Holding B.V.Inventors: Hak Joo Lee, Jeong Jun Woo, Jong Hyun Ahn, Yoon Ki Min
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Patent number: D913980Type: GrantFiled: March 4, 2020Date of Patent: March 23, 2021Assignee: ASM IP Holding B.V.Inventors: Hak Joo Lee, Jeong Jun Woo, Jong Hyun Ahn, Yoon Ki Min