Abstract: Disclosed is a putter including an interchangeable sleeve mechanism capable of easily replacing and mounting a shaft, the putter comprising a main body part, a downward extension part, a blade formation part having a plate-shaped structure which extends to a predetermined length rearward from a lower end of the downward extension part and has an area having a predetermined size, a plurality of weight mounting grooves disposed to be spaced a certain interval from each other in an upper surface or a side surface of the blade formation part and configured to bind weights in a detachable structure, and a sleeve mechanism mounted in a structure detachably attached to the binding groove of the main body part, having a block structure extending to a predetermined height upward, and formed with a shaft binding fastening hole recessed to a predetermined depth in an upper end surface.

Abstract: Disclosed is a putter including an interchangeable sleeve mechanism capable of easily replacing and mounting a shaft, the putter comprising a main body part, a downward extension part, a blade formation part having a plate-shaped structure which extends to a predetermined length rearward from a lower end of the downward extension part and has an area having a predetermined size, a plurality of weight mounting grooves disposed to be spaced a certain interval from each other in an upper surface or a side surface of the blade formation part and configured to bind weights in a detachable structure, and a sleeve mechanism mounted in a structure detachably attached to the binding groove of the main body part, having a block structure extending to a predetermined height upward, and formed with a shaft binding fastening hole recessed to a predetermined depth in an upper end surface.

Abstract: A composition for prevention, alleviation, or treatment of respiratory diseases, and a functional food and a pharmaceutical composition, each comprising same. There is also provided a composition for the enhancement of respiratory functions and the alleviation of respiratory diseases, comprising an Impatiens arguta extract as an active ingredient.

Abstract: There is provided a composition for prevention, alleviation, or treatment of atopic dermatitis diseases, a functional food and a pharmaceutical composition, each including same, and a composition for alleviation of atopic dermatitis diseases, including an Impatiens arguta extract as an active ingredient.

Abstract: A stamina-improving composition, a stamina-improving functional food including same and, more specifically, to a stamina-improving natural tea is provided. A stamina-improving composition including as an active ingredient at least one selected from Orostachys japonicus and Vigna vexillata var tsusimensis Matsumura is provided.

Abstract: The present invention relates to an anti-respiratory virus composition, especially to a tea composition, and provides a natural composition having efficacy for treating and preventing respiratory virus-related diseases.

Abstract: Provided is a composition for relieving a hangover including as its active ingredients Corylus heterophylla Fisher nut extract, Alnus japonica Steud. stem extract and Sorbus commixta fruit extract. It is verified the composition for relieving a hangover according to the present disclosure reduces blood alcohol concentration more significantly than the composition for relieving a hangover including as its active ingredients Alnus japonica Steud. extract and Sorbus commixta extract as disclosed in Korean Patent Registration No. 181168 in in vivo tests (including animal testing and human experiment) and that has effects of considerably alleviating various hangover symptoms.

Abstract: A wafer level package and or a semiconductor device unit may be provided. The wafer level package may include semiconductor chips disposed on an interconnection structure layer and laterally spaced apart from each other. The wafer level package may include a reinforcement zig attached to the semiconductor chips. The wafer level package may include a molded layer covering the semiconductor chips and embedding the reinforcement zig. Related methods are also provided.

Abstract: Provided is a composition for relieving a hangover including as its active ingredients Corylus heterophylla Fisher nut extract, Alnus japonica Steud. stem extract and Sorbus commixta fruit extract. It is verified the composition for relieving a hangover according to the present disclosure reduces blood alcohol concentration more significantly than the composition for relieving a hangover including as its active ingredients Alnus japonica Steud. extract and Sorbus commixta extract as disclosed in Korean Patent Registration No. 181168 in in vivo tests (including animal testing and human experiment) and that has effects of considerably alleviating various hangover symptoms.

Abstract: The present invention relates to a pharmaceutical composition useful for treating or preventing burn injury and a method of treating or preventing burn injury.

Abstract: The present invention relates to a pain relief composition.

Abstract: A wafer level package and or a semiconductor device unit may be provided. The wafer level package may include semiconductor chips disposed on an interconnection structure layer and laterally spaced apart from each other. The wafer level package may include a reinforcement zig attached to the semiconductor chips. The wafer level package may include a molded layer covering the semiconductor chips and embedding the reinforcement zig. Related methods are also provided.

Abstract: A fan-out package may include a core supporter having a through hole, a first semiconductor chip disposed on a first surface of the core supporter in a way that a portion of the first semiconductor chip is exposed by the through hole, a second semiconductor chip disposed on a second surface of the core supporter, a first photosensitive dielectric layer disposed on the first surface of the core supporter to cover the first semiconductor chip, a second photosensitive dielectric layer disposed on the second surface of the core supporter to cover the second semiconductor chip and to fill the through hole, a first trace pattern disposed on the second photosensitive dielectric layer, and a first conductive via penetrating the second photosensitive dielectric layer in the through hole to be connected to both of the first trace pattern and the first semiconductor chip.

Abstract: A fan-out package may include a core supporter having a through hole, a first semiconductor chip disposed on a first surface of the core supporter in a way that a portion of the first semiconductor chip is exposed by the through hole, a second semiconductor chip disposed on a second surface of the core supporter, a first photosensitive dielectric layer disposed on the first surface of the core supporter to cover the first semiconductor chip, a second photosensitive dielectric layer disposed on the second surface of the core supporter to cover the second semiconductor chip and to fill the through hole, a first trace pattern disposed on the second photosensitive dielectric layer, and a first conductive via penetrating the second photosensitive dielectric layer in the through hole to be connected to both of the first trace pattern and the first semiconductor chip.

Abstract: A printed circuit board includes an inner layer having a supporting pattern and via pad patterns that are disposed to be spaced apart from each other in a lateral direction, an outer layer disposed over or below the inner layer and including a circuit pattern, a via plug connecting the circuit pattern layer to any one of the via pad patterns. The supporting pattern is stiffer than the via pad patterns, and at least two of the via pad patterns are electrically connected to each other by a via pad connecting pattern located at substantially the same level as the via pad patterns.

Abstract: A printed circuit board includes an inner layer having a supporting pattern and via pad patterns that are disposed to be spaced apart from each other in a lateral direction, an outer layer disposed over or below the inner layer and including a circuit pattern, a via plug connecting the circuit pattern layer to any one of the via pad patterns. The supporting pattern is stiffer than the via pad patterns, and at least two of the via pad patterns are electrically connected to each other by a via pad connecting pattern located at substantially the same level as the via pad patterns.

Abstract: A semiconductor package includes a package substrate having a cavity therein and a second internal contact portion, a semiconductor die disposed in the cavity of the package substrate and having a first internal contact portion, a bonding wire connecting the first internal contact portion to the second internal contact portion, and an encapsulation part covering surfaces of the semiconductor die and the package substrate and providing an opening that exposes a first external contact portion of the bonding wire. Related memory cards and related electronic systems are also provided.

Abstract: Semiconductor chips are provided. The semiconductor chip includes a semiconductor chip body having an arch-shaped groove in a backside thereof and a non-conductive material pattern filling the arch-shaped groove. Related methods are also provided.

Abstract: An embedded package includes a first semiconductor chip embedded in a package substrate, a second semiconductor chip disposed over a first surface of the package substrate, and a group of external connection joints disposed on the first surface of the package substrate and between a sidewall of the second semiconductor chip and an edge of the embedded package. Related memory cards and related electronic systems are also provided.

Abstract: A chip stack package includes a first chip disposed over a substrate, a second chip disposed over the first chip and having an overhang, and a first supporter attached to a bottom surface of the overhang of the second chip and a sidewall of the first chip. The overhang of the second chip protrudes from the sidewall of the first chip.