Abstract: A power generation apparatus according to an embodiment of the present invention comprises: a cooling unit, a thermoelectric module comprising a thermoelectric element disposed on one surface of the cooling unit, and a heat sink disposed on the thermoelectric element; a guide plate disposed opposite the thermoelectric module; and a branch unit disposed on another surface perpendicular to the one surface of the cooling unit. The heat sink includes multiple heat dissipation fins which are spaced apart from each other. The ratio of the shortest horizontal distance between the heat sink and the guide plate to the shortest horizontal distance between the branch unit and the guide plate is 0.0625 to 0.25.

Abstract: A coil component includes a body having a first surface and a second surface facing each other, and having a plurality of wall surfaces connecting the first surface to the second surface; an insulating substrate; a coil portion comprising a first lead-out pattern and a second lead-out pattern each covered with the body and disposed on the insulating substrate; a first external electrode and a second external electrode disposed on the first surface of the body and spaced apart from each other; a first connection electrode and a second connection electrode respectively extending from the first and second lead-out patterns to the first and second external electrodes; and a first support portion and a second support portion respectively extending from the coil portion to be exposed to one of the plurality of wall surfaces, and respectively disposed to be spaced apart from the first and second lead-out patterns.

Abstract: A capacitor structure includes a plurality of bottom electrodes horizontally spaced apart from each other, a support structure covering sidewalls of the bottom electrodes, a top electrode surrounding the support structure and the bottom electrodes, and a dielectric layer interposed between the support structure and the top electrode, and between the top electrode and each of the bottom electrodes. An uppermost surface of the support structure is positioned at a higher level than an uppermost surface of each of the bottom electrodes.

Abstract: A method of controlling an image acquisition device for tracking a target object includes: detecting an event in which tracking of a first object, which is a tracking target object, fails in a first image acquired by the image acquisition device; determining, in the first image, a reference object which is used as a reference for controlling the image acquisition device; controlling the image acquisition device such that at least one of an image capturing range and an image capturing direction of the image acquisition device is adjusted based on at least one of a size and a location of the reference object in the first image; and recognizing the first object in a second image acquired by the image acquisition device in a state in which at least one of the image capturing range and the image capturing direction is adjusted.

Abstract: Disclosed are an apparatus and a method for quickly and accurately inspecting a droplet on a substrate. An apparatus for inspecting a droplet on a substrate according to an exemplary embodiment of the present disclosure includes: an ultrasonic sensor configured to apply an ultrasonic wave to a droplet on the substrate and detect an ultrasonic wave reflected from the substrate; and a processor configured to acquire a height of the droplet at each position on the substrate on the basis of a signal of the ultrasonic wave reflected from the droplet on the substrate, calculate a volume of the droplet on the basis of the heights of the droplet at the positions, and store or output data in relation to the volume of the droplet. The embodiment of the present disclosure may calculate the volume of the droplet using the ultrasonic wave, thereby quickly and accurately inspecting the droplet on the substrate.

Abstract: A thermoelectric device according to one embodiment of the present invention includes a substrate, a first insulating layer disposed on the substrate, a second insulating layer disposed on the first insulating layer and having an area smaller than an area of the first insulating layer, a plurality of first electrodes disposed on the second insulating layer, a plurality of semiconductor structures disposed on the plurality of first electrodes, and a plurality of second electrodes disposed on the plurality of semiconductor structures, wherein the second insulating layer includes an overlapping region in which the plurality of first electrodes, the plurality of second electrodes, and the plurality of semiconductor structures overlap vertically and a protruding pattern protruding from the overlapping region toward a first outer side the substrate.

Abstract: A coil component includes a body having one surface and the other surface facing each other; an insulating substrate embedded in the body, and having one surface substantially perpendicular to the one surface of the body; a coil portion disposed on the one surface of the insulating substrate, and including a coil pattern layer having a coil pattern and a lead-out pattern extending from the coil pattern and exposed from the one surface of the body; an insulating layer disposed on the one surface of the insulating substrate to cover the coil pattern layer; and first and second external electrodes arranged to be spaced apart from each other on the one surface of the body and respectively connected to the lead-out pattern. A thickness of the lead-out pattern is greater than a thickness of the coil pattern, and less than a thickness of the insulating layer.

Abstract: A semiconductor device includes a substrate including a first side and a second side opposite to each other, a first penetrating structure that penetrates the substrate, and a second penetrating structure that penetrates the substrate, the second penetrating structure being spaced apart from the first penetrating structure, and an area of the first penetrating structure being more than twice an area of the second penetrating structure, as viewed from the first side of the substrate.

Abstract: Disclosed are semiconductor devices and electronic systems including the same. The semiconductor device may include a stack structure extending in a first direction and including gate electrodes vertically stacked on a substrate, selection structures horizontally spaced apart on the stack structure, an upper isolation structure between the selection structure and extending in the first direction on the stack structure, and vertical structures penetrating the stack structure and the selection structures. The vertical structures include first vertical structures arranged along the first direction and penetrating portions of the upper isolation structure. Each selection structure includes a selection gate electrode and a horizontal dielectric pattern that surrounds top, bottom, and sidewall surfaces of the selection gate electrode.

Abstract: A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T2) of the cover portion to a thickness (T1) of the insulating substrate satisfies 3<T2/T1<6, and the thickness (T2) of the cover portion satisfies 90 ?m<T2<120 ?m.

Abstract: A semiconductor device includes an electrode structure including electrodes stacked on a substrate and an insulating pattern on an uppermost electrode of the electrodes, a vertical structure that penetrates the electrode structure and is connected to the substrate, a first insulating layer on the electrode and the vertical structure, a conductive pattern that penetrates the first insulating layer and is connected to the vertical structure, an upper horizontal electrode on the conductive pattern, and an upper semiconductor pattern that penetrates the upper horizontal electrode and is connected to the conductive pattern. The conductive pattern has a first side surface on the vertical structure and a second side surface on the insulating pattern.

Abstract: A three-dimensional semiconductor devices including a substrate, a stack structure including gate electrodes on the substrate and string selection electrodes spaced apart from each other on the gate electrodes, a first separation structure running in a first direction across the stack structure and being between the string selection electrodes, vertical channel structures penetrating the stack structure, and bit lines connected to the vertical channel structures and extending in a second direction may be provided. A first subset of the vertical channel structures is connected in common to one of the bit lines. The vertical channel structures of the first subset may be adjacent to each other in the second direction across the first separation structure. Each of the string selection electrodes may surround each of the vertical channel structures of the first subset.

Abstract: A brake apparatus for a vehicle according to the present disclosure includes a torque member configured to surround a brake disk, a pair of brake pads disposed in the torque member in a way to face each other, and a plurality of return parts mounted on the pair of brake pads, respectively, coupled with the torque member, and configured to guide movements of the brake pads and return the brake pads to their original positions by elastic restoring forces thereof.

Abstract: A memory system includes a memory device having a plurality of memory blocks for storing data, and a controller configured to perform an erase operation including plural unit erase operations to erase data stored in at least one target memory block included in the plurality of memory blocks. The controller can be configured to perform at least some of the plural unit erase operations onto the at least one target memory block before the at least one target memory block allocated for storing data.

Abstract: A coil component includes a body; an insulating substrate embedded in the body; and a coil portion disposed on at least one surface of the insulating substrate. The insulating substrate is inclined with respect to one surface of the body, in a cross-section of the body in a width-thickness direction.

Abstract: A lighting device irradiating light to different locations includes a light irradiation unit that generates light; an optical path adjustment unit that adjusts a path of the light radiated from the light irradiation unit to allow a road surface pattern to be formed at a predetermined location on a road surface around a vehicle; and a driving unit that adjusts the optical path adjustment unit to allow the road surface pattern to be formed at different locations on the road surface around the vehicle.

Abstract: An inductor includes a body, a coil disposed inside the body, and first and second external electrodes disposed on one surface of the body to respectively be connected to both ends of the coil. A recess portion is disposed in a region between the first and second external electrodes on the one surface of the body.

Abstract: A memory system may include a memory device including a plurality of memory blocks, a buffer memory device, and a memory controller. The buffer memory device includes a read buffer configured to store the data read from the memory device and a keep buffer configured to store part of the read data. The memory controller operates to identify keeping data among data stored in the read buffer according to a number of error bits in the keeping data when it was read from the memory device, store the keeping data in the keep buffer, and remove the keeping data from the read buffer. The memory controller may store the keeping data in any one of the plurality of memory blocks based on information related to the keeping data.

Abstract: The present invention includes: a first sealing portion which has a first entry/exit selectively opened or closed by a first opening/closing valve and a second entry/exit selectively opened or closed by a second opening/closing valve and is configured to seal one end of a housing; a second sealing portion which has a third entry/exit selectively opened or closed by a third opening/closing valve and a fourth entry/exit selectively opened or closed by a fourth opening/closing valve, and is configured to seal the other end of the housing; and a controller which is configured to control the supply of raw water through any one of the first entry/exit and the second entry/exit or control the supply of raw water through any one of the third entry/exit and the fourth entry/exit.

Abstract: The present disclosure relates to a method for three-dimensionally modeling an organ through image segmentation. The three-dimensional modeling of an organ includes the operations of: receiving one or more pieces of medical image data for a specific bodily organ of a target object; setting a region of interest with respect to the bodily organ based on the one or more pieces of medical image data; forming one or more blocks corresponding to the region of interest, wherein the blocks include a portion of the bodily organ corresponding to the regions of interest; setting a segment algorithm for each of the blocks; generating first image data respectively performing 3D modeling of portions contained in the blocks based on algorithms set to the blocks; and merging the first image data, and generating a three-dimensional section image data with respect to the entire bodily organ.