Abstract: A semiconductor memory device includes a memory cell array, a control logic circuit, an internal processing circuit, and an error correction circuit. The control logic circuit generates an internal processing mode signal in response to a command from a memory controller. The internal processing circuit selectively performs the internal processing operation on a first set of data read from the memory cell array to output a processing result data, in response to the internal processing mode signal. The error correction circuit performs an error correction code (ECC) encoding on the processing result data to generate a second parity data and stores the processing result data and the second parity data in the memory cell array. The error correction circuit generates the second parity data by selecting the same ECC of a plurality of ECCs as a first ECC.

Abstract: A memory device includes a first memory cell array connected to a first internal data line; a second memory cell array connected to a second internal data line; and a line swap circuit configured to connect the first and second internal data lines with first and second external data lines based on an externally received driving signal. The line swap circuit is configured such that, when the driving signal has a first logic level, the line swap circuit connects the first and second internal data lines with the first and second external data lines, respectively, and when the driving signal has a second, different logic level, the line swap circuit swaps the first and second external data lines so that the first internal data line is connected to the second external data line and the second internal data line is connected to the first external data line.

Abstract: A memory system that supports an offset command includes a memory controller and a memory device. The memory controller may issue an offset command to the memory device for one cycle of a clock signal, the offset command does not include an access address signal, but includes an offset signal from which the access address signal can be derived. The memory device may receive the offset command and may generate an access address signal based on the offset signal of the offset command.

Abstract: A semiconductor memory device includes a memory cell array, a control logic circuit, an internal processing circuit, and an error correction circuit. The control logic circuit generates an internal processing mode signal in response to a command from a memory controller. The internal processing circuit selectively performs the internal processing operation on a first set of data read from the memory cell array to output a processing result data, in response to the internal processing mode signal. The error correction circuit performs an error correction code (ECC) encoding on the processing result data to generate a second parity data and stores the processing result data and the second parity data in the memory cell array. The error correction circuit generates the second parity data by selecting the same ECC of a plurality of ECCs as a first ECC.

Abstract: A memory device includes a memory cell array, a data pattern providing unit, and a write circuit. The memory cell array includes a plurality of memory regions. The data pattern providing unit is configured to provide a predefined data pattern. The write circuit is configured to, when a first write command and an address signal are received from an external device, write the predefined data pattern provided from the data pattern providing unit to a memory region corresponding to the address signal.

Abstract: Provided are a memory device and a memory module, which perform both an ECC operation and a redundancy repair operation. The memory device repairs a single-bit error due to a ‘fail’ cell by using an error correction code (ECC) operation, and also repairs the ‘fail’ cell by using a redundancy repair operation when the ‘fail’ cell is not repairable by the ECC operation. The redundancy repair operation includes a data line repair and a block repair. The ECC operation may change a codeword corresponding to data per one unit of memory cells including the ‘fail’ cell, and may also change the size of parity bits regarding the changed codeword.

Abstract: A semiconductor memory device includes a memory cell array in which a plurality of memory cells are arranged. The semiconductor memory device includes an error correcting code (ECC) circuit configured to generate parity data based on main data, write a codeword including the main data and the parity data in the memory cell array, read the codeword from a selected memory cell row to generate syndromes, and correct errors in the read codeword on a per symbol basis based on the syndromes. The main data includes first data of a first memory cell of the selected memory cell row and second data of a second memory cell of the selected memory cell row. The first data and the second data are assigned to one symbol of a plurality of symbols, and the first memory cell and the second memory cell are adjacent to each other in the memory cell array.

Abstract: A memory device includes a memory cell array, a data pattern providing unit, and a write circuit. The memory cell array includes a plurality of memory regions. The data pattern providing unit is configured to provide a predefined data pattern. The write circuit is configured to, when a first write command and an address signal are received from an external device, write the predefined data pattern provided from the data pattern providing unit to a memory region corresponding to the address signal.

Abstract: A semiconductor memory device includes a memory cell array and a test circuit. The test circuit reads data stream from the memory cell array, configured to, on comparing bits of each first unit in the data stream, compares corresponding bits in the first units as each second unit and outputs a fail information signal including pass/fail information on the data stream and additional information on the data stream, in a test mode of the semiconductor memory device.

Abstract: A semiconductor memory device includes a memory cell array and a first buffer. The memory cell array includes a plurality of bank arrays. Each of the plurality of bank arrays includes a plurality of memory cells. The memory cell array and the first buffer are configured for performing a first internal read operation, which represents operations of retrieving first data from a first region of the memory cell array and of storing the first data into the first buffer, based on a first read command and a first read address. The first internal read operation is performed based on a deterministic interface in which the first data is stored into the first buffer within a predetermined first duration after the first read command is received and a generation of a first acknowledgement signal is unnecessary after storing the first data into the first buffer is completed.

Abstract: A semiconductor memory device includes a memory cell array in which a plurality of memory cells are arranged. The semiconductor memory device includes an error correcting code (ECC) circuit configured to generate parity data based on main data, write a codeword including the main data and the parity data in the memory cell array, read the codeword from a selected memory cell row to generate syndromes, and correct errors in the read codeword on a per symbol basis based on the syndromes. The main data includes first data of a first memory cell of the selected memory cell row and second data of a second memory cell of the selected memory cell row. The first data and the second data are assigned to one symbol of a plurality of symbols, and the first memory cell and the second memory cell are adjacent to each other in the memory cell array.

Abstract: A memory device having an error notification function includes an error correction code (ECC) engine detecting and correcting an error bit by performing an ECC operation on data of the plurality of memory cells, and an error notifying circuit configured to output an error signal according to the ECC operation. The ECC engine outputs error information corresponding to the error bit corresponding to a particular address corrected by the ECC operation. The error notifying circuit may output the error signal when the particular address is not the same as any one of existing one or more failed addresses.

Abstract: A use time managing method of a semiconductor device may include (1) measuring an amount of accumulated operation time of the semiconductor device and when the amount is reached to a predetermined value, generating a unit storage activation signal; (2) repeating step (1) to generate one or more additional unit storage activation signals, thereby generating a plurality of unit storage activation signals, wherein the predetermined values are different for each repeating step; (3) storing data indicating each occurrence of generating the unit storage activation signals; and (4) detecting use time of the semiconductor device based on the cumulatively stored data.

Abstract: A semiconductor memory device includes a memory cell array and a first buffer. The memory cell array includes a plurality of bank arrays. Each of the plurality of bank arrays includes a plurality of memory cells. The memory cell array and the first buffer are configured for performing a first internal read operation, which represents operations of retrieving first data from a first region of the memory cell array and of storing the first data into the first buffer, based on a first read command and a first read address. The first internal read operation is performed based on a deterministic interface in which the first data is stored into the first buffer within a predetermined first duration after the first read command is received and a generation of a first acknowledgement signal is unnecessary after storing the first data into the first buffer is completed.

Abstract: A method of operating a volatile memory device includes storing address information of weak cell rows. According to some examples, after writing to a weak cell row, a refresh operation is performed on the weak cell row within a predetermined time. According to some examples, the writing operation to a weak cell row may be performed with a longer write recovery time than a write recovery time to normal cell rows.

Abstract: Provided are a memory device and a memory module, which perform both an ECC operation and a redundancy repair operation. The memory device repairs a single-bit error due to a ‘fail’ cell by using an error correction code (ECC) operation, and also repairs the ‘fail’ cell by using a redundancy repair operation when the ‘fail’ cell is not repairable by the ECC operation. The redundancy repair operation includes a data line repair and a block repair. The ECC operation may change a codeword corresponding to data per one unit of memory cells including the ‘fail’ cell, and may also change the size of parity bits regarding the changed codeword.

Abstract: Provided are a memory device and a memory module, which perform both an ECC operation and a redundancy repair operation. The memory device repairs a single-bit error due to a ‘fail’ cell by using an error correction code (ECC) operation, and also repairs the ‘fail’ cell by using a redundancy repair operation when the ‘fail’ cell is not repairable by the ECC operation. The redundancy repair operation includes a data line repair and a block repair. The ECC operation may change a codeword corresponding to data per one unit of memory cells including the ‘fail’ cell, and may also change the size of parity bits regarding the changed codeword.

Abstract: A memory device includes a memory cell array, a data pattern providing unit, and a write circuit. The memory cell array includes a plurality of memory regions. The data pattern providing unit is configured to provide a predefined data pattern. The write circuit is configured to, when a first write command and an address signal are received from an external device, write the predefined data pattern provided from the data pattern providing unit to a memory region corresponding to the address signal.

Abstract: In a method of operating a memory device, a command and a first address from a memory controller are received. A read code word including a first set of data corresponding to the first address, a second set of data corresponding to a second address and a read parity data is read from a memory cell array of the memory device. Corrected data are generated by operating error checking and correction (ECC) using an ECC circuit based on the read cord word.

Abstract: A memory module includes a plurality of memory devices and a buffer chip. The buffer chip manages the memory devices. The buffer chip includes a refresh control circuit that groups a plurality of memory cell rows of the memory devices into a plurality of groups according to a data retention time of tire memory cell rows. The buffer chip selectively refreshes each of the plurality of groups in each of a plurality of refresh time regions that are periodically repeated and applies respective refresh periods to the plurality of groups, respectively.