Abstract: The present invention relates to a positive electrode active material having improved capacity characteristic and life cycle characteristic, and a method of preparing the same, and specifically, to a positive electrode active material for a lithium secondary battery, wherein the positive electrode active material comprises a compound represented by Formula 1 above and allowing reversible intercalation/deintercalation of lithium, and from a crystal structure analysis of the positive electrode active material by a Rietveld method in which space group R-3m is used in a crystal structure model on the basis of an X-ray diffraction analysis, the thickness of MO slab is 2.1275 ? or less, the thickness of inter slab is 2.59 ? or greater, and the cation mixing ratio between Li and Ni is 0.5% or less, and a method of preparing the same.

Abstract: A DRAM device includes first terminals, second terminals, third terminals, a control signal generator, a CRC unit, a row decoder, a column decoder, and a memory cell array. The control signal generator generates a control signal. The CRC unit performs a first CRC logical operation on a first data group including qn-bit first data generated by inputting n-bit first data q times, generates a first CRC result signal, performs a second CRC logical operation on a second data group including qn-bit second data by inputting n-bit second q times, generates a second CRC result signal, and generates an error signal based on the first CRC result signal and the second CRC result signal. The error signal is generated based on the second CRC result signal regardless of the first CRC result signal in response to the control signal.

Abstract: A DRAM device includes first terminals, second terminals, third terminals, a control signal generator, a CRC unit, a row decoder, a column decoder, and a memory cell array. The control signal generator generates a control signal. The CRC unit performs a first CRC logical operation on a first data group including qn-bit first data generated by inputting n-bit first data q times, generates a first CRC result signal, performs a second CRC logical operation on a second data group including qn-bit second data by inputting n-bit second q times, generates a second CRC result signal, and generates an error signal based on the first CRC result signal and the second CRC result signal. The error signal is generated based on the second CRC result signal regardless of the first CRC result signal in response to the control signal.

Abstract: A semiconductor memory device which includes a memory cell array, an error injection register set, a data input buffer, a write data generator, and control logic. The error injection register set stores an error bit set, including at least one error bit, based on a first command. The error bit set is associated with a data set to be written in the memory cell array. The data input buffer stores the data set to be written in the memory cell array based on a second command. The write data generator generates a write data set to be written in the memory cell array based on the data set and the error bit set. The control logic controls the error injection register set and the data input buffer.

Abstract: A DRAM device includes first terminals, second terminals, third terminals, a control signal generator, a CRC unit, a row decoder, a column decoder, and a memory cell array. The control signal generator generates a control signal. The CRC unit performs a first CRC logical operation on a first data group including qn-bit first data generated by inputting n-bit first data q times, generates a first CRC result signal, performs a second CRC logical operation on a second data group including qn-bit second data by inputting n-bit second q times, generates a second CRC result signal, and generates an error signal based on the first CRC result signal and the second CRC result signal. The error signal is generated based on the second CRC result signal regardless of the first CRC result signal in response to the control signal.

Abstract: An integrated circuit device and a high bandwidth memory device are disclosed. The integrated circuit device includes a plurality of warpage detection sensors at a plurality of different positions, respectively, and electrically connected in series. Each of the plurality of warpage detection sensors is configured to generate a clock signal with a period that is based on a resistance that varies based on a pressure at a corresponding position, and to generate digital data by performing a counting operation in response to the clock signal.

Abstract: An integrated circuit device and a high bandwidth memory device are disclosed. The integrated circuit device includes a plurality of warpage detection sensors at a plurality of different positions, respectively, and electrically connected in series. Each of the plurality of warpage detection sensors is configured to generate a clock signal with a period that is based on a resistance that varies based on a pressure at a corresponding position, and to generate digital data by performing a counting operation in response to the clock signal.

Abstract: A semiconductor memory device and method of operation that is capable of reducing disturbance of adjacent word lines. A memory cell array includes a plurality of memory cells coupled to a plurality of word-lines and a plurality of bit-lines. A first word-line, which is selected in response to an access address received from the memory controller, is enabled in response to a first command received from a memory controller, and the first word-line is disabled internally in the semiconductor memory device or in response to a disable command received from the memory controller after a reference time interval elapses. The reference time interval starts from a first time point when the first command is applied to the semiconductor memory device, and corresponds to a time interval equal to or greater than a row active time interval of the semiconductor memory device.

Abstract: A DRAM device includes first terminals, second terminals, third terminals, a control signal generator, a CRC unit, a row decoder, a column decoder, and a memory cell array. The control signal generator generates a control signal. The CRC unit performs a first CRC logical operation on a first data group including qn-bit first data generated by inputting n-bit first data q times, generates a first CRC result signal, performs a second CRC logical operation on a second data group including qn-bit second data by inputting n-bit second q times, generates a second CRC result signal, and generates an error signal based on the first CRC result signal and the second CRC result signal. The error signal is generated based on the second CRC result signal regardless of the first CRC result signal in response to the control signal.

Abstract: A memory device includes a first memory cell array connected to a first internal data line; a second memory cell array connected to a second internal data line; and a line swap circuit configured to connect the first and second internal data lines with first and second external data lines based on an externally received driving signal. The line swap circuit is configured such that, when the driving signal has a first logic level, the line swap circuit connects the first and second internal data lines with the first and second external data lines, respectively, and when the driving signal has a second, different logic level, the line swap circuit swaps the first and second external data lines so that the first internal data line is connected to the second external data line and the second internal data line is connected to the first external data line.

Abstract: A method of managing memory includes generating a page pool by aligning a plurality of pages of a memory; when a request to store first data is received, allocating a destination page corresponding to the first data using a page pool; and updating a page table using information about the allocated destination page.

Abstract: A semiconductor memory device which includes a memory cell array, an error injection register set, a data input buffer, a write data generator, and control logic. The error injection register set stores an error bit set, including at least one error bit, based on a first command. The error bit set is associated with a data set to be written in the memory cell array. The data input buffer stores the data set to be written in the memory cell array based on a second command. The write data generator generates a write data set to be written in the memory cell array based on the data set and the error bit set. The control logic controls the error injection register set and the data input buffer.

Abstract: A memory device for performing a data write operation based on a multiple write command, an operating method thereof, and an operating method of a memory controller are provided. An operating method of a memory device including a plurality of banks includes receiving a write command, and data and an address corresponding to the write command, decoding the received write command, and responsive to a result of the decoding indicating that the write command corresponds to a multiple write command, together writing the same data in two or more banks using an internal address generating operation that is based on the received address.

Abstract: The memory device includes a memory array, control logic and a recovery circuit. The memory array has a first region configured to store data, a second region configured to store a portion of fail cell information, and a third region configured to store recovery information. The fail cell information identifies failed cells in the first region, and the recovery information is for recovering data stored in the identified failed cells. The control logic is configured to store the fail cell information, to transfer the portion of the fail cell information to the second region of the memory array, and to determine whether to perform a recovery operation based on address information in an access request and the portion of the fail cell information stored in the second region. The access request is a request to access the first region. The recovery circuit is configured to perform the recovery operation.

Abstract: A semiconductor memory device includes an integrated circuit (IC) chip structure, wherein the IC chip includes a substrate, a memory cell disposed on the substrate, and a local well disposed on the substrate, wherein a conductivity type of the local well is different from a conductivity type of the substrate, a wiring stack structure disposed on the IC chip structure, wherein the wiring stack structure includes a signal transfer pattern connected to the memory cell through a signal interconnector, and a thermal dispersion pattern connected to the local well through a thermal interconnector, and a heat transfer structure connected to the thermal dispersion pattern for transferring heat to the thermal dispersion pattern from a heat source.

Abstract: A semiconductor memory device includes a memory cell array in which a plurality of memory cells are arranged. The semiconductor memory device includes an error correcting code (ECC) circuit configured to generate parity data based on main data, write a codeword including the main data and the parity data in the memory cell array, read the codeword from a selected memory cell row to generate syndromes, and correct errors in the read codeword on a per symbol basis based on the syndromes. The main data includes first data of a first memory cell of the selected memory cell row and second data of a second memory cell of the selected memory cell row. The first data and the second data are assigned to one symbol of a plurality of symbols, and the first memory cell and the second memory cell are adjacent to each other in the memory cell array.

Abstract: A semiconductor memory device includes an integrated circuit (IC) chip structure, wherein the IC chip includes a substrate, a memory cell disposed on the substrate, and a local well disposed on the substrate, wherein a conductivity type of the local well is different from a conductivity type of the substrate, a wiring stack structure disposed on the IC chip structure, wherein the wiring stack structure includes a signal transfer pattern connected to the memory cell through a signal interconnector, and a thermal dispersion pattern connected to the local well through a thermal interconnector, and a heat transfer structure connected to the thermal dispersion pattern for transferring heat to the thermal dispersion pattern from a heat source.

Abstract: A memory device includes a memory cell array, a data pattern providing unit, and a write circuit. The memory cell array includes a plurality of memory regions. The data pattern providing unit is configured to provide a predefined data pattern. The write circuit is configured to, when a first write command and an address signal are received from an external device, write the predefined data pattern provided from the data pattern providing unit to a memory region corresponding to the address signal.

Abstract: A method of managing memory includes generating a page pool by aligning a plurality of pages of a memory; when a request to store first data is received, allocating a destination page corresponding to the first data using a page pool; and updating a page table using information about the allocated destination page.

Abstract: A semiconductor memory device and method of operation that is capable of reducing disturbance of adjacent word lines. A memory cell array includes a plurality of memory cells coupled to a plurality of word-lines and a plurality of bit-lines. A first word-line, which is selected in response to an access address received from the memory controller, is enabled in response to a first command received from a memory controller, and the first word-line is disabled internally in the semiconductor memory device or in response to a disable command received from the memory controller after a reference time interval elapses. The reference time interval starts from a first time point when the first command is applied to the semiconductor memory device, and corresponds to a time interval equal to or greater than a row active time interval of the semiconductor memory device.