Abstract: A user verification apparatus may perform user verification using multiple biometric verifiers. The user verification apparatus may set a termination stage of one or more biometric verifiers. Multiple biometric verifiers may be used to generate outputs, for which separate termination stages are set to establish a particular combination of set termination stages associated with the multiple biometric verifiers, and the user verification apparatus may fuse outputs of the biometric verifiers based on the particular combination of set termination stages. The user verification apparatus may verify a user based on a result of the fusing, and an unlocking command signal may be generated based on the verifying. The unlocking command signal may be generated to selectively grant access, to the verified user, to one or more elements of a device. The device may be a vehicle.

Abstract: A camera module including a lens unit configured to move in a direction of an optical axis and a direction perpendicular with respect to the optical axis; a housing unit accommodating the lens unit; and a shock absorbing member disposed between the housing unit and the lens unit to reduce impacts and noise generated when the housing unit and the lens unit collide.

Abstract: A semiconductor device has a first component. A modular interconnect structure is disposed adjacent to the first component. A first interconnect structure is formed over the first component and modular interconnect structure. A shielding layer is formed over the first component, modular interconnect structure, and first interconnect structure. The shielding layer provides protection for the enclosed semiconductor devices against EMI, RFI, or other inter-device interference, whether generated internally or from external semiconductor devices. The shielding layer is electrically connected to an external low-impedance ground point. A second component is disposed adjacent to the first component. The second component includes a passive device. An LC circuit includes the first component and second component. A semiconductor die is disposed adjacent to the first component. A conductive adhesive is disposed over the modular interconnect structure.

Abstract: A method for authenticating a user includes generating an image for authentication based on at least one authenticated image based on an input image, and performing authentication based on the generated image for authentication.

Abstract: Provided us a visual cortical circuit apparatus comprising: a current mirror unit which uses a transistor as a current source to generate a current having the same size as that of a reaction; a transconductance unit which takes, as an input, the current generated by the current mirror unit and outputs a voltage using a transconductance; and a buffer unit for converting the voltage output from the transconductance unit into a current and buffering the current.

Abstract: A dielectric fluid composition for electrical apparatus comprises a functionalized 12-hydroxy stearic acid having desirable properties including a pour point less than ?30° C. and a fire point greater than 250° C. It may be prepared by a process wherein 12-hydroxy methyl stearate is transesterified by reaction with a C3-C20 alcohol to form an alkyl-12-hydroxy stearate, followed by esterification thereof with a linear or branched C4-C20 carboxylic acid. This acid may be a free acid chloride, a fatty acid, a carboxylic acid anhydride, or combination thereof. The resulting functionalized 12-hydroxy stearic acid exhibits improved thermoxidative capability, low temperature flowability, and increased fire point.

Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.

Abstract: Disclosed is an effective thermal grease comprising a hyperbranched olefinic fluid and a thermally conductive filler. Property-modifying additives and fillers may also be included. The hyperbranched olefinic fluid is selected to have an average of at least 1.5 methine carbons per oligomer molecule and at least 40 methine carbons per one thousand total carbons. The thermal grease exhibits a flash point of 180° C. or higher, a pour point of 0° C. or lower, and a kinematic viscosity at 40° C. of no more than 200 cSt (0.0002 m 2/s). The composition may offer improved thermal conductivity, reduced tendency to migrate, and lower cost when compared with many other thermal greases, including silicone-based thermal greases.

Abstract: A semiconductor device includes a semiconductor die and an encapsulant deposited over and around the semiconductor die. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. A groove is formed in the base semiconductor material. The semiconductor wafer is singulated through the groove to separate the semiconductor die. The semiconductor die are disposed over a carrier with a distance of 500 micrometers (?m) or less between semiconductor die. The encapsulant covers a sidewall of the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while the encapsulant remains devoid of the fan-in interconnect structure. A portion of the encapsulant is removed from a non-active surface of the semiconductor die. The device is singulated through the encapsulant while leaving encapsulant disposed covering a sidewall of the semiconductor die. The encapsulant covering the sidewall includes a thickness of 50 ?m or less.

Abstract: An apparatus and method for analyzing body part association. The apparatus and method may recognize at least one body part from a user image extracted from an observed image, select at least one candidate body part based on association of the at least one body part, and output a user pose skeleton related to the user image based on the selected at least one candidate body part.

Abstract: A three-dimensional (3D) display device for displaying a 3D image using at least one of a gaze direction of a user and a gravity direction includes a gaze direction measuring unit to measure the gaze direction, a data obtaining unit to obtain 3D image data for the 3D image, a viewpoint information obtaining unit to obtain information relating to a viewpoint of the 3D image, a data transform unit to transform the 3D image data, based on the gaze direction and the information relating to the viewpoint of the 3D image, and a display unit to display the 3D image, based on the transformed 3D image data.

Abstract: A data transmission apparatus and method. Information exchange between virtual worlds is achieved by encoding information on a virtual world into metadata and transmitting the metadata to another virtual world. In particular, since the information on the virtual world is encoded into a binary format, high speed data transmission may be achieved.

Abstract: A semiconductor device has a first component. A modular interconnect structure is disposed adjacent to the first component. A first interconnect structure is formed over the first component and modular interconnect structure. A shielding layer is formed over the first component, modular interconnect structure, and first interconnect structure. The shielding layer provides protection for the enclosed semiconductor devices against EMI, RFI, or other inter-device interference, whether generated internally or from external semiconductor devices. The shielding layer is electrically connected to an external low-impedance ground point. A second component is disposed adjacent to the first component. The second component includes a passive device. An LC circuit includes the first component and second component. A semiconductor die is disposed adjacent to the first component. A conductive adhesive is disposed over the modular interconnect structure.

Abstract: A virtual world processing apparatus and method. Sensed information, which is information collected by a sensor is inputted. The sensed information is adapted, based on a sensor capability, which is information on capability of the sensor. Accordingly, interoperability between a real world and a virtual world or interoperability between virtual worlds may be achieved.

Abstract: The present invention relates to a camera module, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a housing configured to protect the image sensor and mounted therein with camera constituent parts, and plural pieces of lenses mounted on the housing, wherein a surface of the housing is metalized.

Abstract: A sensing module, and a Graphical User Interface (GUI) control apparatus and method are provided. The sensing module may be inserted into an input device, for example a keyboard, a mouse, a remote controller, and the like, and may sense a hovering movement of a hand of a user within a sensing area, and thus it is possible to provide an interface to control a wider variety of GUIs, and possible to prevent a display from being covered.

Abstract: Disclosed is an effective thermal grease comprising a hyperbranched olefinic fluid and a thermally conductive filler. Property-modifying additives and fillers may also be included. The hyperbranched olefinic fluid is selected to have an average of at least 1.5 methine carbons per oligomer molecule and at least 40 methine carbons per one thousand total carbons. The thermal grease exhibits a flash point of 180° C. or higher, a pour point of 0° C. or lower, and a kinematic viscosity at 40° C. of no more than 200 cSt (0.0002 m 2/s). The composition may offer improved thermal conductivity, reduced tendency to migrate, and lower cost when compared with many other thermal greases, including silicone-based thermal greases.

Abstract: An apparatus for detecting an interfacing region in a depth image detects the interfacing region based on a depth of a first region and a depth of a second region which is an external region of the first region in a depth image.

Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.

Abstract: In an apparatus and method for controlling an interface, a user interface (UI) may be controlled using information on a hand motion and a gaze of a user without separate tools such as a mouse and a keyboard. That is, the UI control method provides more intuitive, immersive, and united control of the UI. Since a region of interest (ROI) sensing the hand motion of the user is calculated using a UI object that is controlled based on the hand motion within the ROI, the user may control the UI object in the same method and feel regardless of a distance from the user to a sensor. In addition, since positions and directions of view points are adjusted based on a position and direction of the gaze, a binocular 2D/3D image based on motion parallax may be provided.