Abstract: A semiconductor device includes a semiconductor die and an encapsulant deposited over and around the semiconductor die. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. A groove is formed in the base semiconductor material. The semiconductor wafer is singulated through the groove to separate the semiconductor die. The semiconductor die are disposed over a carrier with a distance of 500 micrometers (?m) or less between semiconductor die. The encapsulant covers a sidewall of the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while the encapsulant remains devoid of the fan-in interconnect structure. A portion of the encapsulant is removed from a non-active surface of the semiconductor die. The device is singulated through the encapsulant while leaving encapsulant disposed covering a sidewall of the semiconductor die. The encapsulant covering the sidewall includes a thickness of 50 ?m or less.

Abstract: A video object detecting apparatus enables a user to not only simply watch the video but also to explore a video using a motion and a posture of the user. In addition, the user may manipulate the video using body motion instead of general input units such as a mouse and a touch system. Also, a video object deforming apparatus enables the user to recognize a difference in motions between an interactive video and the user, and provides the user with a video reflecting the difference.

Abstract: Described herein are variant Fc-fragments that contain an insertion within or adjacent to a loop that bind to the neonatal Fc receptor (FcRn) with higher affinity and/or higher binding activity at pH 5-6 and approximately the same or lower affinity at a physiologic pH as compared to a control Fc-fragment, that is, little or no binding activity at a physiologic pH. Also described are variant Fc-polypeptides that comprise these variant Fc-fragments. Further described are methods of making and identifying such Fc-fragments and methods for making and using such Fc-polypeptides.

Abstract: An apparatus recognizes an object using a hole in a depth image. An apparatus may include a foreground extractor to extract a foreground from the depth image, a hole determiner to determine whether a hole is present in the depth image, based on the foreground and a color image, a feature vector generator to generate a feature vector, by generating a plurality of features corresponding to the object based on the foreground and the hole, and an object recognizer to recognize the object, based on the generated feature vector and at least one reference feature vector.

Abstract: An exemplary embodiment of the present invention relates to a camera module configured to prevent a warp of an optical axis of a lens holder, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base, a first lens holder arranged at an upper surface of the base and including at least one or more lens modules therein, a second lens holder forming an outer cover of the first lens holder, and an actuator concentrically arranged with an optical axis of the lens module for adjusting a focus of an image captured by the image sensor.

Abstract: A semiconductor device has a first semiconductor die including an active region formed on a surface of the first semiconductor die. The active region of the first semiconductor die can include a sensor. An encapsulant is deposited over the first semiconductor die. A conductive layer is formed over the encapsulant and first semiconductor die. An insulating layer can be formed over the first semiconductor die. An opening is formed in the insulating layer over the active region. A transmissive layer is formed over the first semiconductor die including the active region. The transmissive layer includes an optical dielectric material or an optical transparent or translucent material. The active region is responsive to an external stimulus passing through the transmissive layer. A plurality of bumps is formed through the encapsulant and electrically connected to the conductive layer. A second semiconductor die is disposed adjacent to the first semiconductor die.

Abstract: A device and method for processing virtual worlds. According to embodiments of the present disclosure, information which is measured from the real world using characteristics of a sensor is transferred to a virtual world, to thereby implement an interaction between the real world and the virtual world. The disclosed device and method for processing virtual worlds involve selectively transferring information, from among the measured information, which is different from previously measured information. The disclosed device and method for processing virtual worlds involve transferring the entire measured information in the event that the measured information is significantly different from the previously measured information and for selectively transferring information, from among the measured information, which is different from the measured information in the event that the difference is not significant.

Abstract: A semiconductor device comprises a carrier including an adhesive disposed over the carrier. The semiconductor device further comprises a semiconductor wafer including a plurality of semiconductor die separated by a non-active region. A plurality of bumps is formed over the semiconductor die. The semiconductor wafer is mounted to the carrier with the adhesive disposed around the plurality of bumps. Irradiated energy is applied to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. The semiconductor wafer is singulated along the modified region by applying stress to the semiconductor wafer. The adhesive is removed from around the plurality of bumps after singulating the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die comprising through silicon vias. The modified region optionally includes a plurality of vertically stacked modified regions.

Abstract: Coated conductors including a conductive core at least partially surrounded by a polymeric coating. The polymeric coating has an ?-olefin based polymer and an ?-olefin based block composite. The ?-olefin block composite has block copolymers having hard segments and soft segments.

Abstract: A camera module including a lens unit configured to move in a direction of an optical axis and a direction perpendicular with respect to the optical axis; a housing unit accommodating the lens unit; and a shock absorbing member disposed between the housing unit and the lens unit to reduce impacts and noise generated when the housing unit and the lens unit collide.

Abstract: The present invention generally relates to a dielectric composition which is a poly-?-olefin or poly(co-ethylene-?-olefin) having a backbone weight average molecular weight less than 10,000 daltons. The dielectric composition uses a metal-ligand complex as a precatalyst and exhibits a hyperbranched structure that enables low viscosity, and therefore good flow characteristics, combined with high fire point due to ability to increase molecular weight via branching rather than backbone growth. Other desirable properties include lowered pour point due to crystallization disruption, and desirable thermal oxidative stability.

Abstract: A virtual world processing apparatus and method. An angle value is obtained by measuring an angle of a body part of a user of a real world using sensor capability, which is information on capability of a bending sensor, and is transmitted to a virtual world, thereby achieving interaction between the real world and the virtual world. In addition, based on the sensor capability and the angle value denoting the angle of the body part, control information is generated to control a part of an avatar of the virtual world, corresponding to the body part, and then transmitted to the virtual world. Accordingly, interaction between the real world and the virtual world is achieved.

Abstract: A semiconductor memory device includes a bit line sense amplifier, a first column select gate, and a second column select gate. The bit line sense amplifier senses an electric potential difference between a bit line and a complementary bit line during a sensing operation for memory cells. The first column select gate transfers an electric potential on the bit line to a local sense amplifier based on a column select signal. The second column select gate transfers an electric potential on the complementary bit line to the local sense amplifier based on the column select signal. The first and second column select gates have different current drive abilities to compensate a difference in bit line interconnection resistance.

Abstract: A display information controlling apparatus and method are provided. The display information controlling apparatus may select at least one object from one or more objects based on a location of each of the one or more objects on a display and a location on the display corresponding to a user input signal. The display information controlling apparatus may perform a predetermined operation corresponding to the selected at least one object.

Abstract: A camera module including a lens unit configured to move in a direction of an optical axis and a direction perpendicular with respect to the optical axis; a housing unit accommodating the lens unit; and a shock absorbing member disposed between the housing unit and the lens unit to reduce impacts and noise generated when the housing unit and the lens unit collide.

Abstract: A virtual world processing apparatus and method. Sensed information, which is information collected by a sensor is inputted. The sensed information is adapted, based on a sensor capability, which is information on capability of the sensor. Accordingly, interoperability between a real world and a virtual world or interoperability between virtual worlds may be achieved.

Abstract: The present invention relates to a camera module, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a housing configured to protect the image sensor and mounted therein with camera constituent parts, and plural pieces of lenses mounted on the housing, wherein a surface of the housing is metalized.

Abstract: An object recognition system is provided. The object recognition system for recognizing an object may include an input unit to receive, as an input, a depth image representing an object to be analyzed, and a processing unit to recognize a visible object part and a hidden object part of the object, from the depth image, by using a classification tree. The object recognition system may include a classification tree learning apparatus to generate the classification tree.

Abstract: An apparatus, system, and method for controlling a virtual object. The virtual object is controlled by detecting a hand motion of a user and generating an event corresponding to the hand motion. Accordingly, the user may control the virtual object displayed on a 3-dimensional graphic user interface (3D GUI) more intuitively and efficiently.

Abstract: A semiconductor device has a first semiconductor die including an active region formed on a surface of the first semiconductor die. The active region of the first semiconductor die can include a sensor. An encapsulant is deposited over the first semiconductor die. A conductive layer is formed over the encapsulant and first semiconductor die. An insulating layer can be formed over the first semiconductor die. An opening is formed in the insulating layer over the active region. A transmissive layer is formed over the first semiconductor die including the active region. The transmissive layer includes an optical dielectric material or an optical transparent or translucent material. The active region is responsive to an external stimulus passing through the transmissive layer. A plurality of bumps is formed through the encapsulant and electrically connected to the conductive layer. A second semiconductor die is disposed adjacent to the first semiconductor die.