Patents by Inventor Joon Han

Joon Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140233848
    Abstract: An apparatus recognizes an object using a hole in a depth image. An apparatus may include a foreground extractor to extract a foreground from the depth image, a hole determiner to determine whether a hole is present in the depth image, based on the foreground and a color image, a feature vector generator to generate a feature vector, by generating a plurality of features corresponding to the object based on the foreground and the hole, and an object recognizer to recognize the object, based on the generated feature vector and at least one reference feature vector.
    Type: Application
    Filed: November 7, 2013
    Publication date: August 21, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jae Joon HAN, Chang Kyu CHOI, Chang Kyo LEE
  • Patent number: 8779565
    Abstract: A method of manufacture of an integrated circuit mounting system includes: providing a die paddle with a component side having a die mount area and a recess with more than one geometric shape; applying an adhesive on the die mount area and in a portion of the recess; and mounting an integrated circuit device with an inactive side directly on the adhesive.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: July 15, 2014
    Assignee: STATS ChipPAC Ltd.
    Inventors: Byung Joon Han, Byung Tai Do, Arnel Senosa Trasporto, Henry Descalzo Bathan
  • Patent number: 8774871
    Abstract: Provided is a vibration apparatus, method and computer-readable medium generating vibrations and ultrasonic waves. The vibration apparatus, method and computer-readable medium may generate the vibrations or the ultrasonic waves in accordance with a first control signal and a second control signal each having a frequency band different from each other.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: July 8, 2014
    Assignees: Samsung Electronics Co., Ltd., Korea University of Technology and Education Industry-University Cooperation Foundation
    Inventors: Jae Joon Han, Won-Chul Bang, Sang-Youn Kim, Tae Heon Yang
  • Publication number: 20140184906
    Abstract: Disclosed herein is data communication that is implemented by capturing video including a plurality of different image codes and executing data matched with the image code to communicate a large amount of data while still displaying an image code for data communication in a minimum area.
    Type: Application
    Filed: December 27, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Il Kwon CHUNG, Kyung Joon HAN
  • Publication number: 20140183761
    Abstract: A semiconductor device includes a semiconductor die and an encapsulant deposited over and around the semiconductor die. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. A groove is formed in the base semiconductor material. The semiconductor wafer is singulated through the groove to separate the semiconductor die. The semiconductor die are disposed over a carrier with a distance of 500 micrometers (?m) or less between semiconductor die. The encapsulant covers a sidewall of the semiconductor die. A fan-in interconnect structure is formed over the semiconductor die while the encapsulant remains devoid of the fan-in interconnect structure. A portion of the encapsulant is removed from a non-active surface of the semiconductor die. The device is singulated through the encapsulant while leaving encapsulant disposed covering a sidewall of the semiconductor die. The encapsulant covering the sidewall includes a thickness of 50 ?m or less.
    Type: Application
    Filed: November 2, 2013
    Publication date: July 3, 2014
    Applicant: STATS ChipPAC, Ltd.
    Inventors: Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim, Byung Joon Han
  • Publication number: 20140183718
    Abstract: A semiconductor device includes a standardized carrier. A semiconductor wafer includes a plurality of semiconductor die and a base semiconductor material. The semiconductor wafer is singulated through a first portion of the base semiconductor material to separate the semiconductor die. The semiconductor die are disposed over the standardized carrier. A size of the standardized carrier is independent from a size of the semiconductor die. An encapsulant is deposited over the standardized carrier and around the semiconductor die. An interconnect structure is formed over the semiconductor die while leaving the encapsulant devoid of the interconnect structure. The semiconductor device is singulated through the encapsulant. Encapsulant remains disposed on a side of the semiconductor die.
    Type: Application
    Filed: September 25, 2013
    Publication date: July 3, 2014
    Applicant: STATS ChipPAC, Ltd.
    Inventors: Byung Joon Han, Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu
  • Patent number: 8766977
    Abstract: An apparatus and method for generating a skeleton model using motion data and image data. The apparatus for generating the skeleton model may synchronize the image data and the motion data, and generate a three-dimensional (3D) skeleton model of an entire body of a user using a silhouette extracted from the image data and also using a position or orientation of a joint of the user extracted from the motion data. The skeleton model may be generated using the image data and the motion data, thereby improving accuracy of the skeleton model of the entire body of the user.
    Type: Grant
    Filed: August 11, 2009
    Date of Patent: July 1, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang Yeong Kim, Won Chul Bang, Do Kyoon Kim, Kee Chang Lee, Jae Joon Han, Hwa Sup Lim
  • Publication number: 20140168389
    Abstract: A three-dimensional (3D) display device for displaying a 3D image using at least one of a gaze direction of a user and a gravity direction includes a gaze direction measuring unit to measure the gaze direction, a data obtaining unit to obtain 3D image data for the 3D image, a viewpoint information obtaining unit to obtain information relating to a viewpoint of the 3D image, a data transform unit to transform the 3D image data, based on the gaze direction and the information relating to the viewpoint of the 3D image, and a display unit to display the 3D image, based on the transformed 3D image data.
    Type: Application
    Filed: September 16, 2013
    Publication date: June 19, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jae Joon HAN, Chang Kyu Choi
  • Patent number: 8753549
    Abstract: The disclosure is directed to a thermally-stable dielectric fluid. The dielectric fluid includes (a) an oil, (b) a substituted, hindered phenolic antioxidant having at least two substituted cresol groups being covalently bonded to each other through a methylene bridge, and (c) a substituted, diphenyl amine antioxidant having at least two substituted phenyl groups being covalently bonded to each other through an amine bridge.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: June 17, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Suh Joon Han, Dale C. Schmidt, Christopher J. Tucker
  • Publication number: 20140110143
    Abstract: The present disclosure provides a dielectric fluid composed of a genetically engineered microbial oil (GEMO) and an antioxidant. The GEMO includes a triglyceride and an amount of small glyceride. The amount of small glyceride is within a range from 0.1 wt % to 30 wt %, based upon the GEMO weight.
    Type: Application
    Filed: June 25, 2012
    Publication date: April 24, 2014
    Inventors: Suh Joon Han, Brian R. Maurer
  • Patent number: 8704349
    Abstract: An integrated circuit package system is provided including providing a substrate having a first surface and second surface; mounting interconnects to the first surface; mounting integrated circuit dies to the first surface; embedding the interconnects and the integrated circuit die within an encapsulant on the substrate and leaving top portions of the interconnects exposed; attaching solder balls to the second surface; and singulating the substrate and the encapsulant into a plurality of integrated circuit packages.
    Type: Grant
    Filed: February 14, 2006
    Date of Patent: April 22, 2014
    Assignee: Stats Chippac Ltd.
    Inventors: Seng Guan Chow, II Kwon Shim, Byung Joon Han
  • Publication number: 20140101604
    Abstract: An interfacing device for providing a user interface (UI) exploiting a multi-modality may recognize at least two modality inputs for controlling a scene, and generate scene control information based on the at least two modality inputs.
    Type: Application
    Filed: October 4, 2013
    Publication date: April 10, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Joon HAN, Seung Ju HAN, Du Sik PARK, Chang Kyu CHOI
  • Patent number: 8674516
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; attaching vertical interconnects along a periphery of the first substrate; mounting an integrated circuit over the first substrate, the integrated circuit surrounded by the vertical interconnects; and mounting a second substrate directly on the vertical interconnects and the integrated circuit.
    Type: Grant
    Filed: June 22, 2011
    Date of Patent: March 18, 2014
    Assignee: Stats Chippac Ltd.
    Inventors: Byung Joon Han, In Sang Yoon, JoHyun Bae
  • Patent number: 8643163
    Abstract: An integrated circuit package-on-package stacking system includes: providing a first integrated circuit package, mounting a metalized interposer substrate over the first integrated circuit package, attaching a stiffener integrated with the metalized interposer substrate and having dimensions within package extents, and attaching a second integrated circuit package on the metalized interposer substrate adjacent the stiffener.
    Type: Grant
    Filed: February 16, 2009
    Date of Patent: February 4, 2014
    Assignee: STATS ChipPAC Ltd.
    Inventors: Il Kwon Shim, Byung Joon Han, Seng Guan Chow
  • Publication number: 20140015931
    Abstract: A virtual world processing apparatus and method are provided. Sensed information related to an image taken in a real world is transmitted to a virtual world using image sensor capability information, which is information on a capability of an image sensor.
    Type: Application
    Filed: July 3, 2013
    Publication date: January 16, 2014
    Inventors: Seung Ju HAN, Min Su Ahn, Jae Joon Han, Do Kyoon Kim, Yong Beom Lee
  • Patent number: 8580160
    Abstract: The disclosure is directed to a dielectric fluid. The dielectric fluid includes an algae oil. The algae oil includes a natural algae antioxidant. The natural algae antioxidant is selected from ?-carotene, astaxanthin, tocopherol, polyunsaturated triglycerides, and combinations thereof.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: November 12, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Suh Joon Han, Dirk B. Zinkweg, Jeffrey M. Cogen, Steve Gluck
  • Publication number: 20130278633
    Abstract: A method and system for generating an augmented reality (AR) scene may include obtaining real world information including multimedia information and sensor information associated with a real world, loading an AR locator representing a scheme for mixing the real world information and at least one virtual object content and the real world information onto an AR container, obtaining the at least one virtual object content corresponding to the real world information using the AR locator from a local storage or an AR contents server, and visualizing AR information by mixing the real world information and the at least one virtual object content based on the AR locator.
    Type: Application
    Filed: April 19, 2013
    Publication date: October 24, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Min Su Ahn, Seung Ju Han, Jae Joon Han, Do Kyoon Kim, Yong Beom Lee
  • Publication number: 20130271449
    Abstract: A method of generating three-dimensional (3D) volumetric data may be performed by generating a multilayer image, generating volume information and a type of a visible part of an object, based on the generated multilayer image, and generating volume information and a type of an invisible part of the object, based on the generated multilayer image. The volume information and the type of each of the visible part and invisible part may be generated based on the generated multilayered image which may be include at least one of a ray-casting-based multilayer image, a chroma key screen-based multilayer image, and a primitive template-based multilayer image.
    Type: Application
    Filed: April 8, 2013
    Publication date: October 17, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Chang Kyo LEE, Byung In Yoo, Chang Kyu Choi, Jae Joon Han
  • Publication number: 20130264527
    Abstract: The method of manufacturing a natural ester, oil-based electrical insulation fluid by contacting refined, bleached, optionally winterized, and deodorized natural ester oil, e.g., soy oil, with an absorbent is improved by using as the absorbent a synthetic silicate absorbent comprising an alkali and/or alkaline earth metal, e.g., magnesium.
    Type: Application
    Filed: November 8, 2011
    Publication date: October 10, 2013
    Inventors: Suh Joon Han, Peter C. Dreux, Paul J. Caronia, Daniel Witte
  • Publication number: 20130204852
    Abstract: A data transmission apparatus and method. Information exchange between virtual worlds is achieved by encoding information on a virtual world into metadata and transmitting the metadata to another virtual world. In particular, since the information on the virtual world is encoded into a binary format, high speed data transmission may be achieved.
    Type: Application
    Filed: July 21, 2011
    Publication date: August 8, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Joon Han, Seung Ju Han, Won Chul Bang, Do Kyoon Kim