Abstract: A semiconductor device comprises a carrier including an adhesive disposed over the carrier. The semiconductor device further comprises a semiconductor wafer including a plurality of semiconductor die separated by a non-active region. A plurality of bumps is formed over the semiconductor die. The semiconductor wafer is mounted to the carrier with the adhesive disposed around the plurality of bumps. Irradiated energy is applied to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. The semiconductor wafer is singulated along the modified region by applying stress to the semiconductor wafer. The adhesive is removed from around the plurality of bumps after singulating the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die comprising through silicon vias. The modified region optionally includes a plurality of vertically stacked modified regions.

Abstract: A method for fabricating an encapsulant cavity integrated circuit package system includes: providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity.

Abstract: A video object detecting apparatus enables a user to not only simply watch the video but also to explore a video using a motion and a posture of the user. In addition, the user may manipulate the video using body motion instead of general input units such as a mouse and a touch system. Also, a video object deforming apparatus enables the user to recognize a difference in motions between an interactive video and the user, and provides the user with a video reflecting the difference.

Abstract: An apparatus, system, and method for controlling a virtual object. The virtual object is controlled by detecting a hand motion of a user and generating an event corresponding to the hand motion. Accordingly, the user may control the virtual object displayed on a 3-dimensional graphic user interface (3D GUI) more intuitively and efficiently.

Abstract: A semiconductor package has a semiconductor die disposed on a substrate. A bond wire is connected between a first bonding site on the semiconductor die and a second bonding site on the substrate. The first bonding site is a die bond pad; the second bonding site is a stitch bond. The second bonding site has a bond finger formed on the substrate, a conductive layer in direct physical contact with the bond finger, and a bond stud coupled to the bond wire and in direct physical contact with the conductive layer to conduct an electrical signal from the semiconductor die to the bond finger. The bond finger is made of copper. The conductive layer is made of copper or gold. The bond stud is made of gold and overlies a side portion and top portion of the copper layer.

Abstract: An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer.

Abstract: A method and apparatus for processing a virtual world. A data structure of a virtual object of a virtual world may be defined, and a virtual world object of the virtual world may be controlled, and accordingly an object in a real world may be reflected to the virtual world. Additionally, the virtual world object may migrate between virtual worlds, using the defined data structure.

Abstract: Disclosed are a virtual world processing device and method. By way of example, data collected from the real world is converted to binary form data which is then transmitted, or is converted to XML data, or the converted XML data is further converted to binary form data which is then transmitted, thereby allowing the data transmission rate to be increased and a low bandwidth to be used, and, in the case of a data-receiving adaptation RV engine, the complexity of the adaptation RV engine can be reduced as there is no need to include an XML parser.

Abstract: A virtual world processing apparatus and method. Sensed information, which is information collected by a sensor is inputted. The sensed information is adapted, based on a sensor capability, which is information on capability of the sensor. Accordingly, interoperability between a real world and a virtual world or interoperability between virtual worlds may be achieved.

Abstract: Provided is a feature extraction method and apparatus to extract a feature of a three-dimensional (3D) depth image. The feature extraction apparatus may generate a plurality of level sets using a depth image, and may extract a feature for each level depth image.

Abstract: A sensing module, and a Graphical User Interface (GUI) control apparatus and method are provided. The sensing module may be inserted into an input device, for example a keyboard, a mouse, a remote controller, and the like, and may sense a hovering movement of a hand of a user within a sensing area, and thus it is possible to provide an interface to control a wider variety of GUIs, and possible to prevent a display from being covered.

Abstract: Provided are a display device and a non-transitory computer-readable recording medium. By comparing a priority of an animation clip corresponding to a predetermined part of an avatar of a virtual world with a priority of motion data and by determining data corresponding to the predetermined part of the avatar, a motion of the avatar in which motion data sensing a motion of a user of a real world is associated with the animation clip may be generated.

Abstract: Disclosed is a moving object and a location measuring device and method thereof that may transmit an ultrasound signal to the moving object through a plurality of ultrasound transmitting units, and may estimate a location of the moving object at a current time based on distance information of distances between the moving object and the plurality of ultrasound transmitting units measured based on the transmitted ultrasound, inertia information, and location information of the moving object at a time prior to the current time.

Abstract: A method of manufacture of an integrated circuit mounting system includes: providing a die paddle with a component side having a die mount area and a recess with more than one geometric shape; applying an adhesive on the die mount area and in a portion of the recess; and mounting an integrated circuit device with an inactive side directly on the adhesive.

Abstract: An integrated circuit package system includes a base substrate, attaching a base die over the base substrate, attaching an integrated interposer having interposer circuit devices, over the base die, and forming a package system encapsulant having an encapsulant cavity over the integrated interposer on a side opposite the base die.

Abstract: A bridge stack integrated circuit package-on-package system is provided including forming a first integrated circuit package system having a first substrate, forming a second integrated circuit package system having a second substrate, and mounting a bridge integrated circuit package system on the first substrate and on the second substrate.

Abstract: Disclosed are an apparatus and a method of location tracking. The location tracking apparatus may calculate a location of an object using an ultrasound. In this instance, an intensity of the used ultrasound may be determined based on a distance to the object, thereby reducing unnecessary power consumption.

Abstract: In an apparatus and method for controlling an interface, a user interface (UI) may be controlled using information on a hand motion and a gaze of a user without separate tools such as a mouse and a keyboard. That is, the UI control method provides more intuitive, immersive, and united control of the UI. Since a region of interest (ROI) sensing the hand motion of the user is calculated using a UI object that is controlled based on the hand motion within the ROI, the user may control the UI object in the same method and feel regardless of a distance from the user to a sensor. In addition, since positions and directions of view points are adjusted based on a position and direction of the gaze, a binocular 2D/3D image based on motion parallax may be provided.

Abstract: A semiconductor device has a wafer for supporting the device and a conductive layer formed over a top surface of the wafer. A carrier wafer is permanently bonded over the conductive layer. Within the wafer and the carrier wafer, an interconnect structure is formed. The interconnect structure includes a first via formed in the wafer that exposes the conductive layer, a second via formed in the carrier wafer that exposes the conductive layer, a first metal layer deposited over the first via, the first metal layer in electrical contact with the conductive layer, and a second metal layer deposited over the second via, the second metal layer in electrical contact with the conductive layer. First and second insulation layers are deposited over the first and second metal layers respectively. The first or second insulation layer has an etched portion to expose a portion of the first or second metal layer.

Abstract: An object controlling apparatus and method are provided. An object of a virtual world may be more intuitively and readily manipulated by controlling an operation, a state, a shape, and the like of the object based on transform information associated with the object and a pointing signal for manipulating the virtual that is received from an input device. In addition, by manipulating the object based on information matching the input pointing signal between internal transform information and total transform information, a unique transform operation may be assigned to each object and thus, the user may be provided with a variety of functions. Here, the internal transform information is uniquely set for each object and the total transform information is set to be commonly applied to all the objects of the virtual world.