Abstract: An induction heating cooker includes heat resistant glass; an induction coil unit located under the heat resistant glass to generate a magnetic field; a plurality of light emitting diodes (LEDs) provided outside the induction coil unit while being spaced apart from each other along a circumferential direction of the induction coil unit; a printed circuit board, the plurality of LEDs being mounted on the printed circuit board; a light blocking film provided on a lower surface of the heat resistant glass; and a slit formed in the light blocking film and allowing light radiated from the plurality of LEDs to pass therethrough.

Abstract: An induction heating cooker includes heat resistant glass; an induction coil unit located under the heat resistant glass to generate a magnetic field; a plurality of light emitting diodes (LEDs) provided outside the induction coil unit while being spaced apart from each other along a circumferential direction of the induction coil unit; a printed circuit board, the plurality of LEDs being mounted on the printed circuit board; a light blocking film provided on a lower surface of the heat resistant glass; and a slit formed in the light blocking film and allowing light radiated from the plurality of LEDs to pass therethrough.

Abstract: An induction heating cooker including reinforced heat resistant glass on which a cooking vessel is placed, an induction coil unit located under the reinforced heat resistant glass and configured to generate a magnetic field, a plurality of light emitting diodes (LEDs) provided radially outside and vertically below the induction coil unit while being spaced apart from each other along a circumferential direction of the induction coil unit, a plurality of convex lenses provided on front surfaces of the plurality of LEDs, respectively, a light blocking film provided on a lower surface of the reinforced heat resistant glass, and a slit formed in the light blocking film and allowing light radiated from the plurality of LEDs to pass therethrough, so that light radiated from the LEDs are slantingly projected to form an image of flame, which looks real, on a lower end portion of a side surface of the cooking vessel.

Abstract: A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which is formed with a ground circuit and mounted with a semiconductor chip on one surface, a conductive ground layer, which is formed on the other surface of the substrate and connected with the ground circuit, a molding, which seals up the ground layer and the substrate having the semiconductor chip mounted thereon, and a conductive shield, which covers the molding and is connected with the ground layer. With a semiconductor package in accordance with an embodiment of the present invention, grounding for shielding is possible even in an entirely molded structure, and a double shielding structure to improve the shielding property.

Abstract: An induction heating cooker including reinforced heat resistant glass on which a cooking vessel is placed, an induction coil unit located under the reinforced heat resistant glass and configured to generate a magnetic field, a plurality of light emitting diodes (LEDs) provided radially outside and vertically below the induction coil unit while being spaced apart from each other along a circumferential direction of the induction coil unit, a plurality of convex lenses provided on front surfaces of the plurality of LEDs, respectively, a light blocking film provided on a lower surface of the reinforced heat resistant glass, and a slit formed in the light blocking film and allowing light radiated from the plurality of LEDs to pass therethrough, so that light radiated from the LEDs are slantingly projected to form an image of flame, which looks real, on a lower end portion of a side surface of the cooking vessel.

Abstract: Disclosed herein are an insulation resin composition for a printed circuit board including: an epoxy resin, a first inorganic filler having thermal conductivity of 20 W/mK or more, and a second inorganic filler having relative permittivity less than 10, and an insulating film, a prepreg, and a printed circuit board.

Abstract: The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof and provides a chip embedded printed circuit board including: an insulating layer having vias formed therethrough; a first chip and a second chip embedded in the insulating layer and having pads, which are respectively exposed to upper and lower surfaces of the insulating layer, on one surfaces thereof; an upper pattern formed on the upper surface of the insulating layer to be connected to the pads of the first chip and the vias; and a lower pattern formed on the lower surface of the insulating layer to be connected to the pads of the second chip and the vias. Also, the present invention provides a manufacturing method of a chip embedded printed circuit board.

Abstract: An electronic component package includes: a first insulation layer; an electronic component mounted in one surface of the first insulation layer; a heat sink formed with a cavity corresponding to the electronic component, bonded to the one surface of the first insulation layer to cover the electronic component, and formed with an inset hole and with an inlet hole; an adhesive charged in the cavity; and a circuit pattern formed in another surface of the first insulation layer.

Abstract: An electronic component package and a manufacturing method thereof are disclosed. The electronic component package manufacturing method, which includes mounting an electronic component in one surface of a first insulation layer; bonding a heat sink to the one surface of the first insulation layer, corresponding to the electronic component, to cover the electronic component, the heat sink being formed with a cavity; charging the cavity with an adhesive; and forming a circuit pattern in the other surface of the first insulation layer, can prevent a void from being generated in the adhesive, make the handling stable and make the size small by allowing the heat sink formed with the cavity to cover the electronic component before the pattern build-up and supplying the adhesive through one side of the cavity while providing negative pressure through the other side.

Abstract: This invention relates to a resin composition with enhanced heat-releasing properties, including a liquid crystal oligomer, an epoxy resin, or a resin mixture thereof, and graphene oxide as a filler, and to a heat-releasing film for an electronic device, an insulating film for a printed circuit board, and a prepreg, which are manufactured using the resin composition.

Abstract: Disclosed herein are a prepreg, including: an inorganic fiber, an organic fiber, or a hybrid fiber obtained by mix-weaving the inorganic fiber and the organic fiber, coated with a thermally conductive component or impregnated with a thermally conductive component; and a cross-linkable resin for impregnating the fiber therewith, a method for manufacturing the same, and a copper clad laminate using the same, so that the prepreg and the copper clad laminate can maintain a low coefficient of thermal expansion and a high modulus of elasticity and have excellent heat radiation property.

Abstract: A heat radiating substrate having strengthened insulation resistance and heat conductivity, and a manufacturing method thereof. The method for manufacturing a heat radiating substrate includes: preparing a metal substrate; performing an anodizing process on the metal substrate to form an anodic oxidation layer; filling surface pores of the anodic oxidation layer with an insulating material; and forming a metal wiring layer on the anodic oxidation layer. High insulation resistance and heat conductivity can be obtained by filling surface pores formed in an anodizing process with an insulating material.

Abstract: This invention relates to an insulating film for a printed circuit board having improved thermal conductivity, a manufacturing method thereof and a printed circuit board using the same, wherein the insulating film includes an amphiphilic block copolymer having a vertical structure formed in a thickness direction by chemically coupling a hydrophilic compound with a hydrophobic compound.

Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate; an Insulating layer formed on one surface or both surfaces of the base substrate; an electrode layer formed on a top surface of the insulating layer; and an insulating film covering a surface of the insulating layer except for a bonding surface between the electrode layer and the insulating layer so as to secure high dielectric breakdown voltage while keeping high thermal conductivity.

Abstract: Disclosed herein are a metal heat radiation substrate and a manufacturing method thereof. The metal heat radiation substrate includes: a metal substrate having a through-hole formed therein; a heat resistant insulating material filled in the through-hole and having a via hole formed at a filled portion; a metal oxide film formed on upper and lower surfaces of the metal substrate except for an inner wall of the through-hole by performing anodizing thereon; and a conductive layer filled in the via hole and formed over the metal oxide film.

Abstract: Disclosed herein are an electrode pattern and a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. In order to increase a heat dissipation effect, disclosed herein are an electrode pattern including electrode layers with a predetermined pattern; and insulators insulating the electrode layers from each other, in which the insulators are made of metal oxide, a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same.

Abstract: Disclosed herein is a package substrate including: a base substrate; insulation layers formed on upper and lower portions of the base substrate; a first metal layer formed on an upper portion of the insulation layer; a first through-via penetrating through the base substrate, the insulation layer, and the first metal layer and being made of an insulating material; a seed layer formed on upper and lower portions and an inner wall of the first through-via; a second metal layer formed on upper portions of the first metal layer and the seed layer; and a second through-via formed in the seed layer formed at the inner wall of the first through-via and the second metal layer.

Abstract: Disclosed herein is an apparatus for manufacturing a substrate. The apparatus for manufacturing a substrate includes: a reaction gas ejector ejecting reaction gas; a lift pin supporting the substrate and having a header contacting a rear surface of the substrate; and a support chuck having a lift pin insertion unit inserted with the lift pin and moving vertically and including a ring in a header insertion portion into which the header is inserted in the lift pin insertion unit.

Abstract: The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof. The present invention provides the chip embedded printed circuit board including an insulating layer embedding a chip provided with posts at an upper part, vias formed through the insulating layer, upper patterns formed at the upper part of the insulating layer to be connected to the posts and the vias and lower patterns formed at a lower part of the insulating layer to be connected to the vias, and the manufacturing method thereof.

Abstract: Disclosed herein are a wafer level package for heat dissipation and a method of manufacturing the same. The wafer level package includes a heat dissipation plate including a cavity and a hole, a die including a pad disposed in the cavity of the heat dissipation plate in a face-up manner, a thermal conductive adhesive disposed between the die and an inner wall of the cavity and disposed in the hole, and a redistribution layer connected at one end to the pad and at the other end extended. The wafer level package protects the die from external environments and enables the die to be easily flush with the heat dissipation plate.