Abstract: A method of improving an error checking and correction performance of a memory includes replacing a defective column including a defective memory cell of the memory cell array with a spare column of a the spare cell array, wherein the memory cell array includes memory cells in a matrix and the spare cell array includes spare memory cells in a matrix to be replaced for defective memory cells; storing check bits of error correction code in at least one memory cell of the defective column; storing defect information regarding a defect of the defective memory cell; determining whether the at least one memory cell storing the check bits is to be used to perform error checking and correction on a memory, based on the defect information; and performing error checking and correction on the memory using a memory cell selected based on a result of determining whether the at least one memory cell storing the check bits is to be used.

Abstract: Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.

Abstract: Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.

Abstract: Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.