Patents by Inventor Joon Sup Lee
Joon Sup Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10693043Abstract: Disclosed are an LED and an LED module. The LED includes: a first conductivity type semiconductor layer; a mesa disposed over the first conductivity type semiconductor layer and including an active layer and a second conductivity type semiconductor layer; a first ohmic-contact structure in contact with the first conductivity type semiconductor layer; a second ohmic-contact structure in contact with the second conductivity type semiconductor layer; a lower insulating layer at least partially covering the mesa and the first conductivity type semiconductor layer and disposed to form a first opening part at least partially exposing the first ohmic-contact structure and a second opening part at least partially exposing the second ohmic-contact structure; and a current distributing layer connected to the first ohmic-contact structure at least partially exposed by the first opening part and disposed to form a third opening part at least partially exposing the second opening part.Type: GrantFiled: February 12, 2018Date of Patent: June 23, 2020Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jong Hyeon Chae, Won Young Roh, Joon Sup Lee, Min Woo Kang, Jong Min Jang, Hyun A Kim, Seon Min Bae, Daewoong Suh
-
Publication number: 20200176636Abstract: A light emitting diode is provided to include a first conductive-type semiconductor layer; a mesa including a second conductive-type semiconductor layer disposed on the first conductive-type semiconductor layer and an active layer interposed between the first and the second conductive-type semiconductor layers; and a first electrode disposed on the mesa, wherein the first conductive-type semiconductor layer includes a first contact region disposed around the mesa along an outer periphery of the first conductive-type semiconductor layer; and a second contact region at least partially surrounded by the mesa, the first electrode is electrically connected to at least a portion of the first contact region and at least a portion of the second contact region, and a linewidth of an adjoining region between the first contact region and the first electrode is greater than the linewidth of an adjoining region between the second contact region and the first electrode.Type: ApplicationFiled: February 5, 2020Publication date: June 4, 2020Inventors: Jong Hyeon CHAE, Joon Sup LEE, Daewoong SUH, Won Young ROH, Min Woo KANG, Jong Min JANG, Se Hee OH, Hyun A KIM
-
Publication number: 20200098949Abstract: A light emitting diode apparatus includes a substrate, a first conductive type semiconductor layer, a second conductive type semiconductor layer, a mesa, a lower insulating layer, a first pad and a second pad. The substrate has a first surface and a second surface opposite to the first surface. The first conductivity type semiconductor layer is disposed on the first surface of the substrate. The mesa is disposed on the first conductive semiconductor layer and has an active layer and the second conductive semiconductor layer. A peripheral edge of the first conductive semiconductor layer is exposed. The lower insulating layer covers the mesa and the first conductive semiconductor layer and has a plurality of first openings exposing the first conductive semiconductor layer along a peripheral edge of the substrate.Type: ApplicationFiled: October 22, 2019Publication date: March 26, 2020Applicant: SEOUL VIOSYS CO., LTD.Inventors: Jong Hyeon CHAE, Joon Sup LEE, Won Young ROH, Min Woo KANG, Jong Min JANG, Hyun A KIM, Daewoong SUH
-
Patent number: 10573785Abstract: A light emitting diode is provided to include a first conductive-type semiconductor layer; a mesa including a second conductive-type semiconductor layer disposed on the first conductive-type semiconductor layer and an active layer interposed between the first and the second conductive-type semiconductor layers; and a first electrode disposed on the mesa, wherein the first conductive-type semiconductor layer includes a first contact region disposed around the mesa along an outer periphery of the first conductive-type semiconductor layer; and a second contact region at least partially surrounded by the mesa, the first electrode is electrically connected to at least a portion of the first contact region and at least a portion of the second contact region, and a linewidth of an adjoining region between the first contact region and the first electrode is greater than the linewidth of an adjoining region between the second contact region and the first electrode.Type: GrantFiled: December 11, 2017Date of Patent: February 25, 2020Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jong Hyeon Chae, Joon Sup Lee, Daewoong Suh, Won Young Roh, Min Woo Kang, Jong Min Jang, Se Hee Oh, Hyun A Kim
-
Publication number: 20200035751Abstract: A light-emitting element includes a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first contact electrode and a second contact electrode located on the light-emitting structure, and respectively making ohmic contact with the first conductive semiconductor layer and the second conductive semiconductor layer; an insulation layer for covering a part of the first contact electrode and the second contact electrode so as to insulate the first contact electrode and the second contact electrode; a first electrode pad and a second electrode pad electrically connected to each of the first contact electrode and the second contact electrode; and a radiation pad formed on the insulation layer, and radiating heat generated from the light-emitting structure.Type: ApplicationFiled: October 7, 2019Publication date: January 30, 2020Inventors: Jong Kyu KIM, So Ra LEE, Yeo Jin YOON, Jae Kwon KIM, Joon Sup LEE, Min Woo KANG, Se Hee OH, Hyun A. KIM, Hyoung Jin LIM
-
Publication number: 20200013928Abstract: A light emitting diode including a first conductive type semiconductor layer, a mesa disposed on the first conductive type semiconductor layer, the mesa including an active layer and a second conductive type semiconductor layer, a reflective electrode disposed on the mesa and configured to be in ohmic-contact with the second conductive type semiconductor layer, a current spreading layer disposed on the mesa and the reflective electrode, the current spreading layer including a first portion configured to be in ohmic-contact with an upper surface of the first conductive type semiconductor layer, a first n-contact region spaced apart from a second n-contact region with the mesa disposed between the first and second n-contact regions, and an insulation layer including a first opening exposing the reflective electrode between the first and second n-contact regions. The first and second n-contact regions have a second opening that exposes the first conductive type semiconductor layer.Type: ApplicationFiled: September 16, 2019Publication date: January 9, 2020Inventors: Jong Hyeon CHAE, Jong Min Jang, Won Young Roh, Daewoong Suh, Dae Sung Cho, Joon Sup Lee, Kyu Ho Lee, Chi Hyun In
-
Patent number: 10505077Abstract: A light emitting element according to an embodiment of the present invention comprises a first conductive-type semiconductor layer including a contact region on the lower surface thereof, a light emitting structure which includes a mesa including a second conductive-type semiconductor layer and an active layer, a second electrode, a first insulation layer, an electrode cover layer, a first electrode, a second insulation layer, and a support structure. In addition, the mesa may include a body part and a plurality of protrusion parts protruding from the body part, the contact region may be disposed between the protrusion parts, and a part of the contact region may overlap with a second metal bulk in the vertical direction. Accordingly, current spreading efficiency can be improved, and thus luminance efficiency can be more improved.Type: GrantFiled: December 19, 2018Date of Patent: December 10, 2019Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jong Hyeon Chae, Chang Yeon Kim, Joon Sup Lee, Dae Woong Suh, Won Young Roh, Ju Yong Park, Seung Hyun Kim
-
Patent number: 10497836Abstract: A light-emitting diode is provided to include: a transparent substrate having a first surface, a second surface, and a side surface; a first conductive semiconductor layer positioned on the first surface of the transparent substrate; a second conductive semiconductor layer positioned on the first conductive semiconductor layer; an active layer positioned between the first conductive semiconductor layer and the second conductive semiconductor layer; a first pad electrically connected to the first conductive semiconductor layer; and a second pad electrically connected to the second conductive semiconductor layer, wherein the transparent substrate is configured to discharge light generated by the active layer through the second surface of the transparent substrate, and the light-emitting diode has a beam angle of at least 140 degrees or more. Accordingly, a light-emitting diode suitable for a backlight unit or a surface lighting apparatus can be provided.Type: GrantFiled: March 27, 2017Date of Patent: December 3, 2019Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jong Hyeon Chae, Joon Sup Lee, Won Young Roh, Min Woo Kang, Jong Min Jang, Hyun A. Kim, Daewoong Suh
-
Patent number: 10439105Abstract: A light emitting diode including a first conductive type semiconductor layer, a mesa disposed on the first conductive type semiconductor layer, the mesa including an active layer and a second conductive type semiconductor layer, a reflective electrode disposed on the mesa and configured to be in ohmic-contact with the second conductive type semiconductor layer, a current spreading layer disposed on the mesa and the reflective electrode, the current spreading layer including a first portion configured to be in ohmic-contact with an upper surface of the first conductive type semiconductor layer, a first n-contact region spaced apart from a second n-contact region with the mesa disposed between the first and second n-contact regions, and an insulation layer including a first opening exposing the reflective electrode between the first and second n-contact regions. The first and second n-contact regions have a second opening that exposes the first conductive type semiconductor layer.Type: GrantFiled: August 2, 2016Date of Patent: October 8, 2019Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Hyeon Chae, Jong Min Jang, Won Young Roh, Daewoong Suh, Dae Sung Cho, Joon Sup Lee, Kyu Ho Lee, Chi Hyun In
-
Patent number: 10438992Abstract: A light-emitting element includes a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first contact electrode and a second contact electrode located on the light-emitting structure, and respectively making ohmic contact with the first conductive semiconductor layer and the second conductive semiconductor layer; an insulation layer for covering a part of the first contact electrode and the second contact electrode so as to insulate the first contact electrode and the second contact electrode; a first electrode pad and a second electrode pad electrically connected to each of the first contact electrode and the second contact electrode; and a radiation pad formed on the insulation layer, and radiating heat generated from the light-emitting structure.Type: GrantFiled: January 18, 2017Date of Patent: October 8, 2019Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jong Kyu Kim, So Ra Lee, Yeo Jin Yoon, Jae Kwon Kim, Joon Sup Lee, Min Woo Kang, Se Hee Oh, Hyun A Kim, Hyoung Jin Lim
-
Publication number: 20190296204Abstract: A light emitting diode including a first semiconductor layer, a mesa disposed thereon and including a second semiconductor layer and an active layer, an ohmic reflection layer disposed on the mesa to form an ohmic contact with the second semiconductor layer, a lower insulation layer covering the mesa and the ohmic reflection layer and partially exposing the first semiconductor layer and the ohmic reflection layer, a first pad metal layer disposed on the lower insulation layer and electrically connected to the first semiconductor layer, a metal reflection layer disposed on the lower insulation layer and laterally spaced apart from the first pad metal layer, and an upper insulation layer covering the first pad metal layer and the metal reflection layer, and having a first opening exposing the first pad metal layer, in which at least a portion of the metal reflection layer covers a side surface of the mesa.Type: ApplicationFiled: October 11, 2017Publication date: September 26, 2019Inventors: Se Hee OH, Hyun A KIM, Joon Sup LEE, Min Woo KANG, Hyoung Jin LIM
-
Patent number: 10388690Abstract: A light emitting diode array is provide to include: a substrate; light emitting diodes positioned over the substrate, each including a first semiconductor layer, an active layer, and a second semiconductor layer, wherein each light emitting diode is disposed to form a first via hole structure exposing a portion of the corresponding first semiconductor layer; lower electrodes disposed over the second semiconductor layer; a first interlayer insulating layer disposed over the lower electrodes and configured to expose the portion of the first semiconductor layer of corresponding light emitting diodes; upper electrodes electrically connected to the first semiconductor layer through the first via hole structure, wherein the first via hole structure is disposed in parallel with one side of the corresponding second semiconductor layer and the first interlayer insulating layer is disposed to form a second via hole structure exposing a portion of the lower electrodes.Type: GrantFiled: March 25, 2016Date of Patent: August 20, 2019Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jong Min Jang, Jong Hyeon Chae, Joon Sup Lee, Daewoong Suh, Hyun A. Kim, Won Young Roh, Min Woo Kang
-
Patent number: 10319884Abstract: A light emitting diode includes a first conductive type semiconductor layer and a mesa disposed on the first conductive type semiconductor layer. The mesa includes an active layer and a second conductive type semiconductor layer. A reflective electrode is disposed on the mesa to be in ohmic-contact with the second conductive type semiconductor layer. A current spreading layer is disposed on the mesa and the reflective electrode. A first portion of the current spreading layer is in ohmic-contact with an upper surface of an end portion of the first conductive type semiconductor layer. A lower insulating layer is disposed between the mesa and the current spreading layer, and the reflective electrode and the current spreading layer. An upper insulating layer covers the current spreading layer and includes a first hole exposing a second portion of the current spreading layer that is disposed on an upper portion of the mesa.Type: GrantFiled: April 19, 2016Date of Patent: June 11, 2019Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Hyeon Chae, Jong Min Jang, Won Young Roh, Daewoong Suh, Dae Sung Cho, Joon Sup Lee, Kyu Ho Lee, Chi Hyun In
-
Patent number: 10297720Abstract: The present invention relates to a light emitting diode and a method of manufacturing same. The light emitting diode includes: a first conductive semiconductor layer; a plurality of mesas that are disposed spaced apart from one another on the first conductive semiconductor layer, each mesa including an active layer and a second conductive semiconductor layer; reflective electrodes that are respectively disposed on the plurality of mesas and come into ohmic contact with the second conductive semiconductor layer; openings that cover the plurality of mesas and the first conductive semiconductor layer, are electrically insulated from the mesas, and expose the reflective electrodes to the upper region of each mesa; and a current spreading layer that comes into ohmic contact with the first conductive semiconductor layer. Thus, a light emitting diode that improves current spreading performance may be provided.Type: GrantFiled: October 22, 2015Date of Patent: May 21, 2019Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jong Hyeon Chae, Jong Min Jang, Won Young Roh, Daewoong Suh, Dae Sung Cho, Joon Sup Lee, Kyu Ho Lee, Chi Hyun In
-
Publication number: 20190148597Abstract: A light emitting element according to an embodiment of the present invention comprises a first conductive-type semiconductor layer including a contact region on the lower surface thereof, a light emitting structure which includes a mesa including a second conductive-type semiconductor layer and an active layer, a second electrode, a first insulation layer, an electrode cover layer, a first electrode, a second insulation layer, and a support structure. In addition, the mesa may include a body part and a plurality of protrusion parts protruding from the body part, the contact region may be disposed between the protrusion parts, and a part of the contact region may overlap with a second metal bulk in the vertical direction. Accordingly, current spreading efficiency can be improved, and thus luminance efficiency can be more improved.Type: ApplicationFiled: December 19, 2018Publication date: May 16, 2019Inventors: Jong Hyeon CHAE, Chang Yeon KIM, Joon Sup LEE, Dae Woong SUH, Won Young ROH, Ju Yong PARK, Seung Hyun KIM
-
Patent number: 10270008Abstract: A light emitting element according to an embodiment of the present invention comprises a first conductive-type semiconductor layer including a contact region on the lower surface thereof, a light emitting structure which includes a mesa including a second conductive-type semiconductor layer and an active layer, a second electrode, a first insulation layer, an electrode cover layer, a first electrode, a second insulation layer, and a support structure. In addition, the mesa may include a body part and a plurality of protrusion parts protruding from the body part, the contact region may be disposed between the protrusion parts, and a part of the contact region may overlap with a second metal bulk in the vertical direction. Accordingly, current spreading efficiency can be improved, and thus luminance efficiency can be more improved.Type: GrantFiled: March 8, 2016Date of Patent: April 23, 2019Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jong Hyeon Chae, Chang Yeon Kim, Joon Sup Lee, Dae Woong Suh, Won Young Roh, Ju Yong Park, Seung Hyun Kim
-
Patent number: 10249798Abstract: A light emitting device includes a light emitting structure including a support structure including a first bulk electrode a second bulk electrode disposed on and electrically connected to the first electrode and the second electrode, respectively. A substrate is disposed adjacent to the support structure, wherein each of the first and second bulk electrodes includes an upper region and a lower region with the upper regions of the first and second bulk electrodes being separated from each other by a first distance. The substrate includes a first interconnection portion and a second interconnection portion electrically connected to the first bulk electrode and the second bulk electrode, respectively, and separated from each other by a second distance. The second distance is greater than the first distance.Type: GrantFiled: August 23, 2016Date of Patent: April 2, 2019Assignee: Seoul Viosys Co., Ltd.Inventors: Chang Yeon Kim, Sung Su Son, Joon Sup Lee, Jong Hyeon Chae
-
Patent number: 10062810Abstract: Described are a light emitting diode and a light emitting diode module. The light emitting diode module includes a printed circuit board and a light emitting diode joined thereto through a solder paste. The light emitting diode includes a first electrode pad electrically connected to a first conductive type semiconductor layer and a second electrode pad connected to a second conductive type semiconductor layer, wherein each of the first electrode pad and the second electrode pad includes at least five pairs of Ti/Ni layers or at least five pairs of Ti/Cr layers and the uppermost layer of Au. Thus a metal element such as Sn in the solder paste is prevented from diffusion so as to provide a reliable light emitting diode module.Type: GrantFiled: January 2, 2018Date of Patent: August 28, 2018Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Hyeon Chae, Joon Sup Lee, Daewoong Suh, Won Young Roh, Min Woo Kang, Jong Min Jang
-
Publication number: 20180175250Abstract: Disclosed are an LED and an LED module. The LED includes: a first conductivity type semiconductor layer; a mesa disposed over the first conductivity type semiconductor layer and including an active layer and a second conductivity type semiconductor layer; a first ohmic-contact structure in contact with the first conductivity type semiconductor layer; a second ohmic-contact structure in contact with the second conductivity type semiconductor layer; a lower insulating layer at least partially covering the mesa and the first conductivity type semiconductor layer and disposed to form a first opening part at least partially exposing the first ohmic-contact structure and a second opening part at least partially exposing the second ohmic-contact structure; and a current distributing layer connected to the first ohmic-contact structure at least partially exposed by the first opening part and disposed to form a third opening part at least partially exposing the second opening part.Type: ApplicationFiled: February 12, 2018Publication date: June 21, 2018Inventors: Jong Hyeon Chae, Won Young Roh, Joon Sup Lee, Min Woo Kang, Jong Min Jang, Hyun A Kim, Seon Min Bae, Daewoong Suh
-
Patent number: 9991425Abstract: A light emitting device including a light emitting structure disposed on one surface of a substrate and a transflective portion disposed on the other surface of the substrate. The transflective portion and the substrate have different indexes of refraction from one another.Type: GrantFiled: February 2, 2017Date of Patent: June 5, 2018Assignee: Seoul Viosys Co., Ltd.Inventors: Jong Hyeon Chae, Chung Hoon Lee, Daewoong Suh, Jong Min Jang, Joon Sup Lee, Won Young Roh, Min Woo Kang, Hyun A Kim, Seon Min Bae