Abstract: A thin film transistor includes an oxide semiconductor, in which an oxygen defect content of the oxide semiconductor is no greater than about 0.15 based on an entire oxygen content included in the oxide semiconductor.

Abstract: Disclosed is a method for forming banks during the fabrication of electronic devices incorporating an organic semiconductor material that includes preparing an aqueous coating composition having at least a water-soluble polymer, a UV curing agent and a water-soluble fluorine compound. This coating composition is applied to a substrate, exposed using UV radiation and then developed using an aqueous developing composition to form the bank pattern. Because the coating composition can be developed using an aqueous composition rather than an organic solvent or solvent system, the method tends to preserve the integrity of other organic structures present on the substrate. Further, the incorporation of the fluorine compound in the aqueous solution provides a degree of control over the contact angles exhibited on the surface of the bank pattern and thereby can avoid or reduce subsequent surface treatments.

Abstract: A thin film transistor array panel includes: a semiconductor layer disposed on an insulation substrate; a gate electrode overlapping the semiconductor layer; a source electrode and a drain electrode overlapping the semiconductor layer; a first barrier layer disposed between the source electrode and the semiconductor layer; and a second barrier layer disposed between the drain electrode and the semiconductor layer, wherein the first barrier layer and the second barrier layer include nickel-chromium (NiCr).

Abstract: A sputtering target includes a plurality of targets and edges of the targets overlap each other.

Abstract: Exemplary embodiments of the present invention relate to a panel and a display device including the same, the panel including a substrate, a signal line arranged on the substrate, the signal line configured to transmit a driving signal, an insulating layer arranged on the signal line, and a pixel electrode and a contact assistant arranged on the insulating layer. The contact assistant is electrically connected to a portion of the signal line, the contact assistant includes indium zinc oxide doped with a metal oxide not including indium or zinc, and the metal oxide has a smaller Gibbs free energy than zinc oxide.

Abstract: A patternable adhesive composition including at least one alkali soluble resin including an alkali soluble group and an acryloyl group, at least one radically polymerizable compound, at least one thermosettable compound, and at least one photo-radical initiator.

Abstract: Disclosed is a method for forming banks during the fabrication of electronic devices incorporating an organic semiconductor material that includes preparing an aqueous coating composition having at least a water-soluble polymer, a UV curing agent and a water-soluble fluorine compound. This coating composition is applied to a substrate, exposed using UV radiation and then developed using an aqueous developing composition to form the bank pattern. Because the coating composition can be developed using an aqueous composition rather than an organic solvent or solvent system, the method tends to preserve the integrity of other organic structures present on the substrate. Further, the incorporation of the fluorine compound in the aqueous solution provides a degree of control over the contact angles exhibited on the surface of the bank pattern and thereby can avoid or reduce subsequent surface treatments.

Abstract: Disclosed is a method for forming banks during the fabrication of electronic devices incorporating an organic semiconductor material that includes preparing an aqueous coating composition having at least a water-soluble polymer, a UV curing agent and a water-soluble fluorine compound. This coating composition is applied to a substrate, exposed using UV radiation and then developed using an aqueous developing composition to form the bank pattern. Because the coating composition can be developed using an aqueous composition rather than an organic solvent or solvent system, the method tends to preserve the integrity of other organic structures present on the substrate. Further, the incorporation of the fluorine compound in the aqueous solution provides a degree of control over the contact angles exhibited on the surface of the bank pattern and thereby can avoid or reduce subsequent surface treatments.

Abstract: The disclosed mold includes recessed parts which have a shape corresponding to embossed portions of the barrier rib to be fabricated, and protruding parts which have a shape corresponding to depressed portions of the barrier rib to be fabricated, protrude adjacent to the recessed parts, and are tapered. The protruding parts and the recessed parts are arranged at regular intervals. It is possible to simply fabricate the two-layered barrier rib for inkjet application through a single embossing process at low cost using the mold for fabricating the barrier rib of the present invention.

Abstract: Disclosed is a method for forming banks during the fabrication of electronic devices incorporating an organic semiconductor material that includes preparing an aqueous coating composition having at least a water-soluble polymer, a UV curing agent and a water-soluble fluorine compound. This coating composition is applied to a substrate, exposed using UV radiation and then developed using an aqueous developing composition to form the bank pattern. Because the coating composition can be developed using an aqueous composition rather than an organic solvent or solvent system, the method tends to preserve the integrity of other organic structures present on the substrate. Further, the incorporation of the fluorine compound in the aqueous solution provides a degree of control over the contact angles exhibited on the surface of the bank pattern and thereby can avoid or reduce subsequent surface treatments.

Abstract: A thin film transistor includes a gate electrode on a substrate, a main active layer in electrical connection with the gate electrode and including an exposed channel portion, a source electrode in electrical connection with the main active layer, a drain electrode which is spaced apart from the source electrode and in electrical connection with the main active layer, and a sub active layer in electrical connection to the main active layer.

Abstract: A method of preparing a semiconductor package including disposing photosensitive adhesive film on a reinterconnected rear surface of a wafer on which the through electrodes are disposed, and forming a pattern corresponding to the through electrodes to prepare the semiconductor package.

Abstract: A patternable adhesive composition including at least one alkali soluble resin including an alkali soluble group and an acryloyl group, at least one radically polymerizable compound, at least one thermosettable compound, and at least one photo-radical initiator.

Abstract: Provided are a photosensitive adhesive composition having an alkali soluble epoxy resin and a patternable adhesive film using the same. The photosensitive adhesive composition has good pattern formability and adhesiveness since the photosensitive adhesive composition includes the alkali soluble epoxy resin.

Abstract: A composition for a patternable adhesive film, a patternable adhesive film having the same, and a method of manufacturing a semiconductor package using the patternable adhesive film are provided. The composition contains a binder resin, a radical-polymerizable acrylate monomer, a photo-radical initiator, and a thermal-radical initiator without an epoxy resin. The composition may have good patternability, adhesiveness, and low-temperature stability, and be rapidly cured at a low temperature.

Abstract: A photosensitive polyimide and an adhesive composition and adhesive film containing the same are provided. The photosensitive polyimide has an imide backbone and grafted side chains including a methacrylate-based side chain and a silicon-modified side chain.

Abstract: Disclosed is a method for forming banks during the fabrication of electronic devices incorporating an organic semiconductor material that includes preparing an aqueous coating composition having at least a water-soluble polymer, a UV curing agent and a water-soluble fluorine compound. This coating composition is applied to a substrate, exposed using UV radiation and then developed using an aqueous developing composition to form the bank pattern. Because the coating composition can be developed using an aqueous composition rather than an organic solvent or solvent system, the method tends to preserve the integrity of other organic structures present on the substrate. Further, the incorporation of the fluorine compound in the aqueous solution provides a degree of control over the contact angles exhibited on the surface of the bank pattern and thereby can avoid or reduce subsequent surface treatments.

Abstract: A conducting polymer, the conducting polymer composition further including an ionomer, and an organic optoelectronic device including the conducting polymer or the composition are provided. The conducting polymer according to the embodiments of the present invention is a self-doped conducting polymer in which conducting polymer chains are grafted in a polyacid. The conducting polymer composition to the present invention is manufactured by blending the self-doped conducting polymer with an ionomer having a physical cross-linking property thereto, and thus they are homogeneously dissolved in water or organic solvents. The conducting polymer and the composition have a good film-forming property and can be easily blended with other organic polymers, and conductivity and a work function thereof is easily controlled according to the content of the ionomer. Also, optoelectronic devices including the conducting polymer composition have high efficiency and a long lifetime.

Abstract: The present invention provides a method for manufacturing a secondary cell, comprising the steps of: disposing two sheets of separators (10) above and below a negative electrode plate (30), disposing a positive electrode plate (40) above the upper separator (10) or below the lower separator (10), and supplying elongated each one end of the separators (10), the negative electrode plate (30), and the positive electrode plate (40) to a mandrel (20) along the same transfer line; punching each vertical one end and/or the other end of the negative electrode plate (30) and the positive electrode plate (40), which intersects the transfer direction of the negative electrode plate (30) and the positive electrode plate (40) continuously supplied, to form a plurality of negative electrode tabs (32) on the negative electrode plate (30) by a predetermined gap (g) and form a plurality of positive electrode tabs (42) on the positive electrode plate (40) by a predetermined gap (g); winding the stacked body (S) of the separato