Abstract: Provided are a thin film transistor and a method of manufacturing the same. The thin film transistor includes: a lower structure; a semiconductor layer formed on the lower structure and including a plurality of doping regions; a first insulating layer and a second insulating layer formed on the semiconductor layer and separated from each other; a third insulating layer formed on the first insulating layer and the second insulating layer; and a gate electrode layer formed between regions of the third insulating layer respectively corresponding to the first insulating layer and the second insulating layer.

Abstract: A surface light source device includes a light source body, first and second electrodes, a light reflecting layer, and a fluorescent layer. The light source body is configured to generate light. The first and second electrodes are each disposed adjacent to a corresponding opposite end portion of the light source body. The first and second electrodes receive a discharge voltage that creates a potential difference across the light source body. The light reflecting layer is disposed at an internal surface of the light source body. The light reflecting layer includes light diffusing particles having at least two sizes. The fluorescent layer is disposed at selected regions of the light source body. Therefore, the light reflecting layer is not deformed by heat and enhances reflectivity without changing a color coordinates.

Abstract: Provided is a semiconductor plating system for plating a semiconductor object with a desired layer. The semiconductor plating system include a plating tank configured to accommodate a plating solution for use in plating the semiconductor object, and a plating solution induction device configured to induce the plating solution to spirally flow toward the semiconductor object.

Abstract: A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.

Abstract: A backlight unit having a structure which supports a diffusion sheet without a diffusion plate and a liquid crystal display device having the same include a backlight unit, which includes a receiving member having a receiving space and a coupling hole formed therein, a fastening member coupled to the coupling hole of the receiving member, and a sheet having a fastening hole formed therein, wherein the fastening member is coupled to the fastening hole to fix the sheet to the receiving member.

Abstract: A flat fluorescent lamp includes a lamp body and an external electrode. The lamp body includes a plurality of discharge spaces. Each of the discharge spaces includes a first discharge region having a first space width and a first space length, a second discharge region having a second space width and a second space length, and a third discharge region having a third space width and third space length. The second discharge region is disposed between the first and third discharge regions. The second space width is smaller than the first and third space widths, and the second space length is smaller than the first and third space lengths. Thus, an electrode part of the flat fluorescent lamp is prevented from being blackened due to dendrite generated at the electrode part, so that the display quality of the liquid crystal display device having the flat fluorescent lamp can be improved.

Abstract: A polarizing plate includes a base layer, a buffer layer and a plurality of conductive lattice lines. The buffer is formed on the base layer. The conductive lattice lines are formed on the buffer layer in a stripe shape to reflect and polarize incident light. The buffer layer protects the conductive lattice lines. The conductive lattice lines include a silver (Ag) layer or an aluminum (Al) layer. Therefore, the buffer layer protects the conductive lattice lines, so that the lifetime of the polarizing plate may be increased. Furthermore, the display quality of a display panel and a display device having the polarizing plate may be enhanced.

Abstract: A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and a coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips.

Abstract: A flat-type fluorescent lamp and liquid crystal display having minimum pin-shaped holes include a first substrate, a second substrate forming a plurality of discharging spaces together with the first substrate, and external electrodes that cover the outer edge surfaces of the first and the second substrates while perpendicularly extending across the discharging spaces. The second substrate is substantially as thick as the first substrate, especially at the position covered by the external electrodes.

Abstract: A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.

Abstract: A polarizing plate includes a base substrate, a conductive lattice pattern and a light absorbing pattern. The base substrate has a first surface and a second surface located opposite to the first surface. The conductive lattice pattern is formed on the first surface in a stripe arrangement. The conductive lattice pattern reflects and/or polarizes light incident on the conductive lattice pattern. The light absorbing pattern is formed on the first surface and corresponds to the conductive lattice pattern. The light absorbing pattern absorbs at least a portion of light reflected on an arbitrary interface after being polarized by the conductive lattice pattern. Thus, an undesired polarization component of a light exiting through a polarizing plate may be reduced, thereby increasing a contrast ratio of a display panel.

Abstract: The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.

Abstract: Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.

Abstract: In one embodiment, a semiconductor package structure includes a heat dissipative element connected to an internal circuit. The semiconductor package includes a semiconductor chip, an interconnection substrate, and a heat dissipative element. The semiconductor chip includes an internal circuit and inner pads that connect the internal circuit. The interconnection substrate is disposed below the semiconductor chip and includes input/output terminals. At least one of the inner pads is electrically connected to at least one of the input/output terminals. The heat dissipative element is disposed on the semiconductor chip and is electrically connected to at least one of the inner pads.

Abstract: In an eco-friendly method of recycling a fluorescent lamp capable of reducing energy consumption and a recycling apparatus for performing the recycling method, broken pieces of fluorescent lamps are heated at a temperature of about 100? to about 330? to form a gas containing a mercury vapor. The gas containing the mercury vapor is cooled at a temperature of about ?38? to about 0? to form a liquid mercury. The liquid mercury is collected. Therefore, the broken pieces of the fluorescent lamps are heated at the temperature no higher than the boiling point of mercury so that an energy consumption and a size of the recycling apparatus are decreased, and a probability for the recycling apparatus to malfunction may also be decreased.

Abstract: Disclosed is a liquid crystal display comprising a first substrate; pixel electrodes formed on the first substrate, the pixel electrodes having formed thereon a first aperture pattern; a second substrate provided opposing the first substrate; a common electrode formed on the second substrate, the common electrode having formed thereon a second aperture pattern; liquid crystal material injected between the first and second substrates; and spacers provided between the first and second substrates for maintaining a predetermined gap between the first and second substrates, wherein center portions of the first aperture pattern and the second aperture pattern are substantially straight and formed alternatingly in parallel, and wherein the spacers are positioned at ends of the second aperture pattern.

Abstract: An optical sheet includes a first plane, a second plane facing the first plane and a plurality of optical patterns. The optical patterns are formed on the second plane along a plurality of columns. An optical pattern includes a plurality of convex light-condensing portions. End portions of the light-condensing portions are connected to each other continuously and form crests and troughs. The optical patterns disposed in adjacent columns share a common side.

Abstract: An optical sheet includes a reflective polarizer and a filter layer. The reflective polarizer reflects a part of incident light and transmits another part of the incident light. The filter layer selectively reflects the transmitted light passed through the reflective polarizer. The filter layer reflects at least one of a first wave band that is an overlapped area between a green peak and a blue peak in the spectrum of incident light, and a second wave band that is an overlapped area between a green peak and a red peak in the spectrum of incident light.

Abstract: A light generating device includes a body having discharge spaces generating light in response to a voltage signal, and electrodes providing the voltage signal to the discharge spaces. The discharge spaces are apart from each other and arranged substantially parallel with each other. The electrodes are disposed at external portions of the body. The body includes a first substrate, and a second substrate disposed on the first substrate. The second substrate includes space forming members and space dividing members. The discharge spaces are each formed between corresponding one of the space forming members and the first substrate. The space dividing members are each disposed between the adjacent space forming members. The space dividing members include connecting passages each connecting adjacent ones of the discharge spaces.

Abstract: A light condenser for an LCD includes a base layer, a condensing layer and a lower surface-treated layer. The condensing layer is disposed on the base layer and has a condensing pattern formed therein. The lower surface-treated layer is disposed below the base layer and has a plurality of protrusions extending downwardly therefrom. Each of the protrusions has a substantially round shape. The novel light condenser enables the number of optical elements needed in a display apparatus to be reduced, thereby reducing LCD manufacturing costs. Additionally, the light condenser prevents a mutual scratching and adhesion problem between the condenser and a diffusing plate of the LCD, thereby improving the quality of the image produced by the display.