Abstract: A liquid crystal display includes first and second substrates. The first substrate has a first insulating substrate, and a pixel electrode formed on the first insulating substrate with a first opening pattern. The second substrate has a second insulating substrate, and a common electrode formed on the second insulating substrate with a second opening pattern. The first and the second opening patterns proceed parallel to each other while being arranged in an alternate manner. A liquid crystal material is injected between the first and the second substrates. A spacer is positioned at an end of the second opening pattern to maintain the distance between the first and the second substrates.

Abstract: A flat-type fluorescent lamp and liquid crystal display having minimum pin-shaped holes include a first substrate, a second substrate forming a plurality of discharging spaces together with the first substrate, and external electrodes that cover the outer edge surfaces of the first and the second substrates while perpendicularly extending across the discharging spaces. The second substrate is substantially as thick as the first substrate, especially at the position covered by the external electrodes.

Abstract: A flat fluorescent lamp includes a lamp body and an external electrode. The lamp body includes a plurality of discharge spaces. Each of the discharge spaces includes a first discharge region having a first space width and a first space length, a second discharge region having a second space width and a second space length, and a third discharge region having a third space width and third space length. The second discharge region is disposed between the first and third discharge regions. The second space width is smaller than the first and third space widths, and the second space length is smaller than the first and third space lengths. Thus, an electrode part of the flat fluorescent lamp is prevented from being blackened due to dendrite generated at the electrode part, so that the display quality of the liquid crystal display device having the flat fluorescent lamp can be improved.

Abstract: A flat fluorescent lamp and liquid crystal display apparatus having the same is provided. The flat fluorescent lamp includes a first substrate and a second substrate combined with the first substrate to form a discharge space between the first and second substrates. The flat fluorescent lamp also includes a getter disposed in the discharge space. The getter includes a body portion and a wing portion for securing the body portion.

Abstract: A liquid crystal display includes the first and second substrates. The first substrate has a first insulating substrate. A pixel electrode is formed on the first insulating substrate. The second substrate has a second insulating substrate. A common electrode is formed on the second insulating substrate. The first and second protrusions having different thicknesses are formed on the common electrode. A liquid crystal material is injected between the first and the second substrates.

Abstract: A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a vertical direction into corresponding insertion holes. The module may include a heat sink composed of a base plate and a plurality of protrusions. The protrusion may extend downward from the base plate.

Abstract: A flat fluorescent lamp includes a first substrate, a second substrate combined with the first substrate to define a plurality of discharge spaces, and a first external electrode formed on the outer surface of the second substrate to cross the discharge spaces. A first region of the second substrate corresponding to an outermost discharge space has a thickness thinner than that of a second region of the second substrate corresponding to remaining discharge spaces not disposed outermost. Thus, the outermost discharge space may have a compensated luminance, thereby improving luminance uniformity of light emitted from the flat fluorescent lamp and display quality of the liquid crystal display device including the flat fluorescent lamp.

Abstract: A heat pipe structure may include a plurality of heat pipes. Each heat pipe may include at least one ring arranged to form a passage through which a gas flows, and at least one globe arranged to form a wick, or capillary structure through which a fluid may flow. The at least one ring and the at least one globe may be arranged in a tube, which may connect a heat source and a heat dissipation part, and the fluid may be a working fluid for transferring heat.

Abstract: In a flat-type light source and an LCD device incorporating the flat-type light source, the flat-type light source includes a lamp body, external electrodes and hollow electrodes. The lamp body has a plurality of discharge spaces. The external electrodes are disposed on an outer surface of the lamp body, and are partially overlapped with the discharge spaces. Each of the hollow electrodes is disposed on an inner surface of the lamp body, and is disposed in each of the discharge spaces. The hollow electrode may have a rectangular or other suitable tube shape. As a result of this construction, a discharge voltage to operate the flat-type light source may be decreased, and discharge efficiency may be increased.

Abstract: A multi-chip package having a heat dissipating path. The multi-chip package includes a stack of integrated circuit (IC) chips, a heat sink part interposed between the IC chips so that one end portion of the heat sink part can be exposed from a side of the stack of integrated circuit chips, a substrate on which the stack of integrated circuit chips is mounted, and solder or solder ball-shaped thermally connecting parts to thermally connect the exposed end portion of the heat sink part to the substrate to dissipate heat collected in the heat sink part through the substrate.

Abstract: The semiconductor chip package may include a substrate having circuit patterns and substrate pads connected with the circuit patterns. At least one semiconductor chip is mounted on the substrate, and a thermoelectric cooler having a P-type material plate and an N-type material plate is mounted on the semiconductor chip. Portions of the P-type and N-type material plates may be attached on the semiconductor chip. The P-type and N-type material plates may be electrically connected to the circuit patterns of the substrate to be provided with DC power.

Abstract: A flat fluorescent lamp includes a body and a fluorescent layer. The body generates invisible radiation. The fluorescent layer has a luminance-enhancing pattern formed thereon. The fluorescent layer converts the invisible radiation into visible light. Therefore, a surface area of the fluorescent layer is increased to increase an amount of visible light, so that luminance of a display device employing the flat fluorescent lamp is enhanced.

Abstract: A light generating device includes a body having discharge spaces generating light in response to a voltage signal, and electrodes providing the voltage signal to the discharge spaces. The discharge spaces are apart from each other and arranged substantially parallel with each other. The electrodes are disposed at external portions of the body. The body includes a first substrate, and a second substrate disposed on the first substrate. The second substrate includes space forming members and space dividing members. The discharge spaces are each formed between corresponding one of the space forming members and the first substrate. The space dividing members are each disposed between the adjacent space forming members. The space dividing members include connecting passages each connecting adjacent ones of the discharge spaces.

Abstract: In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.

Abstract: A surface light source device includes a light source body, first and second electrodes, a light reflecting layer, and a fluorescent layer. The light source body is configured to generate light. The first and second electrodes are each disposed adjacent to a corresponding opposite end portion of the light source body. The first and second electrodes receive a discharge voltage that creates a potential difference across the light source body. The light reflecting layer is disposed at an internal surface of the light source body. The light reflecting layer includes light diffusing particles having at least two sizes. The fluorescent layer is disposed at selected regions of the light source body. Therefore, the light reflecting layer is not deformed by heat and enhances reflectivity without changing a color coordinates.

Abstract: A semiconductor module, including a semiconductor device mounted on a printed circuit board (PCB), the PCB having an electrical connection to the semiconductor module, and a heat sink in direct contact with the semiconductor device, the heat sink being formed with a first end and a second end, the first end and the second end being formed with different heights, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink. Another semiconductor module, including a semiconductor device mounted on a PCB, a heat sink in direct contact with the semiconductor device, the heat sink having a first portion and a second portion, wherein the first portion has a flat shape and is in direct contact with the semiconductor device and the second portion has a corrugated shape and is not in contact with the semiconductor device, wherein the semiconductor module allows air flow to pass through the semiconductor module, radiating heat away from the heat sink.

Abstract: A semiconductor stack package includes lower and upper individual packages. When the upper individual package is stacked on the lower individual package, a heat-conducting layer provided under the upper package touches a heat-mediating layer provided on the lower package. Thus, a layer of trapped air found in conventional stack packages is eliminated, and a direct heat-dissipating path is produced through both the heat-conducting layer and the heat-mediating layer. Therefore, the heat dissipation of the stack package is improved. Alternatively, the stack package may have a symmetric configuration in which each IC chip faces away from each other. A memory module has several stack packages mounted on one or both surfaces of a module board. The method includes forming the packages and stacking the packages. The method further includes forming a module board and mounting the stack packages on the module board.

Abstract: A device for generating light capable of uniformly distributing discharge gases in discharge areas, as well as preventing charge drift. The device includes a first substrate, a second substrate assembled with the first substrate to form a discharge space between the first and second substrates. The second substrate includes at least one sinking portion extending toward the first substrate to divide the discharge space into at least two discharge areas, and at least one connection passage is formed on the first substrate to connect the discharge areas to each other.

Abstract: A light source device includes a light emitting body, a pair of main electrodes and a pair of sub electrodes. The light emitting body includes discharge spaces disposed substantially parallel to each other. The main electrodes are disposed at opposite end portions of the light emitting body, respectively. The main electrodes induce an electrical discharge of a gas in the discharge spaces between the main electrodes. The sub electrodes are disposed between the main electrodes. The sub electrodes induce an electrical discharge of a gas in the discharge spaces between the sub electrodes. Resultantly, power consumption is reduced and uniformity of luminance is enhanced. Therefore, display quality of the display apparatus is enhanced.

Abstract: A semiconductor module with vertically arranged semiconductor packages may include a module board with a plurality of insertion holes. A plurality of semiconductor packages may be inserted in a vertical direction into corresponding insertion holes. The module may include a heat sink composed of a base plate and a plurality of protrusions. The protrusion may extend downward from the base plate.